公开(公告)号：US5278140A

公开(公告)日：1994-01-11

申请号：US945760

申请日：1992-09-16

申请人： Praveen Chaudhari ,  Cheng-Chung J. Chi ,  Duane B. Dimos ,  Jochen D. Mannhart ,  Chang C. Tsuei

发明人： Praveen Chaudhari ,  Cheng-Chung J. Chi ,  Duane B. Dimos ,  Jochen D. Mannhart ,  Chang C. Tsuei

IPC分类号： B32B18/00 ,  C01G1/00 ,  C04B41/87 ,  H01B13/00 ,  H01L39/22 ,  H01L39/24 ,  B05D5/12 ,  H01B12/00

CPC分类号： H01L39/2496 ,  H01L39/225 ,  Y10S505/701 ,  Y10S505/702 ,  Y10S505/728

摘要： A method is disclosed for fabricating grain boundary junction devices, which comprises preparing a crystalline substrate containing at least one grain boundary therein, epitaxially depositing a high Tc superconducting layer on the substrate, patterning the superconducting layer to leave at least two superconducting regions on either side of the grain boundary and making electrical contacts to the superconducting regions so that bias currents can be produced across the grain boundary.

摘要翻译： 公开了一种用于制造晶界结器件的方法，其包括制备其中含有至少一个晶界的晶体衬底，在衬底上外延沉积高Tc超导层，对超导层进行构图以在两侧留下至少两个超导区 的晶界并且与超导区域电接触，使得跨晶界产生偏置电流。

公开(公告)号：US4714831A

公开(公告)日：1987-12-22

申请号：US859102

申请日：1986-05-01

申请人： Gregory J. Clark ,  Praveen Chaudhari ,  Jerome J. Cuomo ,  Margaret A. Frisch ,  James L. Speidell

发明人： Gregory J. Clark ,  Praveen Chaudhari ,  Jerome J. Cuomo ,  Margaret A. Frisch ,  James L. Speidell

IPC分类号： G21K1/087 ,  H01J37/04 ,  H01J37/05 ,  H01J49/48 ,  H01J40/04

CPC分类号： H01J37/04 ,  H01J49/488

摘要： A spherical grid for use in instrumentation comprising a rigid non-magnetic frame having a pattern of holes. Into each hole a flat wafer is placed, each wafer having etched therein holes defining the grid mesh. The frame maintains the geometric conformal shape allowing large units to be constructed.

摘要翻译： 用于仪器的球形网格，包括具有孔图案的刚性非磁性框架。 在每个孔中放置一个平坦的晶片，每个晶片在其中蚀刻有限定网格网格的孔。 框架保持几何适形形状，允许构建大型单元。

公开(公告)号：US4341942A

公开(公告)日：1982-07-27

申请号：US157628

申请日：1980-06-06

申请人： Praveen Chaudhari ,  John B. Kiessling ,  David J. Perlman ,  Eugene E. Tynan ,  Robert J. von Gutfeld

发明人： Praveen Chaudhari ,  John B. Kiessling ,  David J. Perlman ,  Eugene E. Tynan ,  Robert J. von Gutfeld

IPC分类号： B23K26/22 ,  H01L21/60 ,  H05K3/32 ,  B23K27/00

CPC分类号： H01L24/85 ,  B23K26/037 ,  B23K26/22 ,  H01L24/48 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48455 ,  H01L2224/4847 ,  H01L2224/48599 ,  H01L2224/48699 ,  H01L2224/8501 ,  H01L2224/85214 ,  H01L2224/86939 ,  H01L24/45 ,  H01L2924/00014 ,  H01L2924/01007 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01021 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01054 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/19043 ,  H01L2924/20751 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/402 ,  H05K3/328

摘要： A wire is positioned in intimate contact with a microcircuit chip above a conductor line or pad on the chip. The line is protected by a layer of passivating or insulating material deposited upon the chip. A short pulse, focussed, energy source such as a laser beam drills a hole through or on the edge of the wire, and also opens a hole drawn through the insulating material to expose the conductor line. Then energy is directed upon the portion of the wire surrounding the hole to melt metal from the wire down into the hole which coalesces with molten metal below to form an electrical and mechanical bond of the wire to the line.

摘要翻译： 导线定位成与芯片上的导线或焊盘上方的微电路芯片紧密接触。 该线被沉积在芯片上的一层钝化或绝缘材料保护。 短脉冲，聚焦的能量源（例如激光束）通过导线的边缘钻孔或打开通过绝缘材料拉出的孔以露出导线。 然后，能量指向围绕孔的线的部分，以将金属从金属丝下降到与下面的熔融金属聚结的孔中，以形成电线与线的电和机械结合。

公开(公告)号：US3949387A

公开(公告)日：1976-04-06

申请号：US284512

申请日：1972-08-29

申请人： Praveen Chaudhari ,  Jerome J. Cuomo ,  Richard J. Gambino ,  Thomas R. McGuire

发明人： Praveen Chaudhari ,  Jerome J. Cuomo ,  Richard J. Gambino ,  Thomas R. McGuire

IPC分类号： G11C11/14 ,  G11B11/10 ,  G11B11/105 ,  G11B11/11 ,  G11C13/06 ,  G11C19/08 ,  H01F10/00 ,  H01F10/12 ,  H01F10/13

CPC分类号： G11B11/11 ,  G11B11/10 ,  G11B11/10504 ,  G11B11/10515 ,  G11B11/10517 ,  G11B11/10526 ,  G11B11/10545 ,  G11B11/10591 ,  G11C13/06 ,  G11C19/0808 ,  G11C19/085 ,  G11C19/0866 ,  H01F10/13 ,  H01F10/137

摘要： A beam addressable file using as a storage medium an amorphous magnetic composition having uniaxial anisotropy. The storage medium can be prepared in thin film or bulk form or as particles in a binder. The storage medium can be comprised of a single element or a multicomponent system where at least one of the components has an unpaired spin so that the composition has a net magnetic moment. The storage comosition exists in a microcrystalline structure (i.e., it has localized atomic ordering over a distance 25-100 angstroms) and also in a substantially amorphous structure (i.e., when the composition has localized atomic ordering only over distances less than 25 angstroms). Binary and ternary compositions, either alloys or compounds, are suitable. particularly good examples are combinations of rare earth elements and transition metal elements. The magnetic properties of these amorphous magnetic compositions are easily changed during fabrication or after fabrication, and the compositions can be doped readily without adversely affecting magnetic properties. Either electron beams or light beams can be used to write information into the storage medium and optical readout is generally preferred. Curie point writing or compensation point writing is used.

摘要翻译： 使用具有单轴各向异性的非晶磁性组合物作为存储介质的光束可寻址文件。 存储介质可以以薄膜或本体形式或作为粘合剂中的颗粒制备。 存储介质可以由单个元件或多组分系统组成，其中至少一个组件具有不成对的纺丝，使得组合物具有净磁矩。 存储组合存在于微晶结构中（即，其在25-100埃的距离上具有局部原子排列），并且还存在于基本上非晶结构中（即，当组合物仅在小于25埃的距离处具有局部原子排列时）。 二元和三元组合物，合金或化合物都是合适的。 特别好的例子是稀土元素和过渡金属元素的组合。 这些非晶磁性组合物的磁性能在制造过程中或在制造之后容易改变，并且可以容易地掺杂组合物而不会不利地影响磁性能。 可以使用电子束或光束将信息写入存储介质，并且通常优选光学读出。 使用居里点写入或补偿点写入。