公开(公告)号：US11037864B2

公开(公告)日：2021-06-15

申请号：US16264824

申请日：2019-02-01

Applicant: STMicroelectronics, Inc.

Inventor： Rennier Rodriguez ,  Maiden Grace Maming ,  Jefferson Talledo

IPC: H01L23/495 ,  H01L21/48 ,  H01L23/00

Abstract: The present disclosure is directed to a lead frame including a die pad with cavities, and methods for attaching a semiconductor die to the lead frame. The cavities allow for additional adhesive to be formed on the die pad at the corners of the semiconductor die, and prevent the additional adhesive from overflowing on to active areas of the semiconductor die.

公开(公告)号：US11031350B2

公开(公告)日：2021-06-08

申请号：US16223582

申请日：2018-12-18

Applicant: STMICROELECTRONICS, INC.

Inventor： Jefferson Talledo

IPC: H01L23/00 ,  H01L23/31 ,  H01L23/495 ,  H01L21/56 ,  H01L21/48

Abstract: A leadframe having extensions around an outer edge of a die pad are disclosed. More specifically, leadframes are created with a flange formed at the outer edge of the die pad and extending away from the die pad. The flange is bent, such that it is positioned at an angle with respect to the die pad. Leadframes are also created with anchoring posts formed adjacent the outer edge of the die pad and extending away from the die pad. The anchoring posts have a central thickness that is less than a thickness of first and second portions opposite the central portion. When the leadframe is incorporated into a package, molding compound completely surrounds each flange or anchoring post, which increases the bond strength between the leadframe and the molding compound due to increased contact area. The net result is a reduced possibility of delamination at edges of the die pad.

公开(公告)号：US11004776B2

公开(公告)日：2021-05-11

申请号：US15912193

申请日：2018-03-05

Applicant: STMicroelectronics, Inc.

Inventor： Jefferson Talledo ,  Rammil Seguido

IPC: H01L23/495 ,  H01L23/48 ,  H01L23/52 ,  H01L23/00 ,  H01L21/56 ,  H01L23/498 ,  H01L23/31

Abstract: A semiconductor device may include a circuit board having an opening, and a frame. The frame may have an IC die pad in the opening, and arms extending outwardly from the IC die pad and coupled to the circuit board. The semiconductor device may include an IC mounted on the IC die pad, bond wires coupling the circuit board with the IC, and encapsulation material surrounding the IC, the bond wires, and the arms.

公开(公告)号：US10943885B2

公开(公告)日：2021-03-09

申请号：US15863079

申请日：2018-01-05

Applicant: STMICROELECTRONICS, INC.

Inventor： Jefferson Talledo

IPC: H01L23/00 ,  H01L21/56 ,  H01L21/78 ,  H01L23/495 ,  H01L21/48 ,  H01L23/31

Abstract: A method is for making a semiconductor device. The method may include providing a lead frame having a recess, forming a sacrificial material in the recess of the lead frame, and mounting an IC on the lead frame. The method may include encapsulating the IC and the lead frame, removing portions of the lead frame to define lead frame contacts for the IC, and removing the sacrificial material to define for each lead frame contact a solder anchoring tab extending outwardly at a lower region and defining a sidewall recess between opposing portions of the solder anchoring tab and the encapsulation material.

公开(公告)号：US10141246B2

公开(公告)日：2018-11-27

申请号：US15952068

申请日：2018-04-12

Applicant: STMicroelectronics, Inc.

Inventor： Jefferson Talledo ,  Tito Mangaoang

IPC: H01L21/44 ,  H01L23/495 ,  H01L23/00 ,  H01L21/78 ,  H01L21/56 ,  H01L21/48 ,  H01L23/31

Abstract: The present disclosure is directed to a leadframe package having a side solder ball contact and methods of manufacturing the same. A plurality of solder balls are coupled to recesses in a leadframe before encapsulation and singulation. After singulation, a portion of each solder ball is exposed on sidewalls of the package. This ensures that the sidewalls of the leads are solder wettable, which allows for the formation of stronger joints when the package is coupled to a substrate. This increased adhesion reduces resistance at the joints and also mitigates the effects of expansion of the components in the package such that delamination is less likely to occur. As a result, packages with a side solder ball contact have increased life cycle expectancies.

公开(公告)号：US20180197809A1

公开(公告)日：2018-07-12

申请号：US15912193

申请日：2018-03-05

Applicant: STMicroelectronics, Inc.

Inventor： Jefferson Talledo ,  Rammil Seguido

IPC: H01L23/495 ,  H01L23/00 ,  H01L21/56 ,  H01L23/498 ,  H01L23/31

CPC classification number: H01L23/49531 ,  H01L21/561 ,  H01L21/563 ,  H01L23/3107 ,  H01L23/49503 ,  H01L23/49541 ,  H01L23/49548 ,  H01L23/49568 ,  H01L23/49575 ,  H01L23/49861 ,  H01L24/48 ,  H01L24/49 ,  H01L24/85 ,  H01L24/97 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/4918 ,  H01L2224/73265 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: A semiconductor device may include a circuit board having an opening, and a frame. The frame may have an IC die pad in the opening, and arms extending outwardly from the IC die pad and coupled to the circuit board. The semiconductor device may include an IC mounted on the IC die pad, bond wires coupling the circuit board with the IC, and encapsulation material surrounding the IC, the bond wires, and the arms.

公开(公告)号：US20180190576A1

公开(公告)日：2018-07-05

申请号：US15399234

申请日：2017-01-05

Applicant: STMicroelectronics, Inc.

Inventor： Rennier Rodriguez ,  Aiza Marie Agudon ,  Jefferson Talledo ,  Moonlord Manalo ,  Ela Mia Cadag ,  Rammil Seguido

IPC: H01L23/495 ,  H01L23/31 ,  H01L21/48 ,  H01L21/56

CPC classification number: H01L23/49503 ,  H01L23/3107 ,  H01L23/3142 ,  H01L23/49513 ,  H01L23/49548 ,  H01L2224/27013 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/83192 ,  H01L2224/83385 ,  H01L2224/92247 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/00

Abstract: The present disclosure is directed to a leadframe having a recess in a body of the leadframe to collect glue overflowing from the manufacturing process of coupling a semiconductor die to the leadframe. The recess extends beneath an edge of the semiconductor die so that any tendency of the glue to adhere to the semiconductor die is counteracted by a tendency of the glue to adhere to a wall of the recess and at least partially fill the volume of the recess. In addition, the recess for collecting adhesive may also form a mold lock on an edge of the leadframe, the mold lock providing a more durable connection between the leadframe and an encapsulant during physical and temperature stresses.

公开(公告)号：US10008472B2

公开(公告)日：2018-06-26

申请号：US14753365

申请日：2015-06-29

Applicant: STMICROELECTRONICS, INC.

Inventor： Jefferson Talledo

IPC: H01L23/48 ,  H01L23/52 ,  H01L21/00 ,  H01L23/00 ,  H01L21/56 ,  H01L21/78 ,  H01L21/48 ,  H01L23/31 ,  H01L23/495

CPC classification number: H01L24/85 ,  H01L21/4842 ,  H01L21/561 ,  H01L21/78 ,  H01L23/3121 ,  H01L23/49503 ,  H01L23/49544 ,  H01L23/49582 ,  H01L24/48 ,  H01L24/97 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2224/83 ,  H01L2224/85 ,  H01L2924/00015

Abstract: A method is for making a semiconductor device. The method may include providing a lead frame having a recess, forming a sacrificial material in the recess of the lead frame, and mounting an IC on the lead frame. The method may include encapsulating the IC and the lead frame, removing portions of the lead frame to define lead frame contacts for the IC, and removing the sacrificial material to define for each lead frame contact a solder anchoring tab extending outwardly at a lower region and defining a sidewall recess between opposing portions of the solder anchoring tab and the encapsulation material.

公开(公告)号：US20180144952A1

公开(公告)日：2018-05-24

申请号：US15876046

申请日：2018-01-19

Applicant: STMicroelectronics, Inc.

Inventor： Jefferson Talledo ,  Godfrey Dimayuga

IPC: H01L21/48 ,  H01L23/498

CPC classification number: H01L21/4857 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/49822 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/73265 ,  H01L2924/0002 ,  H01L2924/15183 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/00

Abstract: One or more embodiments are directed to semiconductor packages with one or more cantilever pads and methods of making same. In one embodiment a recess is located in a substrate of the package facing the cantilever pad. The cantilever pad includes a conductive pad on which a conductive ball is formed. The cantilever pad is configured to absorb stresses acting on the package.

公开(公告)号：US09972558B1

公开(公告)日：2018-05-15

申请号：US15479068

申请日：2017-04-04

Applicant: STMicroelectronics, Inc.

Inventor： Jefferson Talledo ,  Tito Mangaoang

IPC: H01L23/495 ,  H01L23/31 ,  H01L21/48 ,  H01L21/56 ,  H01L21/78 ,  H01L23/00

CPC classification number: H01L23/4952 ,  H01L21/4832 ,  H01L21/561 ,  H01L23/3107 ,  H01L23/49582 ,  H01L24/09 ,  H01L24/11 ,  H01L24/17 ,  H01L24/27 ,  H01L24/32 ,  H01L24/46 ,  H01L24/92 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/92125

Abstract: The present disclosure is directed to a leadframe package having a side solder ball contact and methods of manufacturing the same. A plurality of solder balls are coupled to recesses in a leadframe before encapsulation and singulation. After singulation, a portion of each solder ball is exposed on sidewalls of the package. This ensures that the sidewalls of the leads are solder wettable, which allows for the formation of stronger joints when the package is coupled to a substrate. This increased adhesion reduces resistance at the joints and also mitigates the effects of expansion of the components in the package such that delamination is less likely to occur. As a result, packages with a side solder ball contact have increased life cycle expectancies.