摘要:
1-[2,2-bis(trifluoromethyl)-3,3,4,4,5,5,5-heptafluoropentyl]-3,5-diaminobenzene and 1-[2,2-bis(trifluoromethyl)-3,3,4,4,5,5,5-heptafluoropentyl]-4-aminobenzene, as well as fluorinated polymers, preferably polyimides. The perfuuoroalkyl group of these amines is connected to the benzene ring through a tertiary carbon atom followed by a methylene group. This renders the amines more reactive than other amines, where the perfluoroalkyl group is connected directly to the benzene ring. The absence of hydrogen from the group containing the tertiary carbon atom which is adjacent to the perfluorinated groups, prohibits dehydrofluorination.
摘要:
1-[2,2-bis(trifluoromethyl)-3,3,4,4,5,5,5-heptafluoropentyl]-3,5-diaminobenzene and 1-[2,2-bis(trifluoromethyl)-3,3,4,4,5,5,5-heptafluoropentyl]-4-aminobenzene, as well as fluorinated polymers, preferably polyimides. The perfluoroalkyl group of these amines is connected to the benzene ring through a tertiary carbon atom followed by a methylene group. This renders the amines more reactive than other amines, where the perfluoroalkyl group is connected directly to the benzene ring. The absence of hydrogen from the group containing the tertiary carbon atom which is adjacent to the perfluorinated groups, prohibits dehydrofluorination.
摘要:
Perfluoroalkylated diaminoesitylene and polymers, preferably polyimides, made therefrom. The necessarily obtainable meta-substitution position of the perfluoroalkyl group with respect to both amino-groups provides an improved diamine and compositions of matter resulting therefrom.
摘要:
Liquid Crystal Display Devices having alignment layers of polyimides which are characterized by pendant perfluorinated chains, preferably linear, and having more than 6 perfluorinated carbon atoms. These alignment layers are capable to provide the Liquid Crystal Display Devices with stable tilt angles of 5 or more degrees.
摘要:
A back-sheet for a photovoltaic module is provided comprising a fire resistant polymeric film and a second polymeric film adhered to the fire resistant polymeric film. The fire resistant polymeric film comprises a polymer that does not melt at temperatures below 275° C. and an inorganic particulate filler selected from inorganic metal oxides and inorganic metal nitrides, and combinations thereof. The fire resistant polymeric film contains from 40 to 75 weight percent inorganic particulate filler based on the total weight of the film, and the fire resistant polymeric film has an average thickness of at least 85 microns. A photovoltaic module comprising such a back-sheet is also provided.
摘要:
A back-sheet for a photovoltaic module comprises a fire resistant sheet adhered to a fluoropolymer film. The fire resistant sheet comprises 40 to 100 weight percent of crystallized mineral silicate platelets based on the weight of the fire resistant sheet, and the fire resistant sheet has an average thickness of at least 75 microns, and more preferably at least 100 microns. The crystallized mineral silicate platelets of the fire resistant sheet are selected from the group of mica, vermiculite, clay, talc, and combinations thereof. A photovoltaic module made with such a back-sheet is also disclosed.
摘要:
A film is disclosed, containing 40-100 weight percent polyimide. The polyimide is derived from a dianhydride component and a diamine component. The dianhydride component is at least 3,3′,4,4′-biphenyl tetracarboxylic dianhydride (BPDA), and optionally is also pyromellitic dianhydride (PMDA) in a mole ratio of 50-100:50-0 (BPDA:PMDA). The diamine component comprises 1,5-naphthalenediamine (1,5-ND) and 1,4-diaminobenzene (PPD) and/or meta phenylene diamine (MPD) in a mole ratio of 15-95:85-5 (1,5-ND:PPD+MPD). The films have exceptional high temperature storage modulus (elastic modulus) and exceptionally low high temperature creep (eplast).
摘要:
A light-activatable polymer composition and polymer composite includes a polymer binder selected from epoxy resins, silica filled epoxy, bismaleimide resins, bismaleimide triazines, fluoropolymers, polyesters, polyphenylene oxide/polyphenylene ether resins, polybutadiene/polyisoprene crosslinkable resins (and copolymers), liquid crystal polymers, polyamides, cyanate esters, or combinations thereof, the polymer binder being present in an amount from 40, 45, 50, 55, 60, 65, 70, 75, 80, 85, 90, 95, 96, or 97 weight-percent of the total weight of the polymer composition; a spinel crystal filler present in an amount from 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 20, 25, 30, 35, 40, 45, 50, 55 and 60 weight-percent of the total weight of the polymer composition, and methods for making same are provided.
摘要:
The invention is directed to substrates for electronic circuitry. The substrates of the invention have a first polyimide layer having a functional filler and a second polyimide layer having a functional filler. The first layer is non-identical to the second layer, and a surface of the first layer is in contact with and is directly bonded to a surface of the second layer. Filler from each layer extends into the interface between the two layers, and a plurality of covalent bonds are present between the first and second functional layers that chemically bond the two layers together to provide a reliable, predictable multifunctional substrate for electronic circuitry with improved performance relative to polyimide layers bonded together by an adhesive.
摘要:
The present disclosure is directed to a thin film transistor composition. The thin film transistor composition has a semiconductor material and a substrate. The substrate is composed of a polyimide and a sub-micron filler. The polyimide is derived from at least one aromatic dianhydride component selected from rigid rod dianhydride, non-rigid rod dianhydride and combinations thereof, and at least one aromatic diamine component selected from rigid rod diamine, non-rigid rod diamine and combinations thereof. The mole ratio of dianhydride to diamine is 48-52:52-48 and the ratio of X:Y is 20-80:80-20 where X is the mole percent of rigid rod dianhydride and rigid rod diamine, and Y is the mole percent of non-rigid rod dianhydride and non-rigid rod diamine. The sub-micron filler is less than 550 nanometers in at least one dimension; has an aspect ratio greater than 3:1; is less than the thickness of the film in all dimensions.