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138 条记录 (耗时 0.028 秒)

    Process for mounting chip type circuit elements on printed circuit boards and apparatus therefor
    51.
    发明授权
    Process for mounting chip type circuit elements on printed circuit boards and apparatus therefor 失效
    芯片型电路元件安装在印刷电路板上的工艺及其设备

    公开(公告)号：US4881319A

    公开(公告)日：1989-11-21

    申请号：US67648

    申请日：1987-06-26

    申请人： Hiroshi Yagi ,  Hisashi Fujita ,  Yoshio Harada ,  Kenichi Takahashi

    发明人： Hiroshi Yagi ,  Hisashi Fujita ,  Yoshio Harada ,  Kenichi Takahashi

    IPC分类号： H01L21/683 ,  H05K13/04 ,  H05K3/34 ,  B23P19/00

    CPC分类号： H05K13/0413 ,  Y10T29/49144 ,  Y10T29/53178

    摘要： A process for mounting chip type circuit elements on printed circuit boards and apparatus therefor are capable of eliminating the necessity for arranging an X-Y table, thereby to simplify the structure of the apparatus, and decreasing the time required to mount one circuit element on a printed circuit board. Chip type circuit elements are sucked up by a plurality of suction pins arranged in each mounting head, transferred to a centering and turning section and then progressively mounted on a printed circuit board. The mounting head is adapted to carry out the reciprocating movement in the X-direction a plurality of times while it carries out the reciprocating movement in the Y-direction one time.

    摘要翻译： 将芯片型电路元件安装在印刷电路板上的方法及其装置能够消除设置XY工作台的必要性，从而简化了装置的结构，并且减少了将一个电路元件安装在印刷电路上所需的时间 板。 芯片型电路元件由布置在每个安装头中的多个吸引针吸引，转移到定心和转动部分，然后逐渐安装在印刷电路板上。 安装头适用于在Y方向一次进行往复运动时多次进行X方向的往复运动。

    Apparatus and method for mounting circuit element on printed circuit board
    52.
    发明授权
    Apparatus and method for mounting circuit element on printed circuit board 失效
    将电路元件安装在印刷电路板上的装置和方法

    公开(公告)号：US4731923A

    公开(公告)日：1988-03-22

    申请号：US23117

    申请日：1987-03-06

    申请人： Hiroshi Yagi ,  Shuichi Tando ,  Yoshihito Oba ,  Toshihisa Nakamura

    发明人： Hiroshi Yagi ,  Shuichi Tando ,  Yoshihito Oba ,  Toshihisa Nakamura

    IPC分类号： H05K13/04 ,  H05K3/30 ,  B23P19/00

    CPC分类号： H05K13/0413 ,  Y10T29/49131 ,  Y10T29/49133 ,  Y10T29/53183

    摘要： An automatic circuit element mounting apparatus includes a lead wire detection mechanism for detecting lead wires of a circuit element held on a mounting head by suction and a substrate mark detection mechanism for detecting a mounting reference mark of a printed circuit board on which the circuit element is mounted by means of the mounting head, so that the amount of movement of the mounting head may be corrected depending on a result of detection by each of the detection mechanisms to precisely mount the circuit element on the printed circuit board. Also, a method for mounting a circuit element on a printed circuit board is disclosed.

    摘要翻译： 一种自动电路元件安装装置，包括：引线检测机构，用于检测通过抽吸保持在安装头上的电路元件的引线;以及基板标记检测机构，用于检测印刷电路板的安装基准标记，电路元件 通过安装头安装，从而可以根据每个检测机构的检测结果校正安装头的移动量，以精确地将电路元件安装在印刷电路板上。 另外，公开了一种将电路元件安装在印刷电路板上的方法。

    Device for cutting and bending lead wires
    53.
    发明授权
    Device for cutting and bending lead wires 失效
    导线切割和弯曲装置

    公开(公告)号：US4586544A

    公开(公告)日：1986-05-06

    申请号：US628834

    申请日：1984-07-09

    申请人： Hiroshi Yagi ,  Yoshio Harada ,  Tetsuro Ito

    发明人： Hiroshi Yagi ,  Yoshio Harada ,  Tetsuro Ito

    IPC分类号： B21F11/00 ,  B23D31/00 ,  H05K13/04 ,  B21F1/00

    CPC分类号： B23D31/00 ,  H05K13/0473 ,  Y10T29/515 ,  Y10T29/53183

    摘要： A device for cutting lead wires of an electronic circuit element mounted on a printed circuit board into a desired length and for bending the lead wires to be close to the bottom surface of the printed circuit board is capable of dealing with an electronic circuit element having three lead wires as well as that having two lead wires. The device comprises a fixed block having a stationary blade which has two side holes and a central hole formed therethrough, a pair of side levers having laterally movable blade members which are slidable on the surface of the stationary blade to cut and bend lead wires inserted through the side holes of the stationary blade, and a central lever having a movable blade member which are slidable on the surface of the statonary blade to cut and bend a lead wire inserted through the central hole of the stationary blade.

    摘要翻译： 用于将安装在印刷电路板上的电子电路元件的引线切割成​​期望长度并将引线弯曲成靠近印刷电路板的底表面的装置能够处理具有三个电子元件的电子电路元件 引线以及具有两根引线的引线。 该装置包括具有固定叶片的固定块，该固定叶片具有两个侧孔和由其形成的中心孔，一对侧杆具有可横向移动的叶片构件，其可在固定叶片的表面上滑动以切割和弯曲插入的导线 固定刀片的侧孔以及具有可移动刀片构件的中心杠杆，其可在状态刀片的表面上滑动，以切割和弯曲穿过固定刀片的中心孔插入的引线。

    Puncture device
    54.
    发明授权
    Puncture device 有权
    穿刺装置

    公开(公告)号：US09358335B2

    公开(公告)日：2016-06-07

    申请号：US11885046

    申请日：2006-02-16

    申请人： Satoshi Wada ,  Katsuaki Soma ,  Hiroshi Yagi

    发明人： Satoshi Wada ,  Katsuaki Soma ,  Hiroshi Yagi

    IPC分类号： A61M5/178 ,  A61M5/158 ,  A61M25/06

    CPC分类号： A61M5/158 ,  A61M25/06 ,  A61M25/0693 ,  A61M2025/0687

    摘要： A puncture device is provided that does not allow an outer needle to collapse or rise at the time of puncture and exhibits small puncture resistance.A puncture device 1 includes: a hollow outer needle 2; an outer needle hub 3 provided at a proximal end portion of the outer needle 2; a hollow inner needle 4 inserted into the outer needle 2 for use; and an inner needle hub 5 provided at a proximal end portion of the inner needle 4. The inner needle 4 includes, from the distal side, a sharp needlepoint 41, a small diameter portion 42 having an almost uniform outer diameter; an intermediate portion 43 formed as a tapered portion which is progressively increased in outer diameter as it goes toward the proximal end; and a larger diameter portion 44 having inner and outer diameters larger than inner and outer diameters, respectively, of the small diameter portion 42. If the puncture device 1 is assembled, the needlepoint 41 is most projected from the distal opening 24 of the outer needle 2 and the proximal end of the small diameter portion 42 and the distal end of the large diameter portion 4 are located inside the outer needle 2. The inner diameter of the outer needle 2 at a portion L1 where the outer needle 2 covers the small diameter portion 42 of the inner needle 4 is smaller than the large diameter portion 44 of the inner needle 4.

    摘要翻译： 提供一种刺穿装置，其不会在穿刺时使外针塌陷或上升，并且具有小的抗穿刺性。 穿刺装置1包括：中空外针2; 设置在外针2的基端部的外针座3; 插入外针2中的中空内针4使用; 以及内针座5，其设置在内针4的基端部。内针4从远端侧包括尖锐的针尖41，具有几乎均匀外径的小直径部42。 形成为锥形部分的中间部分43，其随着朝向近端而在外径上逐渐增加; 以及分别具有大于小直径部42的内径和外径的内径和外径的较大直径部44.如果组装穿刺装置1，则针尖41从外针的远端开口24最突出 小直径部分42的近端和大直径部分4的远端位于外针2的内侧。外针2在外针2覆盖小直径的部分L1处的内径 内针4的部分42比内针4的大直径部44小。

    Fluorescent lamp, luminaire and method for manufacturing fluorescent lamp
    57.
    发明授权
    Fluorescent lamp, luminaire and method for manufacturing fluorescent lamp 有权
    荧光灯，灯具和荧光灯制造方法

    公开(公告)号：US07938629B2

    公开(公告)日：2011-05-10

    申请号：US12424093

    申请日：2009-04-15

    申请人： Hiroshi Yagi ,  Yoshio Manabe ,  Tsuyoshi Terada

    发明人： Hiroshi Yagi ,  Yoshio Manabe ,  Tsuyoshi Terada

    IPC分类号： F01B37/02

    CPC分类号： H01J61/72 ,  H01J9/247 ,  H01J9/395 ,  H01J61/28

    摘要： A fluorescent lamp is configured so that a glass bulb has a phosphor film formed on its internal face, and a rare gas and an amalgam pellet are enclosed therein. The amalgam pellet contains zinc, tin, and mercury as principal components, one amalgam pellet is enclosed in the glass bulb, and the amalgam pellet has a weight of not more than 20 mg. The fluorescent lamp satisfies the relationship expressed as: 45×(1−A)≦x≦55×(1−A), 75A≦y≦85A, 45−30A≦z≦55−30A, and x+y+z≦100, where x represents a content of zinc contained in the amalgam pellet in percent by weight, y represents a content of tin therein in percent by weight, and z represents a content of mercury therein in percent by weight. This configuration allows the fluorescent lamp to be characterized in that an amount of released mercury that is necessary for the first lighting of the fluorescent lamp is secured, and that the phosphor film is less prone to being peeled due to the amalgam.

    摘要翻译： 荧光灯被配置为使得玻璃灯泡在其内表面上形成有荧光膜，并且在其中封入稀有气体和汞齐颗粒。 汞齐颗粒含有锌，锡和汞作为主要成分，一个汞齐颗粒被封闭在玻璃泡中，汞齐颗粒的重量不超过20毫克。 荧光灯满足以下关系：45×（1-A）＆nlE; x＆nlE; 55×（1-A），75A＆nlE; y＆nlE; 85A，45-30A和n1E; z和nlE; 55-30A，以及x + y + z＆ ; 100，其中x表示汞齐颗粒中含有的以重量％计含量的锌，y表示其中以重量％计含有的锡含量，z表示其中以重量％计含有的汞含量。 这种结构允许荧光灯的特征在于，确保荧光灯的第一次点亮所需的释放汞量，并且荧光膜不太可能由于汞齐而被剥离。

    FLUORESCENT LAMP
    58.
    发明申请
    FLUORESCENT LAMP 审中-公开
    日光灯

    公开(公告)号：US20110037378A1

    公开(公告)日：2011-02-17

    申请号：US12989386

    申请日：2009-04-23

    申请人： Hiroshi Yagi ,  masanorl Shimizu ,  Toru Higashi ,  Yuki Kobayashi

    发明人： Hiroshi Yagi ,  masanorl Shimizu ,  Toru Higashi ,  Yuki Kobayashi

    IPC分类号： H01J1/62

    CPC分类号： H01J61/44 ,  A61N5/0618 ,  A61N2005/0642 ,  A61N2005/0654 ,  A61N2005/0662

    摘要： Fluorescent lamp 100 has a light color with a correlated color temperature higher than 10000 [K] and lower than 17000 [K] and Duv in a range of −2.5 to 5, comprising arc tube 10 and phosphor layer 20 which includes at least: a red emitting rare-earth phosphor with a main emission peak (11) in 605-625 [nm]; a green emitting rare-earth phosphor with a main emission peak (12) in 540-550 [nm]; and a blue emitting rare-earth phosphor with a main emission peak (13) in 440-460 [nm], an action function efficiency of melatonin suppression for per unit luminous flux is higher than 1.0, and a general color rendering index Ra is 80 or higher. With the stated structure, the fluorescent lamp 100 suppresses melatonin secretion thereby achieving effects of adjusting biological rhythms and promoting wakefulness of living bodies, and also remedies the shortcomings in color rendering characteristics of the light source.

    摘要翻译： 荧光灯100具有高于10000 [K]且低于17000 [K]的相关色温和-2.5〜5范围内的Duv的浅色，包括发光管10和荧光体层20，其至少包括： 在605-625 [nm]处具有主发射峰（11）的红色发射稀土荧光粉; 在540-550 [nm]处具有主发射峰（12）的绿色发射稀土荧光体; 和主发射峰（13）在440-460 [nm]的蓝色发射稀土荧光体，每单位光通量的褪黑素抑制的作用函数效率高于1.0，一般显色指数Ra为80 或更高。 利用所述结构，荧光灯100抑制褪黑素分泌，从而实现调节生物节奏和促进生物体的觉醒的效果，并且还补救了光源的显色特性的缺点。