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51.发明申请公开(公告)号：US20090197104A1
公开(公告)日：2009-08-06
申请号：US12117026
申请日：2008-05-08
申请人： Yu-Jean Chen , Brian C. Auman , Sheng-Yu Huang , Tsutomu Mutoh , Ming-Te We , Yu-Chih Yeh
发明人： Yu-Jean Chen , Brian C. Auman , Sheng-Yu Huang , Tsutomu Mutoh , Ming-Te We , Yu-Chih Yeh
IPC分类号： B32B15/088 , B05D3/02 , C08G69/26
CPC分类号： C08G73/1007 , C08L79/08 , C09D179/08 , C09J179/08 , H05K1/0346 , H05K3/389 , H05K2201/0154 , H05K2201/0355 , Y10T428/24355 , Y10T428/31681
摘要： The present invention is related to a polyimide copper clad laminate and the process of making the same. The laminate comprises a layer of polyimide and a layer of copper foil, wherein the polyimide layer is made from a polyimide precursor comprising a diamine monomer, a dianhydride monomer, an organic solvent and a silane coupling agent having one or more organic functional groups, and the copper foil is a smooth copper foil. The polyimide layer of the present invention provides high transparency, good dimensional stability, good mechanical properties and good adhesion to the copper foil.
摘要翻译： 本发明涉及一种聚酰亚胺覆铜层压板及其制造方法。 层压体包括聚酰亚胺层和铜箔层，其中聚酰亚胺层由包含二胺单体，二酐单体，有机溶剂和具有一个或多个有机官能团的硅烷偶联剂的聚酰亚胺前体制成，以及 铜箔是光滑的铜箔。 本发明的聚酰亚胺层提供高透明度，良好的尺寸稳定性，良好的机械性能和对铜箔的良好粘合性。
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公开(公告)号：US07531204B2
公开(公告)日：2009-05-12
申请号：US11891129
申请日：2007-08-09
申请人： Yueh-Ling Lee , Meredith L. Dunbar , Harry Richard Zwicker , Carl B. Wang , Brian C. Auman , Shane Fang
发明人： Yueh-Ling Lee , Meredith L. Dunbar , Harry Richard Zwicker , Carl B. Wang , Brian C. Auman , Shane Fang
IPC分类号： B05D3/00
CPC分类号： H05K3/185 , C23C18/02 , C23C18/1216 , C23C18/1233 , C23C18/1295 , C23C18/204 , Y10T428/24917 , Y10T428/25 , Y10T428/31511 , Y10T428/3154 , Y10T428/31725 , Y10T428/31786
摘要： A light-activatable polymer composition and polymer composite includes a polymer binder selected from epoxy resins, silica filled epoxy, bismaleimide resins, bismaleimide triazines, fluoropolymers, polyesters, polyphenylene oxide/polyphenylene ether resins, polybutadiene/polyisoprene crosslinkable resins (and copolymers), liquid crystal polymers, polyamides, cyanate esters, or combinations thereof, the polymer binder being present in an amount from 40, 45, 50, 55, 60, 65, 70, 75, 80, 85, 90, 95, 96, or 97 weight-percent of the total weight of the polymer composition; a spinel crystal filler present in an amount from 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 20, 25, 30, 35, 40, 45, 50, 55 and 60 weight-percent of the total weight of the polymer composition, and methods for making same are provided.
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53.发明授权Polymer-based capacitor composites capable of being light-activated and receiving direct metalization, and methods and compositions related thereto 失效能够被光活化并接受直接金属化的聚合物基电容器复合材料，以及与其相关的方法和组合物公开(公告)号：US07504150B2
公开(公告)日：2009-03-17
申请号：US11153176
申请日：2005-06-15
CPC分类号： H01G4/20 , H01G4/14 , H05K1/0346 , H05K1/0373 , H05K1/162 , H05K3/185 , H05K2201/0154 , H05K2201/0209 , H05K2201/0355 , H05K2201/09309 , H05K2203/107 , Y10T428/25 , Y10T428/256 , Y10T428/26 , Y10T428/31529 , Y10T428/3154 , Y10T428/31681 , Y10T428/31721
摘要： The present invention relates generally to polymer composites having dispersed therein both useful spinel crystal fillers and ferroelectric (and/or paraelectric) fillers wherein the composite is both light activatable and can be used as a planar capacitor material. The light activation is typically employed via a laser beam (or other light emitting device) where the material has a pattern formed thereon. Electrodes are typically formed on the material's surface after patterning is complete via electroless metal plating. These composite polymers can be used as planar capacitors embedded in printed wiring boards or in integrated circuit packages.
摘要翻译： 本发明一般涉及其中分散有有用的尖晶石晶体填料和铁电（和/或顺电）填料的聚合物复合材料，其中复合材料既可光活化又可用作平面电容器材料。 通常通过激光束（或其他发光器件）使用光激活，其中材料具有形成在其上的图案。 通过无电金属电镀完成图案化之后，电极通常形成在材料的表面上。 这些复合聚合物可以用作嵌入印刷线路板或集成电路封装中的平面电容器。
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公开(公告)号：US07476489B2
公开(公告)日：2009-01-13
申请号：US11271267
申请日：2005-11-10
CPC分类号： H05K3/287 , G03F7/037 , Y10S430/106 , Y10S430/117 , Y10S430/127
摘要： The invention relates to low-temperature curable photosensitive compositions containing a polyamic acid, which compositions are developable in aqueous alkaline solutions and are curable, at a temperature of at least 160° C. and up to 200° C., to low modulus polyimides suitable for use in electronic circuitry applications, and which are particularly suitable for use in flexible circuit applications where low curl, low temperature curing, and good adhesion is a significant advantage.
摘要翻译： 本发明涉及含有聚酰胺酸的低温可固化光敏组合物，该组合物可在碱性水溶液中显影，并且可在至少160℃和高达200℃的温度下固化至适合的低模量聚酰亚胺 用于电子电路应用中，并且其特别适合用于柔性电路应用中，其中低卷曲，低温固化和良好的附着力是显着的优点。
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公开(公告)号：US06469126B1
公开(公告)日：2002-10-22
申请号：US09741943
申请日：2000-12-21
IPC分类号： C08G7310
CPC分类号： C08G73/1014 , C08G73/101 , C08G73/1017 , C08G73/1042 , C08G73/1071
摘要： Random, melt-processible copolyimides are disclosed herein. These copolyimides are semicrystalline and exhibit recoverable (semi)crystallinity from their melts. Associated processes, which entail either solution polymerization or melt polymerization, for producing and fabricating these copolyimides into useful articles having a predetermined shape are also disclosed.
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公开(公告)号：US5280103A
公开(公告)日：1994-01-18
申请号：US899896
申请日：1992-06-17
IPC分类号： C07C211/52 , C08G73/10 , C08G69/26
CPC分类号： C07C211/52 , C08G73/1039 , C08G73/1067
摘要： 1-[2,2-bis(trifluoromethyl)-3,3,4,4,5,5,5-heptafluoropentyl]-3,5-diaminobenzene and 1-[2,2-bis(trifluoromethyl)-3,3,4,4,5,5,5-heptafluoropentyl]-4-aminobenzene, as well as fluorinated polymers, preferably polyimides. The perfuuoroalkyl group of these amines is connected to the benzene ring through a tertiary carbon atom followed by a methylene group. This renders the amines more reactive than other amines, where the perfluoroalkyl group is connected directly to the benzene ring. The absence of hydrogen from the group containing the tertiary carbon atom which is adjacent to the perfluorinated groups, prohibits dehydrofluorination.
摘要翻译： 1- [2,2-双（三氟甲基）-3,3,4,4,5,5,5-七氟戊基] -3,5-二氨基苯和1- [2,2-双（三氟甲基） 3,4,4,5,5,5-七氟戊基] -4-氨基苯基，以及氟化聚合物，优选聚酰亚胺。 这些胺的全氟烷基通过叔碳原子和亚甲基与苯环连接。 这使得胺比其它胺更具反应性，其中全氟烷基直接与苯环连接。 与含有与全氟化基团相邻的叔碳原子的基团不含氢禁止脱氟化氢。
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公开(公告)号：US5145999A
公开(公告)日：1992-09-08
申请号：US680486
申请日：1991-04-04
IPC分类号： C07C211/52 , C08G73/10
CPC分类号： C07C211/52 , C08G73/1039 , C08G73/1067
摘要： 1-[2,2-bis(trifluoromethyl)-3,3,4,4,5,5,5-heptafluoropentyl]-3,5-diaminobenzene and 1-[2,2-bis(trifluoromethyl)-3,3,4,4,5,5,5-heptafluoropentyl]-4-aminobenzene, as well as fluorinated polymers, preferably polyimides. The perfluoroalkyl group of these amines is connected to the benzene ring through a tertiary carbon atom followed by a methylene group. This renders the amines more reactive than other amines, where the perfluoroalkyl group is connected directly to the benzene ring. The absence of hydrogen from the group containing the tertiary carbon atom which is adjacent to the perfluorinated groups, prohibits dehydrofluorination.
摘要翻译： 1- [2,2-双（三氟甲基）-3,3,4,4,5,5,5-七氟戊基] -3,5-二氨基苯和1- [2,2-双（三氟甲基） 3,4,4,5,5,5-七氟戊基] -4-氨基苯基，以及氟化聚合物，优选聚酰亚胺。 这些胺的全氟烷基通过叔碳原子和亚甲基与苯环连接。 这使得胺比其它胺更具反应性，其中全氟烷基直接与苯环连接。 与含有与全氟化基团相邻的叔碳原子的基团不含氢禁止脱氟化氢。
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