公开(公告)号：US20160037619A1

公开(公告)日：2016-02-04

申请号：US14734933

申请日：2015-06-09

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Yong Ho BAEK ,  Young Gwan KO ,  Jae Hoon CHOI ,  Il Jong SEO ,  Sung Uk LEE ,  Eung Suek LEE

IPC: H05K1/02 ,  H05K3/10 ,  H05K3/06 ,  H05K3/40

CPC classification number: H05K3/4682 ,  H05K3/0097 ,  H05K2203/0152 ,  H05K2203/1536

Abstract: There are provided a carrier substrate including: a first metal layer; a barrier layer formed on one surface of the first carrier metal layer; and a second metal layer formed on one surface of the barrier layer, and a method of manufacturing a printed circuit board using the same.

Abstract translation: 提供了一种载体基板，包括：第一金属层; 形成在所述第一载体金属层的一个表面上的阻挡层; 以及形成在阻挡层的一个表面上的第二金属层，以及使用其形成印刷电路板的方法。

公开(公告)号：US20160007449A1

公开(公告)日：2016-01-07

申请号：US14754363

申请日：2015-06-29

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Joon Sung KIM ,  Yong Ho BAEK ,  Jung Hyun CHO ,  Eung Suek LEE ,  Jae Hoon CHOI ,  Young Gwan KO

IPC: H05K1/02 ,  H05K3/46 ,  H05K3/10 ,  H05K1/18 ,  H05K3/30

CPC classification number: H01L23/49827 ,  H01L21/4846 ,  H01L23/13 ,  H01L23/5389 ,  H01L24/25 ,  H01L24/82 ,  H01L2224/04105 ,  H01L2224/19 ,  H01L2224/2518 ,  H01L2224/32225 ,  H01L2224/83005 ,  H01L2224/92144 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/3511 ,  H05K1/0298 ,  H05K1/185 ,  H05K3/10 ,  H05K3/30 ,  H05K3/305 ,  H05K3/4602 ,  H05K3/4644 ,  H05K2201/09227 ,  H05K2203/1469 ,  H05K2203/167

Abstract: Disclosed herein is a chip embedded substrate including: an insulating layer having outer layer circuit patterns provided on any one of an upper surface and a lower surface thereof; a chip embedded in the insulating layer; and internal circuit patterns included in the insulating layer and disposed between a height of a top surface of the chip and a height of a bottom surface thereof.

Abstract translation: 本文公开了一种芯片嵌入式基板，包括：绝缘层，其具有设置在其上表面和下表面中的任一个上的外层电路图案; 嵌入绝缘层中的芯片; 以及包括在绝缘层中并且设置在芯片的顶表面的高度和其底表面的高度之间的内部电路图案。

公开(公告)号：US20150373833A1

公开(公告)日：2015-12-24

申请号：US14488225

申请日：2014-09-16

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Yong Ho BAEK ,  Hyo Seung Nam ,  Jae Hoon Choi ,  Eung Suek Lee ,  Jeong Ho Lee

IPC: H05K1/02 ,  H05K3/46

CPC classification number: H05K3/4682 ,  H05K3/0097 ,  H05K3/4673 ,  H05K2201/096 ,  H05K2203/1536 ,  Y10T29/49156

Abstract: There are provided a printed circuit board and a method of manufacturing the same. According to an exemplary embodiment of the present disclosure, a printed circuit board includes: an insulating layer; a first outer layer circuit pattern formed in a lower portion of the insulating layer to be embedded in the insulating layer; and a second outer layer circuit pattern formed on the insulating layer to protrude from the insulating layer.

Abstract translation: 提供了一种印刷电路板及其制造方法。 根据本公开的示例性实施例，印刷电路板包括：绝缘层; 第一外层电路图形，形成在所述绝缘层的下部，以嵌入所述绝缘层中; 以及形成在所述绝缘层上以从所述绝缘层突出的第二外层电路图案。

公开(公告)号：US20150195902A1

公开(公告)日：2015-07-09

申请号：US14592696

申请日：2015-01-08

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Eung Suek LEE ,  Hyo Seung NAM ,  Sung Uk LEE ,  Jae Hoon CHOI ,  II Jong SEO ,  Yong Ho BAEK

IPC: H05K1/02 ,  H05K3/00 ,  C23C14/34 ,  H05K1/09

CPC classification number: H05K3/4682 ,  H05K3/3452 ,  H05K2201/0376

Abstract: There are provided a printed circuit board and a method of manufacturing the same. The printed circuit board according to an exemplary embodiment of the present disclosure includes: an insulating layer; a first circuit buried below the insulating layer and having a lower surface formed to be exposed from a lower surface of the insulating layer; a second circuit layer formed on the insulating layer; and a first solder resist layer formed below the insulating layer and the first circuit layer and formed to expose a portion of the first circuit layer.

Abstract translation: 提供了一种印刷电路板及其制造方法。 根据本公开的示例性实施例的印刷电路板包括：绝缘层; 埋置在所述绝缘层下方并具有形成为从所述绝缘层的下表面露出的下表面的第一电路; 形成在所述绝缘层上的第二电路层; 以及形成在所述绝缘层和所述第一电路层下面并形成以暴露所述第一电路层的一部分的第一阻焊层。