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公开(公告)号:US07724988B2
公开(公告)日:2010-05-25
申请号:US11927589
申请日:2007-10-29
CPC分类号: G02B6/4232 , G02B6/4249 , H05K1/0274 , H05K1/184 , H05K2201/10121
摘要: An opto-electronic board including a printed wiring board with an optical waveguide, a metallic area, and a hole, wherein an abutting face of the optical waveguide and an abutting face of the metallic area form a part of the side face of the hole. The opto-electronic board further comprises an opto-electronic circuit with a bonding pad, wherein the opto-electronic circuit is arranged in the hole and soldered with its bonding pad to the abutting face of the metallic area.
摘要翻译: 一种光电板,包括具有光波导,金属区域和孔的印刷线路板,其中所述光波导的抵接面和所述金属区域的抵接面形成所述孔的侧面的一部分。 光电板还包括具有接合焊盘的光电子电路,其中光电子电路布置在孔中并用其焊盘焊接到金属区域的邻接面。
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公开(公告)号:US07409488B2
公开(公告)日:2008-08-05
申请号:US10623916
申请日:2003-07-21
申请人: Gerd K. Binnig , Michel Despont , Urs T. Durig , Walter Haberle , Peter Vettiger
发明人: Gerd K. Binnig , Michel Despont , Urs T. Durig , Walter Haberle , Peter Vettiger
IPC分类号: G06F12/00
CPC分类号: B82Y10/00 , G11B9/1436 , G11C23/00
摘要: A data processing system comprises a local probe storage array having a plurality of sensors for reading data from a storage surface. A plurality of data processing elements are mounted on the storage array. Each data processing element is connected to different sensor of the array for processing data read by the connected sensor. The data processing elements may be logic gates for performing simple comparisons with input data. Alternatively, each data processing element may comprise more complex logic circuitry for performing more complex functions based on data read by the storage array. Such function may involve a combination of data read by the storage array and data input to the data processing system from an another source. Each data processing element may comprise a complete microprocessor system responsive to data read from the storage array. It will be appreciated that data processing elements may thought of as collectively constituting a form of CPU capable of acting upon data read from the storage array in a parallel and therefor high speed fashion.
摘要翻译: 数据处理系统包括具有用于从存储表面读取数据的多个传感器的本地探针存储阵列。 多个数据处理元件安装在存储阵列上。 每个数据处理元件连接到阵列的不同传感器,用于处理由连接的传感器读取的数据。 数据处理元件可以是用于执行与输入数据的简单比较的逻辑门。 或者,每个数据处理元件可以包括更复杂的逻辑电路,用于基于由存储阵列读取的数据来执行更复杂的功能。 这样的功能可以涉及由存储阵列读取的数据和从另一个源输入到数据处理系统的数据的组合。 每个数据处理元件可以包括响应于从存储阵列读取的数据的完整的微处理器系统。 应当理解,数据处理元件可以被认为是共同构成一种能够以并行的方式从存储阵列读取数据的CPU的形式。
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公开(公告)号:US07351604B2
公开(公告)日:2008-04-01
申请号:US10501516
申请日:2002-11-21
申请人: Graham Cross , Michel Despont , Urs T. Duerig , Grégoire Genolet , Reto Schlittler , Peter Vettiger
发明人: Graham Cross , Michel Despont , Urs T. Duerig , Grégoire Genolet , Reto Schlittler , Peter Vettiger
IPC分类号: H01L21/00
CPC分类号: G11C23/00 , G01Q70/06 , G01Q70/12 , G01Q70/16 , G11B9/1409 , G11B9/1418 , G11C13/025 , G11C2213/81 , Y10S977/732 , Y10S977/733
摘要: A method for forming a microstructures is described. The method comprises: depositing a seed material on a substrate; growing a nanotube from the seed material; depositing microstructure material on the substrate to embed the nanotube in the microstructure material; and, detaching the substrate to release the microstructure. The resulting mictostructure comprises a body portion and a nanotube embedded in the body portion.
摘要翻译: 描述了形成微结构的方法。 该方法包括:将种子材料沉积在基底上; 从种子材料生长纳米管; 将微结构材料沉积在衬底上以将纳米管嵌入微结构材料中; 并且分离基板以释放微结构。 所得到的微结构包括主体部分和嵌入在主体部分中的纳米管。
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公开(公告)号:US07271034B2
公开(公告)日:2007-09-18
申请号:US11148737
申请日:2005-06-09
IPC分类号: H01L21/00
CPC分类号: H01L21/4882 , H01L21/4871 , H01L21/4875 , H01L23/3677 , H01L2224/16 , H01L2224/73253 , H01L2924/09701 , H01L2924/1461 , H01L2924/00
摘要: Provides semiconductor devices and method for fabricating devices having a high thermal dissipation efficiency. An example device comprises a thermally conducting structure attached to a surface of the semiconductor device via soldering. The thermally conducting structure is essentially formed of a thermally conducting material and comprises an array of freestanding fins, studs or frames, or a grid of connected fins. A process for fabricating such a semiconductor device includes forming a thermally conducting structure on a carrier and attaching the thermally conducting structure formed on the carrier to a surface of the semiconductor device via soldering.
摘要翻译: 提供用于制造具有高散热效率的器件的半导体器件和方法。 示例性装置包括通过焊接附接到半导体器件的表面的导热结构。 导热结构基本上由导热材料形成,并且包括独立的翅片,螺柱或框架的阵列或连接的翅片的格栅。 制造这种半导体器件的方法包括在载体上形成导热结构,并通过焊接将形成在载体上的导热结构附着在半导体器件的表面上。
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公开(公告)号:US07054257B2
公开(公告)日:2006-05-30
申请号:US10426064
申请日:2003-04-29
申请人: Gerd K. Binnig , Michel Despont , Peter Vettiger
发明人: Gerd K. Binnig , Michel Despont , Peter Vettiger
CPC分类号: G11B9/14 , G01Q80/00 , G11B9/1409 , G11B2005/0021
摘要: Read/write components for AFM-based data storage devices are provided. In particular embodiments, a read/write component comprises lever means and a support structure, the lever means being connected to the support structure for substantially pivotal movement. The lever means provides first and second current paths between a pair of electrical supply lines on the support structure via which the lever means can be connected in use to power supply means operable in a write mode and a read mode. A write-mode heater is provided on the lever means in the first current path, and a read/write tip is provided on the write-mode heater. A read-mode heater is provided on the lever means in the second current path. Decoupling means is arranged to inhibit current flow to the write-mode heater via the first current path in use when the power supply means is operated in the read mode. The component, with separate write and read-mode heaters, can thus be addressed in both the write and read modes via a single pair of supply lines. Other embodiments provide read/write components employing a thermal decoupling mechanism, and read/write components where read-sensing is performed by a proximity sensing arrangement between the lever means and the support structure. Sensing apparatus for atomic force microscopes is also provided where tip movement can be detected via similar proximity sensing arrangements.
摘要翻译: 提供了基于AFM的数据存储设备的读/写组件。 在特定实施例中,读/写组件包括杠杆装置和支撑结构,杠杆装置连接到支撑结构以实质上枢转运动。 杠杆装置在支撑结构上的一对电源线之间提供第一和第二电流路径,通过该第一和第二电流路径,杠杆装置可以在使用中连接到以写入模式和读取模式操作的电源装置。 写模式加热器设置在第一电流路径中的杠杆装置上,并且在写模式加热器上设置读/写尖端。 在第二电流路径中的杠杆装置上设置读取模式加热器。 去耦装置被布置成当电源装置在读取模式下操作时,通过使用中的第一电流路径阻止电流流向写模式加热器。 因此,具有单独的写入和读取模式加热器的组件可以通过一对电源线在写入和读取模式下进行寻址。 其他实施例提供采用热解耦机构的读/写组件,以及读/写组件,其中通过杠杆装置和支撑结构之间的接近感测装置执行读取感测。 还提供了用于原子力显微镜的感测装置,其中可以通过类似的接近感测装置检测尖端运动。
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公开(公告)号:US20060043288A1
公开(公告)日:2006-03-02
申请号:US10502366
申请日:2002-12-11
申请人: Gerd Binnig , Michel Despont , Walter Haeberle , Mark Lantz
发明人: Gerd Binnig , Michel Despont , Walter Haeberle , Mark Lantz
IPC分类号: G21K7/00
CPC分类号: G11B9/1418 , G01Q70/06 , G01Q80/00 , G11B9/14 , G11B9/1409 , G11B2005/0021
摘要: A cantilever device for scanning a surface comprises a support, a tip platform and a flexible arm arrangement. The tip platform has a plurality of tips. These comprise at least two contact tips providing points of contact with a surface to be scanned, and a scanning tip for scanning the surface, where the scanning tip may be one of the two or more contact tips provided on the platform. The flexible arm arrangement connects the tip platform to the support and allows orientation of the platform, via flexing of the arm arrangement, to bring the contact tips into contact with a surface to be scanned. The platform is then at a well-defined orientation relative to the scan surface, and the scanning tip is appropriately positioned for the scanning operation. Scanning probe microscopes and data storage devices incorporating such cantilever devices are also provided.
摘要翻译: 用于扫描表面的悬臂装置包括支撑件,尖端平台和柔性臂装置。 尖端平台具有多个尖端。 这些包括提供与待扫描表面的接触点的至少两个接触尖端和用于扫描表面的扫描尖端,其中扫描尖端可以是设置在平台上的两个或更多个接触尖端中的一个。 柔性臂装置将尖端平台连接到支撑件并且允许平台的取向通过臂装置的弯曲,以使接触尖端与待扫描的表面接触。 然后平台相对于扫描表面定义明确,并且扫描尖端适当地定位用于扫描操作。 还提供了包括这种悬臂装置的扫描探针显微镜和数据存储装置。
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公开(公告)号:US20050130551A1
公开(公告)日:2005-06-16
申请号:US10501516
申请日:2002-11-21
申请人: Graham Cross , Michel Despont , Urs Duerig , Gregoire Genolet , Reto Schlittler
发明人: Graham Cross , Michel Despont , Urs Duerig , Gregoire Genolet , Reto Schlittler
IPC分类号: B81B3/00 , B82B3/00 , C01B31/02 , G01B7/34 , G01Q70/12 , G01Q70/16 , G11B9/00 , G11C23/00 , H01J9/04 , H01J9/12
CPC分类号: G11C23/00 , G01Q70/06 , G01Q70/12 , G01Q70/16 , G11B9/1409 , G11B9/1418 , G11C13/025 , G11C2213/81 , Y10S977/732 , Y10S977/733
摘要: A method for forming a microstructures is described. The method comprises: depositing a seed material on a substrate; growing a nanotube from the seed material; depositing microstructure material on the substrate to embed the nanotube in the microstructure material; and, detaching the substrate to release the microstructure. The resulting mictostructure comprises a body portion and a nanotube embedded in the body portion.
摘要翻译: 描述了形成微结构的方法。 该方法包括:将种子材料沉积在基底上; 从种子材料生长纳米管; 将微结构材料沉积在衬底上以将纳米管嵌入微结构材料中; 并且分离基板以释放微结构。 所得到的微结构包括主体部分和嵌入在主体部分中的纳米管。
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公开(公告)号:US20130105286A1
公开(公告)日:2013-05-02
申请号:US13807049
申请日:2011-06-08
IPC分类号: H01H59/00
CPC分类号: H01H59/00 , H01H47/00 , H01H59/0009
摘要: An electromechanical switch device includes a first switch portion, a second switch portion and an actuator device. The actuator device is configured to provide an actuation force, thereby actuating the first and second switch portion relative to each other to change from a disconnected to a connected state. The actuator device is further configured to provide the actuation force with a modulation at least when the first and second switch portion are in the connected state. A method of operating an electromechanical switch device is also provided.
摘要翻译: 机电开关装置包括第一开关部分,第二开关部分和致动器装置。 致动器装置构造成提供致动力,从而相对于彼此致动第一和第二开关部分,以从断开状态切换到连接状态。 致动器装置进一步构造成至少当第一和第二开关部分处于连接状态时,通过调制来提供致动力。 还提供了一种操作机电开关装置的方法。
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公开(公告)号:US08416537B2
公开(公告)日:2013-04-09
申请号:US12614275
申请日:2009-11-06
申请人: David Berman , Robert G. Biskeborn , Michel Despont , Philipp Herget , Wayne Isami Imaino , Pierre-Olivier Jubert , Peter V. Koeppe , Chandrasekhar Narayan
发明人: David Berman , Robert G. Biskeborn , Michel Despont , Philipp Herget , Wayne Isami Imaino , Pierre-Olivier Jubert , Peter V. Koeppe , Chandrasekhar Narayan
IPC分类号: G11B5/39
CPC分类号: G11B5/3163 , G11B5/00826 , G11B5/398
摘要: In one embodiment, a read sensor for a recording head for a magnetic media storage system, has first and second shields, and a magneto-resistive sensor disposed between and shielded by the first and second shields in which the sensing axis of the sensor is tilted with respect to the recording surface of the head. In one embodiment, the sensing axis is oriented at an angle between 10 and 60 degrees with respect to the normal of the recording surface. Other embodiments are described and claimed.
摘要翻译: 在一个实施例中,用于磁性介质存储系统的记录头的读取传感器具有第一和第二屏蔽以及设置在第一和第二屏蔽之间并被传感器的感测轴倾斜的屏蔽的磁阻传感器 相对于头部的记录表面。 在一个实施例中,感测轴相对于记录表面的法线定向成10度至60度的角度。 描述和要求保护其他实施例。
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公开(公告)号:US08373431B2
公开(公告)日:2013-02-12
申请号:US12054938
申请日:2008-03-25
申请人: Thomas Albrecht , Michel Despont , Urs T. Duerig , Mark Lantz , Hugo E. Rothuizen , Dorothea W. Wiesmann Rothuizen
发明人: Thomas Albrecht , Michel Despont , Urs T. Duerig , Mark Lantz , Hugo E. Rothuizen , Dorothea W. Wiesmann Rothuizen
CPC分类号: G11B11/007 , G01Q70/14 , G01Q80/00 , G11B9/1409
摘要: A data storage device comprises a storage medium for storing data in the form of marks and at least one probe for scanning the storage medium. The storage medium may be comprised in a substrate. The probe comprises a cantilever that comprises terminals serving as electrical contacts an being during operation of the probe mechanically fixed to a probe-holding structure, which may be a common frame of the data storage device. A probe further comprises a supporting structure, to which the terminals are mechanically directly coupled or coupled via hinges and which extends away from the terminals. A tip with a nanoscale apex is provided. A beam structure comprises a heating resistor and is attached at ends to the supporting structure. The beam structure is thinned at least in a direction parallel to an axis of the tip compared to an area of the supporting structure abutting the beam structure.
摘要翻译: 数据存储装置包括用于以标记形式存储数据的存储介质和用于扫描存储介质的至少一个探针。 存储介质可以包含在基板中。 探头包括悬臂,其包括用作电触点的端子,所述端子在机械地固定到探头保持结构的探头的操作期间,探头保持结构可以是数据存储装置的公共框架。 探头还包括支撑结构,端子通过铰链机械地直接联接或耦合到该支撑结构,并且远离端子延伸。 提供具有纳米级顶点的尖端。 梁结构包括加热电阻器,并且在端部附接到支撑结构。 与支撑结构邻接梁结构的区域相比,梁结构至少在平行于尖端的轴线的方向上变薄。
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