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51.发明授权Method for non-destructive trench depth measurement using electron beam source and X-ray detection 失效使用电子束源和X射线检测的非破坏性沟槽深度测量方法公开(公告)号：US07186977B2
公开(公告)日：2007-03-06
申请号：US11035932
申请日：2005-01-14
IPC分类号： H01J37/256 , G01N23/223
CPC分类号： G01N23/2252 , H01J2237/2807 , H01J2237/281
摘要： A method (and system) for non-destructive measurement of a depth of a feature in a structure, includes using a scanning electron microscope (SEM) image to navigate to find the feature in an X-ray image, using an electron beam to produce a fluorescent emission in the feature, and using an X-ray count made at a position of the feature in the X-ray image, to determine a depth of the feature.
摘要翻译： 一种用于对结构中的特征深度的非破坏性测量的方法（和系统）包括使用扫描电子显微镜（SEM）图像导航以在X射线图像中找到特征，使用电子束产生 特征中的荧光发射，以及使用在X射线图像中的特征的位置处进行的X射线计数来确定特征的深度。
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公开(公告)号：US09157657B2
公开(公告)日：2015-10-13
申请号：US13600482
申请日：2012-08-31
IPC分类号： F24J2/08 , F28D15/02 , F28D15/04 , H01L31/052 , H01L31/054 , F24J2/52
CPC分类号： F24S23/31 , F24S2025/011 , F28D15/0233 , F28D15/046 , H01L31/052 , H01L31/0521 , H01L31/0543 , Y02E10/43 , Y02E10/52
摘要： A method of cooling a solar concentrator includes absorbing heat from solar energy collectors into a chamber section. The chamber section is arranged below, in a heat exchange relationship, the solar energy collectors.
摘要翻译： 一种冷却太阳能聚光器的方法包括将太阳能收集器的热量吸收到室部分中。 室部分以热交换关系布置在太阳能收集器的下方。
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公开(公告)号：US20130199595A1
公开(公告)日：2013-08-08
申请号：US13365306
申请日：2012-02-03
IPC分类号： H01L31/052
CPC分类号： H01L31/052 , H01L31/0521 , H01L31/054 , H01L31/0543 , Y02E10/52
摘要： A convective method is employed to cool a solar concentrator device. The convective method employs formation of a vortex gas circulation inside an enclosure of the solar concentrator device, which is bounded by at least one light-path altering component, sidewalls, and a back panel. Optionally, a heat sink assembly can be provided within the enclosure. Internal convention through the vortex gas circulation transfers the heat generated at a photovoltaic cell to all surfaces of the solar concentrator device to facilitate radiative and/or convective cooling at the outside surfaces of the enclosure.
摘要翻译： 采用对流方法来冷却太阳能集中器装置。 对流方法采用在太阳能集中器装置的外壳内形成涡流气体循环，太阳能集中器装置由至少一个光路改变部件，侧壁和后面板限定。 可选地，可以在外壳内提供散热器组件。 通过涡流气体循环的内部惯例将在光伏电池处产生的热量转移到太阳能集中器装置的所有表面，以便于在外壳的外表面处进行辐射和/或对流冷却。
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公开(公告)号：US08459334B2
公开(公告)日：2013-06-11
申请号：US12533587
申请日：2009-07-31
IPC分类号： F28F7/00
CPC分类号： H01L23/433 , F28F2013/006 , H01L23/42 , H01L2924/0002 , H01L2924/00
摘要： A system and method to improve long term reliability of an integrated circuit package containing a patterned metal thermal interface (PMTI), the method including: coupling a heat sink to a heat source; providing a PMTI material between the heat source and the heat sink; providing a partial containment of a compressed malleable metal to impede the PMTI from being inched-out of its location under a bearing load.
摘要翻译： 一种用于提高包含图案化金属热界面（PMTI）的集成电路封装的长期可靠性的系统和方法，所述方法包括：将散热器耦合到热源; 在热源和散热器之间提供PMTI材料; 提供压缩的可延展金属的部分容纳物，以阻止PMTI在轴承负载下被排出其位置。
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公开(公告)号：US20120318327A1
公开(公告)日：2012-12-20
申请号：US13600482
申请日：2012-08-31
IPC分类号： H01L31/052
CPC分类号： F24S23/31 , F24S2025/011 , F28D15/0233 , F28D15/046 , H01L31/052 , H01L31/0521 , H01L31/0543 , Y02E10/43 , Y02E10/52
摘要： A method of cooling a solar concentrator includes absorbing heat from solar energy collectors into a chamber section. The chamber section is arranged below, in a heat exchange relationship, the solar energy collectors.
摘要翻译： 一种冷却太阳能聚光器的方法包括将太阳能收集器的热量吸收到室部分中。 室部分以热交换关系布置在太阳能收集器的下方。
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公开(公告)号：US08091614B2
公开(公告)日：2012-01-10
申请号：US11558842
申请日：2006-11-10
CPC分类号： H01L23/427 , F28D15/0233 , F28F1/02 , F28F3/048 , F28F9/0275 , H01L23/467 , H01L23/473 , H01L2924/0002 , H01L2924/00
摘要： The present invention is an air/fluid cooling system. In one embodiment an apparatus for dissipating heat from a heat-generating device includes a base having a first side configured for thermal coupling to the heat-generating device, an air-based cooling path coupled to the base, for dissipating at least a portion of the heat via air, and a fluid-based cooling path coupled to the base, for dissipating at least a portion of the heat via a fluid. The air-based cooling path and the fluid-based cooling path may be operated simultaneously or individually to dissipate heat from the heat generating device and to allow access to the cooling system, for example for maintenance, repairs and upgrades.
摘要翻译： 本发明是空气/流体冷却系统。 在一个实施例中，用于从发热装置散热的装置包括：基座，其具有被配置用于与发热装置的热耦合的第一侧;耦合到所述基座的空气基冷却通道，用于耗散至少一部分 经由空气的热量以及耦合到所述基座的基于流体的冷却路径，用于通过流体散发至少一部分热量。 基于空气的冷却路径和基于流体的冷却路径可以同时或单独地操作以从发热装置散发热量并且允许进入冷却系统，例如用于维护，修理和升级。
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57.发明授权Method and apparatus for deploying a liquid metal thermal interface for chip cooling 有权用于部署用于芯片冷却的液态金属热界面的方法和装置公开(公告)号：US07952193B2
公开(公告)日：2011-05-31
申请号：US12261316
申请日：2008-10-30
IPC分类号： H01L23/34
CPC分类号： H01L23/3736 , H01L21/4882 , H01L2924/0002 , Y10T428/1452 , Y10T428/1476 , Y10T428/31678 , H01L2924/00
摘要： In one embodiment, the present invention is a method and apparatus for chip cooling. One embodiment of an inventive method for bonding a liquid metal to an interface surface (e.g., a surface of an integrated circuit chip or an opposing surface of a heat sink) includes applying an adhesive to the interface surface. A metal film is then bonded to the adhesive, thereby easily adapting the interface surface for bonding to the liquid metal.
摘要翻译： 在一个实施例中，本发明是用于芯片冷却的方法和装置。 用于将液态金属接合到界面表面（例如，集成电路芯片的表面或散热器的相对表面）的本发明方法的一个实施例包括将粘合剂施加到界面表面。 然后将金属膜粘合到粘合剂上，从而容易地使界面表面适应于液体金属的粘结。
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公开(公告)号：US20100218817A1
公开(公告)日：2010-09-02
申请号：US12622504
申请日：2009-11-20
申请人： Supratik Guha , Philip C. Hobbs , Yves C. Martin , Robert L. Sandstrom , Theodore G. van Kessel
发明人： Supratik Guha , Philip C. Hobbs , Yves C. Martin , Robert L. Sandstrom , Theodore G. van Kessel
IPC分类号： H01L31/00
CPC分类号： H02S20/00 , F24S23/12 , F24S23/30 , F24S23/77 , F24S40/55 , H01L31/0543 , H01L31/0547 , H02S20/32 , H02S40/22 , H02S40/425 , Y02E10/40 , Y02E10/52
摘要： A solar concentration system includes an optically clear shell member having an outer surface and an inner surface, with the inner surface defining a hollow interior portion, a liquid contained within the hollow interior portion of the optically clear shell, and a solar collection system contained within the hollow interior portion of the optically clear shell. The solar collection system includes a tracking system configured and disposed to selectively shift within the hollow interior portion, a reflector member mounted to the tracking system, and a solar receiver mounted to the tracking system. The tracking system being configured and disposed orient the reflector member and the solar receiver to follow a path of the sun enhancing the collection of solar energy.
摘要翻译： 太阳能集中系统包括具有外表面和内表面的光学透明壳体构件，其中内表面限定中空内部部分，容纳在光学透明壳体的中空内部部分内的液体以及包含在其中的太阳能收集系统 光学透明外壳的中空内部。 太阳能收集系统包括配置和设置成在中空内部部分内有选择地移动的跟踪系统，安装到跟踪系统的反射器部件和安装到跟踪系统的太阳能接收器。 跟踪系统被配置和布置成使得反射器构件和太阳能接收器沿着太阳能路径收集太阳能。
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公开(公告)号：US20090146294A1
公开(公告)日：2009-06-11
申请号：US11954159
申请日：2007-12-11
申请人： Michael D. Hillman , Gregory L. Tice , Oscar Woo , Richard Lidio Blanco, JR. , Ronald J. Smith , Sean A. Bailey , Anwyl M. McDonald , Clayton R. Anderson , Yves C. Martin , Theodore G. Van Kessel
发明人： Michael D. Hillman , Gregory L. Tice , Oscar Woo , Richard Lidio Blanco, JR. , Ronald J. Smith , Sean A. Bailey , Anwyl M. McDonald , Clayton R. Anderson , Yves C. Martin , Theodore G. Van Kessel
IPC分类号： H01L23/46
CPC分类号： H01L23/42 , H01L23/26 , H01L2924/0002 , H01L2924/3011 , H01L2924/00
摘要： Embodiments of an apparatus are described. This apparatus includes a semiconductor-die layer mechanically coupled to a semiconductor die, and a heat-removal-device layer mechanically coupled to a heat-removal device. Moreover, a thermal-interface material is included between the semiconductor die and the heat-removal device, where the thermal-interface material is mechanically coupled to a region of the semiconductor-die layer and to a region of the heat-removal-device layer. Additionally, a boundary material is mechanically coupled to the semiconductor-die layer and the heat-removal-device layer, where the thermal-interface material is contained in a cavity defined, at least in part, by the semiconductor-die layer, the boundary material, and the heat-removal-device layer.
摘要翻译： 描述装置的实施例。 该装置包括机械地耦合到半导体管芯的半导体管芯层，以及机械耦合到散热装置的散热装置层。 此外，在半导体管芯和散热装置之间包括热界面材料，其中热界面材料机械耦合到半导体管芯层的区域和散热装置层的区域 。 另外，边界材料机械耦合到半导体管芯层和除热器件层，其中热界面材料包含在至少部分由半导体管芯层限定的空腔中，边界 材料和除热装置层。
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公开(公告)号：US20090051026A1
公开(公告)日：2009-02-26
申请号：US11841120
申请日：2007-08-20
CPC分类号： H01L23/3735 , H01L21/6835 , H01L24/27 , H01L24/28 , H01L2924/01013 , H01L2924/01023 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/0104 , H01L2924/01041 , H01L2924/01042 , H01L2924/01044 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01072 , H01L2924/01073 , H01L2924/01074 , H01L2924/01075 , H01L2924/01076 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01327
摘要： A process for forming a releasable metal film includes depositing a metal onto a polymeric sheet such that the metal layer provides a low adhesive interface and exhibits relatively low stress. A barrier layer is then deposited onto the surface of the low adhesion interface. A thin film of a stress relief layer of silicon dioxide, aluminum oxide, copper or aluminum is then deposited followed by addition of a second barrier layer onto the stress relief layer. The stress relief layer provides compressive relief to balance the tensile stress of the so-stacked metal films. An additional solderable layer maybe added for soldering applications. To fabricate the working device with sputtering tools, an extremely high gas pressure is used to achieve low adhesion force between the wettable metallic layer and the polymeric carrier film.
摘要翻译： 用于形成可释放金属膜的方法包括将金属沉积到聚合物片材上，使得金属层提供低粘合剂界面并显示相对低的应力。 然后将阻挡层沉积在低粘合界面的表面上。 然后沉积二氧化硅，氧化铝，铜或铝的应力消除层的薄膜，然后在应力消除层上添加第二阻挡层。 应力消除层提供压缩释放以平衡如此堆叠的金属膜的拉伸应力。 可以添加额外的可焊接层用于焊接应用。 为了用溅射工具制造工作装置，使用非常高的气压来实现可湿性金属层和聚合物载体膜之间的低粘附力。
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