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公开(公告)号：US10297553B2
公开(公告)日：2019-05-21
申请号：US15982839
申请日：2018-05-17
发明人： Yong Ho Baek , Sang Kun Kim , Ye Jeong Kim , Jae Ean Lee , Jae Hoon Choi
IPC分类号： H01L21/56 , H01L23/00 , H01L23/31 , H01L23/538 , H05K1/18 , H01L21/48 , H01L21/66 , H01L23/13
摘要： An electronic component package includes first and second wiring parts including insulating layers, conductive patterns formed in the insulating layers, and conductive vias penetrating through the insulating layers, to be connected to the conductive patterns, respectively; a frame disposed between the first and second wiring parts and having conductive connection parts electrically connecting one or more through-holes with the first and second wiring parts and an electronic component disposed to be surrounded by the through-hole, to thereby be connected to the first wiring part, wherein the conductive patterns formed to be adjacent to the electronic component among the conductive patterns of the first wiring part are embedded in the insulating layer of the first wiring part.
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公开(公告)号：US09831142B2
公开(公告)日：2017-11-28
申请号：US15200838
申请日：2016-07-01
发明人： Yong Ho Baek , Jung Hyun Cho , Jae Hoon Choi
CPC分类号： H01L22/34 , H01L21/565 , H01L23/31 , H01L23/5226 , H01L24/16 , H01L24/48 , H01L2224/16235 , H01L2224/16238 , H01L2224/32225 , H01L2224/48105 , H01L2224/48227 , H01L2224/81005 , H01L2924/00014 , H01L2924/15311 , H01L2924/1533 , H01L2224/05599 , H01L2224/45099
摘要： A board for an electronic component package includes a wiring part on which an electronic component is disposed, wherein the wiring part includes an insulating layer, a signal transferring wiring electrically connected to the electronic component, and an electrical testing wiring electrically disconnected from the electronic component, and the electrical testing wiring includes conductive patterns formed on both surfaces of the wiring part, and conductive vias electrically connecting the conductive patterns to each other.
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公开(公告)号：US09011709B2
公开(公告)日：2015-04-21
申请号：US13843120
申请日：2013-03-15
发明人： Jae Hoon Choi , Ji Sung Cho , Eun Sil Kim , Se Woong Paeng , Bae Kyun Kim
IPC分类号： H01G11/60
摘要： The present invention relates to an electrolyte of an energy storage device. An electrolyte composition in accordance with an embodiment of the present invention includes an electrolyte salt, a carbonate solvent, and at least one nitrile solvent of acetonitrile and propionitrile.
摘要翻译： 本发明涉及能量储存装置的电解质。 根据本发明实施方案的电解质组合物包括电解质盐，碳酸酯溶剂和至少一种乙腈和丙腈的腈溶剂。
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公开(公告)号：US10674608B2
公开(公告)日：2020-06-02
申请号：US16033427
申请日：2018-07-12
发明人： Jung Hyun Park , Yong Ho Baek , Jae Hoon Choi
摘要： There is provided a printed circuit board including: a first insulating layer; a first circuit pattern formed on a first surface of the first insulating layer; an adhesive layer provided on a second surface of the first insulating layer; and an electronic component disposed on the adhesive layer and enclosed by the first insulating layer and a second insulating layer formed on the first insulating layer.
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5.发明申请ACTIVATED CARBON, METHOD FOR PREPARING THE SAME, AND ELECTROCHEMICAL CAPACITOR INCLUDING THE SAME 审中-公开活性炭，其制备方法和包括其的电化学电容器公开(公告)号：US20140177136A1
公开(公告)日：2014-06-26
申请号：US14106204
申请日：2013-12-13
发明人： Eun Sil Kim , Se Woong Paeng , Bae Kyun Kim , Jae Hoon Choi
CPC分类号： H01G11/34 , C01B32/342 , Y02E60/13
摘要： Disclosed herein are an activated carbon in which pores with pore sizes of 0.3˜5 nm account for 80% or higher based on an overall pore volume, a method for preparing the activated carbon, and an electrochemical capacitor including the activated carbon, so that, since the activated carbon has uniform sized fine pores, high-rate discharge characteristics, high-rate charging and discharging characteristics, and low-temperature characteristics can be improved; since the content of functional groups on the surface of the activated carbon is low, there can be provided a supercapacitor and a lithium ion capacitor, having improved high voltage and lifespan characteristics; and the time for preparing an active material can be significantly shortened and thus the material cost and the process cost can be remarkably reduced.
摘要翻译： 本文公开了活性炭，其中孔径为0.3〜5nm的孔基于总孔体积为80％以上，制备活性炭的方法和包含活性炭的电化学电容器， 由于活性炭具有均匀的细小孔，因此可以提高高倍率放电特性，高速充放电特性和低温特性; 由于活性炭表面的官能团的含量低，所以可以提供具有改善的高电压和寿命特性的超级电容器和锂离子电容器; 并且可以显着缩短制备活性物质的时间，从而可以显着降低材料成本和工艺成本。
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公开(公告)号：US11096286B2
公开(公告)日：2021-08-17
申请号：US16812640
申请日：2020-03-09
发明人： Jung Hyun Park , Yong Ho Baek , Jae Hoon Choi
摘要： There is provided a printed circuit board including: a first insulating layer; a first circuit pattern formed on a first surface of the first insulating layer; an adhesive layer provided on a second surface of the first insulating layer; and an electronic component disposed on the adhesive layer and enclosed by the first insulating layer and a second insulating layer formed on the first insulating layer.
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公开(公告)号：US10129982B2
公开(公告)日：2018-11-13
申请号：US14815868
申请日：2015-07-31
发明人： Jae Hoon Choi , Jung Hyun Park , Yong Ho Baek , Hea Sung Kim , Jung Hyun Cho , Il Jong Seo
摘要： An embedded board includes an insulating layer and an electronic device embedded in the insulating layer. A first circuit pattern is embedded to contact a bottom surface of the insulating layer, and a second circuit pattern protrudes from the bottom surface of the insulating layer. A via is bonded to the device and the second circuit pattern.
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公开(公告)号：US20150373833A1
公开(公告)日：2015-12-24
申请号：US14488225
申请日：2014-09-16
发明人： Yong Ho BAEK , Hyo Seung Nam , Jae Hoon Choi , Eung Suek Lee , Jeong Ho Lee
CPC分类号： H05K3/4682 , H05K3/0097 , H05K3/4673 , H05K2201/096 , H05K2203/1536 , Y10T29/49156
摘要： There are provided a printed circuit board and a method of manufacturing the same. According to an exemplary embodiment of the present disclosure, a printed circuit board includes: an insulating layer; a first outer layer circuit pattern formed in a lower portion of the insulating layer to be embedded in the insulating layer; and a second outer layer circuit pattern formed on the insulating layer to protrude from the insulating layer.
摘要翻译： 提供了一种印刷电路板及其制造方法。 根据本公开的示例性实施例，印刷电路板包括：绝缘层; 第一外层电路图形，形成在所述绝缘层的下部，以嵌入所述绝缘层中; 以及形成在所述绝缘层上以从所述绝缘层突出的第二外层电路图案。
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公开(公告)号：US20140168853A1
公开(公告)日：2014-06-19
申请号：US13842189
申请日：2013-03-15
发明人： Jae Hoon Choi , Yeong Su Cho , Eun Sil Kim , Se Woong Paeng , Bae Kyun Kim , Ji Sung Cho
摘要： Disclosed herein is a super capacitor including: an electrode assembly; a pouch cell enclosing an outer peripheral surface of the electrode assembly; a resin case molding the pouch cell; and a lead wire of which one side is electrically connected to the electrode assembly and the other side exposed to the outside of the resin case is bonded to an outer peripheral surface of the resin case. According to the present invention, the super capacitor may have durability against external impact, and cycle life characteristics of the super capacitor may be significantly improved.
摘要翻译： 这里公开了一种超级电容器，包括：电极组件; 封闭电极组件的外周表面的袋细胞; 模塑袋细胞的树脂外壳; 并且其一侧电连接到电极组件并且暴露于树脂壳体的外侧的另一侧的引线被接合到树脂壳体的外周表面。 根据本发明，超级电容器可以具有耐外部冲击的耐久性，并且可以显着地提高超级电容器的循环寿命特性。
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公开(公告)号：US11812556B2
公开(公告)日：2023-11-07
申请号：US17374409
申请日：2021-07-13
发明人： Jung Hyun Park , Yong Ho Baek , Jae Hoon Choi
CPC分类号： H05K1/185 , H05K3/4682 , H05K2201/0195 , H05K2203/1469
摘要： There is provided a printed circuit board including: a first insulating layer; a first circuit pattern formed on a first surface of the first insulating layer; an adhesive layer provided on a second surface of the first insulating layer; and an electronic component disposed on the adhesive layer and enclosed by the first insulating layer and a second insulating layer formed on the first insulating layer.
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