公开(公告)号：US20090105651A1

公开(公告)日：2009-04-23

申请号：US11885046

申请日：2006-02-16

申请人： Satoshi Wada ,  Katsuaki Soma ,  Hiroshi Yagi

发明人： Satoshi Wada ,  Katsuaki Soma ,  Hiroshi Yagi

IPC分类号： A61B17/34

CPC分类号： A61M5/158 ,  A61M25/06 ,  A61M25/0693 ,  A61M2025/0687

摘要： A puncture device is provided that does not allow an outer needle to collapse or rise at the time of puncture and exhibits small puncture resistance.A puncture device 1 includes: a hollow outer needle 2; an outer needle hub 3 provided at a proximal end portion of the outer needle 2; a hollow inner needle 4 inserted into the outer needle 2 for use; and an inner needle hub 5 provided at a proximal end portion of the inner needle 4. The inner needle 4 includes, from the distal side, a sharp needlepoint 41, a small diameter portion 42 having an almost uniform outer diameter; an intermediate portion 43 formed as a tapered portion which is progressively increased in outer diameter as it goes toward the proximal end; and a larger diameter portion 44 having inner and outer diameters larger than inner and outer diameters, respectively, of the small diameter portion 42. If the puncture device 1 is assembled, the needlepoint 41 is most projected from the distal opening 24 of the outer needle 2 and the proximal end of the small diameter portion 42 and the distal end of the large diameter portion 4 are located inside the outer needle 2. The inner diameter of the outer needle 2 at a portion L1 where the outer needle 2 covers the small diameter portion 42 of the inner needle 4 is smaller than the large diameter portion 44 of the inner needle 4.

摘要翻译： 提供一种刺穿装置，其不会在穿刺时使外针塌陷或上升，并且具有小的抗穿刺性。 穿刺装置1包括：中空外针2; 设置在外针2的基端部的外针座3; 插入外针2中的中空内针4使用; 以及内针座5，其设置在内针4的基端部。内针4从远端侧包括尖锐的针尖41，具有几乎均匀外径的小直径部42。 形成为锥形部分的中间部分43，其随着朝向近端而在外径上逐渐增加; 以及分别具有大于小直径部42的内径和外径的内径和外径的较大直径部44.如果组装穿刺装置1，则针尖41从外针的远端开口24最突出 小直径部分42的近端和大直径部分4的远端位于外针2的内侧。外针2在外针2覆盖小直径的部分L1处的内径 内针4的部分42比内针4的大直径部44小。

公开(公告)号：US09358335B2

公开(公告)日：2016-06-07

申请号：US11885046

申请日：2006-02-16

申请人： Satoshi Wada ,  Katsuaki Soma ,  Hiroshi Yagi

发明人： Satoshi Wada ,  Katsuaki Soma ,  Hiroshi Yagi

IPC分类号： A61M5/178 ,  A61M5/158 ,  A61M25/06

CPC分类号： A61M5/158 ,  A61M25/06 ,  A61M25/0693 ,  A61M2025/0687

摘要： A puncture device is provided that does not allow an outer needle to collapse or rise at the time of puncture and exhibits small puncture resistance.A puncture device 1 includes: a hollow outer needle 2; an outer needle hub 3 provided at a proximal end portion of the outer needle 2; a hollow inner needle 4 inserted into the outer needle 2 for use; and an inner needle hub 5 provided at a proximal end portion of the inner needle 4. The inner needle 4 includes, from the distal side, a sharp needlepoint 41, a small diameter portion 42 having an almost uniform outer diameter; an intermediate portion 43 formed as a tapered portion which is progressively increased in outer diameter as it goes toward the proximal end; and a larger diameter portion 44 having inner and outer diameters larger than inner and outer diameters, respectively, of the small diameter portion 42. If the puncture device 1 is assembled, the needlepoint 41 is most projected from the distal opening 24 of the outer needle 2 and the proximal end of the small diameter portion 42 and the distal end of the large diameter portion 4 are located inside the outer needle 2. The inner diameter of the outer needle 2 at a portion L1 where the outer needle 2 covers the small diameter portion 42 of the inner needle 4 is smaller than the large diameter portion 44 of the inner needle 4.

摘要翻译： 提供一种刺穿装置，其不会在穿刺时使外针塌陷或上升，并且具有小的抗穿刺性。 穿刺装置1包括：中空外针2; 设置在外针2的基端部的外针座3; 插入外针2中的中空内针4使用; 以及内针座5，其设置在内针4的基端部。内针4从远端侧包括尖锐的针尖41，具有几乎均匀外径的小直径部42。 形成为锥形部分的中间部分43，其随着朝向近端而在外径上逐渐增加; 以及分别具有大于小直径部42的内径和外径的内径和外径的较大直径部44.如果组装穿刺装置1，则针尖41从外针的远端开口24最突出 小直径部分42的近端和大直径部分4的远端位于外针2的内侧。外针2在外针2覆盖小直径的部分L1处的内径 内针4的部分42比内针4的大直径部44小。

公开(公告)号：US08481803B2

公开(公告)日：2013-07-09

申请号：US12356969

申请日：2009-01-21

申请人： Satoshi Wada ,  Shigeki Numata ,  Hiroshi Yagi

发明人： Satoshi Wada ,  Shigeki Numata ,  Hiroshi Yagi

IPC分类号： A61F5/24 ,  A61F5/28 ,  A61F13/00 ,  A61F5/00 ,  A61F15/00 ,  A61L15/00 ,  A61B17/00

CPC分类号： A61B17/135 ,  A61B17/1325 ,  A61B2017/00907 ,  A61B2017/12004 ,  A61B2090/3937

摘要： A hemostatic device includes a flexible band adapted to be wrapped around a patient's limb at a site on the limb where bleeding is to be stopped, a portion for securing the band in a wrapped state to the limb, a curved plate which is made of a material more rigid than the band and at least a portion of which is curved toward the inner peripheral side thereof, a main balloon which is provided on the inner peripheral side of the curved plate and which inflates when a fluid is introduced therein, and a pressing member which is provided between the curved plate and the main balloon so that at least a portion thereof overlaps with the balloon and which is adapted for pressing against the balloon. The device provides an excellent hemostatic effect and prevents numbness and poor circulation in areas peripheral to the site of attachment.

公开(公告)号：US07498477B2

公开(公告)日：2009-03-03

申请号：US10618964

申请日：2003-07-15

申请人： Satoshi Wada ,  Shigeki Numata ,  Hiroshi Yagi

发明人： Satoshi Wada ,  Shigeki Numata ,  Hiroshi Yagi

IPC分类号： A61F5/00 ,  A61F5/28 ,  A61F5/34 ,  A61F13/00 ,  A61L15/00 ,  A61B17/00

CPC分类号： A61B17/135 ,  A61B17/1325 ,  A61B2017/00907 ,  A61B2017/12004 ,  A61B2090/3937

摘要： A hemostatic device includes a flexible band adapted to be wrapped around a patient's limb at a site on the limb where bleeding is to be stopped, a portion for securing the band in a wrapped state to the limb, a curved plate which is made of a material more rigid than the band and at least a portion of which is curved toward the inner peripheral side thereof, a main balloon which is provided on the inner peripheral side of the curved plate and which inflates when a fluid is introduced therein, and a pressing member which is provided between the curved plate and the main balloon so that at least a portion thereof overlaps with the balloon and which is adapted for pressing against the balloon. The device provides an excellent hemostatic effect and prevents numbness and poor circulation in areas peripheral to the site of attachment.

摘要翻译： 止血装置包括柔性带，其适于围绕肢体周围的肢体缠绕，其中出血停止，用于将带固定到包裹状态的部分，弯曲板，其由 所述材料比所述带更刚性，并且其至少一部分向其内周侧弯曲;主气球，设置在所述弯曲板的内周侧，并且当流体被引入时膨胀; 构件，其设置在弯曲板和主气囊之间，使得其至少一部分与气囊重叠，并且适于压靠气球。 该装置提供优异的止血效果，并防止附着部位周围区域的麻木和不良循环。

公开(公告)号：US09044947B2

公开(公告)日：2015-06-02

申请号：US13483417

申请日：2012-05-30

申请人： Satoshi Wada ,  Hiromitsu Yamaguchi ,  Makoto Akahira

发明人： Satoshi Wada ,  Hiromitsu Yamaguchi ,  Makoto Akahira

IPC分类号： B41J29/393 ,  B41J2/155 ,  B41J2/045 ,  B41J2/21

CPC分类号： B41J2/155 ,  B41J2/04505 ,  B41J2/04541 ,  B41J2/0458 ,  B41J2/04588 ,  B41J2/04598 ,  B41J2/2132 ,  B41J29/393 ,  B41J2202/20

摘要： An object of the present invention is to provide an ink jet printing apparatus which can prevent possible stripe-like density unevenness in a joint in a print head constructed by joining a plurality of chips together even if the print head is inclined to the regular position of the print head. The present invention uses a print head having the nozzle arrays being shifted in a direction in which the nozzles are arranged, so as to have overlapping portions in a direction orthogonal to the nozzle arranging direction. The present invention controls an ink ejecting operation of the nozzles in the overlapping portions between the plurality of nozzle arrays on the basis of an angle between the nozzle array arranging direction and a direction orthogonal to the direction in which the print head moves relative to the print medium.

摘要翻译： 本发明的目的是提供一种喷墨打印设备，其可以防止在通过将多个芯片接合在一起而构成的打印头中的接头中可能的条纹状浓度不均匀，即使打印头倾斜到 打印头。 本发明使用具有沿着喷嘴排列方向移动的喷嘴列的打印头，以便在与喷嘴布置方向正交的方向上具有重叠部分。 本发明基于喷嘴阵列排列方向与与打印头相对于打印头移动的方向正交的方向之间的角度来控制喷嘴在多个喷嘴阵列之间的重叠部分中的喷墨操作 中。

公开(公告)号：US20130063024A1

公开(公告)日：2013-03-14

申请号：US13607319

申请日：2012-09-07

申请人： Satoshi Wada ,  Miki Moriyama

发明人： Satoshi Wada ,  Miki Moriyama

IPC分类号： H05B33/12 ,  H01J9/00

CPC分类号： H01L33/58 ,  H01L25/0753 ,  H01L33/501 ,  H01L33/56 ,  H01L33/60 ,  H01L2224/16225 ,  H01L2924/181 ,  H01L2933/005 ,  H01L2924/00012

摘要： The present invention provides a glass-sealed LED lamp which includes a mounting substrate, an LED chip mounted on the mounting substrate, a glass sealing body, and a glass bonding portion bonding the LED chip to a portion of a lower surface side of the glass sealing body. A clearance between a lower surface of the glass sealing body and an upper surface of the mounting substrate side, which causes total reflection at an interface between the glass sealing body and the clearance, is formed outward of the portion of the lower surface side of the glass sealing body.

摘要翻译： 本发明提供一种玻璃密封LED灯，其包括安装基板，安装在安装基板上的LED芯片，玻璃密封体和将LED芯片接合到玻璃的下表面侧的一部分的玻璃接合部 密封体。 玻璃密封体的下表面与安装基板侧的上表面之间的间隙在玻璃密封体与间隙之间的界面处形成全反射，形成在该玻璃密封体的下表面侧的部分的外侧 玻璃密封体。

公开(公告)号：US20120171789A1

公开(公告)日：2012-07-05

申请号：US13419093

申请日：2012-03-13

申请人： Yoshinobu Suehiro ,  Mitsuhiro Inoue ,  Hideaki Kato ,  Kunihiro Hadame ,  Ryoichi Tohmon ,  Satoshi Wada ,  Koichi Ota ,  Kazuya Aida ,  Hiroki Watanabe ,  Yoshinori Yamamoto ,  Masaaki Ohtsuka ,  Naruhito Sawanobori

发明人： Yoshinobu Suehiro ,  Mitsuhiro Inoue ,  Hideaki Kato ,  Kunihiro Hadame ,  Ryoichi Tohmon ,  Satoshi Wada ,  Koichi Ota ,  Kazuya Aida ,  Hiroki Watanabe ,  Yoshinori Yamamoto ,  Masaaki Ohtsuka ,  Naruhito Sawanobori

IPC分类号： H01L33/52 ,  H01L33/64

CPC分类号： H01L33/56 ,  C03B23/20 ,  C03C8/24 ,  C03C27/06 ,  H01L24/17 ,  H01L24/45 ,  H01L24/73 ,  H01L2224/14 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48237 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/48465 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/92125 ,  H01L2224/97 ,  H01L2924/01057 ,  H01L2924/01322 ,  H01L2924/12035 ,  H01L2924/12036 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2933/005 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： A method of making a solid element device that includes a solid element, an element mount part on which the solid element is mounted and which has a thermal conductivity of not less than 100 W/mK, an external terminal provided separately from the element mount part and electrically connected to the solid element, and a glass sealing part directly contacting and covering the solid element for sealing the solid element, includes pressing a glass material at a temperature higher than a yield point of the glass material for forming the glass sealing part.

摘要翻译： 一种固体元件装置的制造方法，该固体元件装置包括固体元件，安装有固体元件的元件安装部件，其导热率不小于100W / mK，与元件安装部件分开设置的外部端子 并且与固体元件电连接，并且直接接触和覆盖固体元件以密封固体元件的玻璃密封部件包括在玻璃材料的高于用于形成玻璃密封部分的玻璃材料的屈服点的温度下挤压玻璃材料。

公开(公告)号：US08210638B2

公开(公告)日：2012-07-03

申请号：US12024628

申请日：2008-02-01

申请人： Satoshi Wada ,  Hiromitsu Yamaguchi ,  Makoto Akahira

发明人： Satoshi Wada ,  Hiromitsu Yamaguchi ,  Makoto Akahira

IPC分类号： B41J29/393

CPC分类号： B41J2/155 ,  B41J2/04505 ,  B41J2/04541 ,  B41J2/0458 ,  B41J2/04588 ,  B41J2/04598 ,  B41J2/2132 ,  B41J29/393 ,  B41J2202/20

摘要： An object of the present invention is to provide an ink jet printing apparatus which can prevent possible stripe-like density unevenness in a joint in a print head constructed by joining a plurality of chips together even if the print head is inclined to the regular position of the print head. The present invention uses a print head having the nozzle arrays being shifted in a direction in which the nozzles are arranged, so as to have overlapping portions in a direction orthogonal to the nozzle arranging direction. The present invention controls an ink ejecting operation of the nozzles in the overlapping portions between the plurality of nozzle arrays on the basis of an angle between the nozzle array arranging direction and a direction orthogonal to the direction in which the print head moves relative to the print medium.

摘要翻译： 本发明的目的是提供一种喷墨打印设备，其可以防止在通过将多个芯片接合在一起而构成的打印头中的接头中可能的条纹状浓度不均匀，即使打印头倾斜到 打印头。 本发明使用具有沿着喷嘴排列方向移动的喷嘴列的打印头，以便在与喷嘴布置方向正交的方向上具有重叠部分。 本发明基于喷嘴阵列排列方向与与打印头相对于打印头移动的方向正交的方向之间的角度来控制喷嘴在多个喷嘴阵列之间的重叠部分中的喷墨操作 中。

公开(公告)号：US08154047B2

公开(公告)日：2012-04-10

申请号：US12923788

申请日：2010-10-07

申请人： Yoshinobu Suehiro ,  Mitsuhiro Inoue ,  Hideaki Kato ,  Kunihiro Hadame ,  Ryoichi Tohmon ,  Satoshi Wada ,  Koichi Ota ,  Kazuya Aida ,  Hiroki Watanabe ,  Yoshinori Yamamoto ,  Masaaki Ohtsuka ,  Naruhito Sawanobori

发明人： Yoshinobu Suehiro ,  Mitsuhiro Inoue ,  Hideaki Kato ,  Kunihiro Hadame ,  Ryoichi Tohmon ,  Satoshi Wada ,  Koichi Ota ,  Kazuya Aida ,  Hiroki Watanabe ,  Yoshinori Yamamoto ,  Masaaki Ohtsuka ,  Naruhito Sawanobori

IPC分类号： H01L33/56

CPC分类号： H01L33/56 ,  C03B23/20 ,  C03C8/24 ,  C03C27/06 ,  H01L24/17 ,  H01L24/45 ,  H01L24/73 ,  H01L2224/14 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48237 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/48465 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/92125 ,  H01L2224/97 ,  H01L2924/01057 ,  H01L2924/01322 ,  H01L2924/12035 ,  H01L2924/12036 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2933/005 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： A solid element device includes a solid element, an electric power receiving and supplying part for receiving electric power from and supplying the electric power to the solid element, and an inorganic sealing material for sealing the solid element. The inorganic sealing material includes a low melting glass selected from SiO2—Nb2O5-based, B2O3—F-based, P2O5—F-based, P2O5—ZnO-based, SiO2—B2O3—La2O3-based, and SiO2—B2O3-based low melting glasses.

摘要翻译： 固体元件装置包括固体元件，用于从固体元件接收电力并向其提供电力的电力接收和供应部件，以及用于密封固体元件的无机密封材料。 无机密封材料包括选自SiO 2-Nb 2 O 5系，B 2 O 3 -F系，P 2 O 5 -F系，P 2 O 5·ZnO系，SiO2-B2O3-La2O3系，SiO2-B2O3系低 熔化眼镜。

公开(公告)号：US08034250B2

公开(公告)日：2011-10-11

申请号：US12922824

申请日：2009-03-18

申请人： Jumpei Hayashi ,  Zuyi Zhang ,  Toshihiro Ifuku ,  Satoshi Wada ,  Keisuke Yamato ,  Nobuhiro Kumada ,  Masaki Azuma ,  Hiroshi Funakubo ,  Takashi Iijima ,  Soichiro Okamura

发明人： Jumpei Hayashi ,  Zuyi Zhang ,  Toshihiro Ifuku ,  Satoshi Wada ,  Keisuke Yamato ,  Nobuhiro Kumada ,  Masaki Azuma ,  Hiroshi Funakubo ,  Takashi Iijima ,  Soichiro Okamura

IPC分类号： C04B35/00 ,  C04B35/495

CPC分类号： H01L41/187 ,  C01G23/003 ,  C01G23/006 ,  C01G29/00 ,  C01P2002/34 ,  C01P2002/76 ,  C01P2004/20 ,  C01P2004/61 ,  C01P2004/62 ,  C01P2006/42 ,  C04B35/462 ,  C04B35/4682 ,  C04B35/475 ,  C04B35/499 ,  C04B35/547 ,  C04B2235/3206 ,  C04B2235/3215 ,  C04B2235/3224 ,  C04B2235/3227 ,  C04B2235/3255 ,  C04B2235/3284 ,  C04B2235/3298

摘要： Provided is a piezoelectric material including a lead-free perovskite-type composite oxide which is excellent in piezoelectric characteristics and temperature characteristics and is represented by the general formula (1): xABO3-yA′BO3-zA″B′O3 in which A is a Bi element; A′ is a rare earth element including La; B is at least one element selected from Ti, Zn, Sn and Zr; A″ is at least one element selected from Ba, Sr and Ca; B′ is at least one element selected from divalent, trivalent, pentavalent, tetravalent, and hexavalent elements; and x is a value of 0.10 or more and 0.95 or less, y is a value of 0 or more and 0.5 or less, and z is a value of 0 or more and 0.7 or less, provided that x+y+z=1.

摘要翻译： 提供一种压电材料，其包括压电特性和温度特性优异的无铅钙钛矿型复合氧化物，并由通式（1）表示：XABO3-yA'BO3-zA“B'O3，其中A为 铋元素 A'是包括La的稀土元素; B是选自Ti，Zn，Sn和Zr中的至少一种元素; A“是选自Ba，Sr和Ca中的至少一种元素; B'是选自二价，三价，五价，四价和六价元素中的至少一种元素; x为0.10以上且0.95以下的值，y为0以上且0.5以下的范围，z为0以上且0.7以下的值，但x + y + z = 1 。