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公开(公告)号：US08021211B2
公开(公告)日：2011-09-20
申请号：US12105798
申请日：2008-04-18
申请人： Hung Chih Chen , Yin Yuan , Stephen Jew
发明人： Hung Chih Chen , Yin Yuan , Stephen Jew
IPC分类号： B24B7/22
CPC分类号： B24B37/30
摘要： Embodiments of the present invention generally relate to a substrate transferring system. One embodiment of the present invention provides a substrate holder comprising a pedestal plate, a basin wall extending from a top surface of the pedestal plate, wherein the basin wall has a substantially leveled top surface, the basin wall and the pedestal plate define a basin configured to retain a liquid therein, and a liquid port opening to the basin, wherein the liquid port is configured to flow a liquid to the basin and allow the liquid to overflow from the basin wall, and a top surface of the overflow liquid in the basin is configured to support a substrate without contacting the basin wall or the pedestal plate.
摘要翻译： 本发明的实施例一般涉及基板传送系统。 本发明的一个实施例提供了一种衬底保持器，其包括基座板，从基座板的顶表面延伸的盆壁，其中，所述盆壁具有基本上平整的顶表面，所述盆壁和所述基座板限定了配置 在其中保持液体，以及通向所述盆的液体口，其中所述液体端口被配置为使液体流到所述盆中并允许所述液体从所述盆壁溢出，并且所述盆中的所述溢流液体的顶表面 构造成支撑基板而不接触盆壁或基座板。
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公开(公告)号：US07988535B2
公开(公告)日：2011-08-02
申请号：US12105924
申请日：2008-04-18
摘要： The present invention generally relates to a substrate transferring system. Particularly, the present invention relates to apparatus and method to effectively remove the chemical fume, vapor and other byproducts generated during a polishing process. One embodiment of the present invention provides an apparatus for polishing a substrate comprising a platen having a polishing surface configured to polish the substrate by contacting the substrate while moving relatively to the substrate, a polishing head configured to support the substrate and position the substrate to be in contact with the polishing surface during polishing, a solution nozzle configured to dispense a polishing solution on the polishing surface, and an exhaust assembly configured to remove fume, vapor and other byproducts generated during polishing.
摘要翻译： 本发明一般涉及基片转印系统。 特别地，本发明涉及有效地除去在抛光过程中产生的化学烟雾，蒸气和其它副产物的装置和方法。 本发明的一个实施例提供了一种用于抛光衬底的装置，包括具有抛光表面的压板，所述抛光表面被配置为通过在相对于衬底移动的同时使衬底接触而抛光衬底;抛光头，其构造成支撑衬底并将衬底定位为 在抛光期间与抛光表面接触，配置成在研磨表面上分配抛光溶液的溶液喷嘴以及被配置为去除在抛光期间产生的烟雾，蒸气和其它副产物的排气组件。
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公开(公告)号：US07842158B2
公开(公告)日：2010-11-30
申请号：US11837412
申请日：2007-08-10
IPC分类号： B24B29/00
CPC分类号： B24B37/30
摘要： A carrier head for chemical mechanical polishing of a substrate includes a base and a flexible membrane extending beneath the base. The flexible membrane includes a central portion with an outer surface providing a substrate receiving surface, a perimeter portion connecting the central portion to the base, and at least one flap extending from an inner surface of the central portion. The flap divides a volume between the flexible membrane and the base into a plurality of chambers, and the flap includes a laterally extending first section and an angled second section extending beneath the first section and connecting the laterally extending first section to the central portion.
摘要翻译： 用于基板的化学机械抛光的承载头包括基部和在基部下方延伸的柔性膜。 柔性膜包括具有提供基板接收表面的外表面的中心部分，将中心部分连接到基部的周边部分和从中心部分的内表面延伸的至少一个折片。 翼片将柔性膜和基部之间的体积分成多个室，并且该翼片包括横向延伸的第一部分和在第一部分下方延伸并且将横向延伸的第一部分连接到中心部分的成角度的第二部分。
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公开(公告)号：US20090264049A1
公开(公告)日：2009-10-22
申请号：US12105924
申请日：2008-04-18
摘要： The present invention generally relates to a substrate transferring system. Particularly, the present invention relates to apparatus and method to effectively remove the chemical fume, vapor and other byproducts generated during a polishing process. One embodiment of the present invention provides an apparatus for polishing a substrate comprising a platen having a polishing surface configured to polish the substrate by contacting the substrate while moving relatively to the substrate, a polishing head configured to support the substrate and position the substrate to be in contact with the polishing surface during polishing, a solution nozzle configured to dispense a polishing solution on the polishing surface, and an exhaust assembly configured to remove fume, vapor and other byproducts generated during polishing.
摘要翻译： 本发明一般涉及基片转印系统。 特别地，本发明涉及有效地除去在抛光过程中产生的化学烟雾，蒸气和其它副产物的装置和方法。 本发明的一个实施例提供了一种用于抛光衬底的装置，包括具有抛光表面的压板，所述抛光表面被配置为通过在相对于衬底移动的同时使衬底接触而抛光衬底;抛光头，其被配置为支撑衬底并将衬底定位为 在抛光期间与抛光表面接触，配置成在研磨表面上分配抛光溶液的溶液喷嘴以及被配置为去除在抛光期间产生的烟雾，蒸气和其它副产物的排气组件。
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55.发明授权公开(公告)号：US07527271B2
公开(公告)日：2009-05-05
申请号：US11757069
申请日：2007-06-01
IPC分类号： B23B31/30
CPC分类号： H01L21/6838 , B24B37/30 , H01L21/67005 , Y10T29/5313 , Y10T279/11
摘要： The present invention relates to an apparatus and method for improving and speeding up substrate loading process. One embodiment provides a method for vacuum chucking a substrate. The method comprises venting a center chamber of a flexible membrane configured for mounting the substrate, moving the substrate such that a backside of the substrate is in full contact with the flexible membrane, and vacuuming the center chamber to vacuum chuck the backside of the substrate to the flexible membrane.
摘要翻译： 本发明涉及一种用于改善和加速基板加载过程的装置和方法。 一个实施例提供了用于真空吸附衬底的方法。 该方法包括将配置用于安装衬底的柔性膜的中心室排出，移动衬底，使得衬底的背面与柔性膜完全接触，并且抽真空中心室以将衬底的背面真空吸附到 柔性膜。
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公开(公告)号：US20090047873A1
公开(公告)日：2009-02-19
申请号：US12259708
申请日：2008-10-28
申请人： Steven M. Zuniga , Hung Chih Chen
发明人： Steven M. Zuniga , Hung Chih Chen
摘要： A retainer is used with an apparatus for polishing a substrate. The substrate has upper and lower surfaces and a lateral, substantially circular, perimeter. The apparatus has a polishing pad with an upper polishing surface for contacting and polishing the lower face of the substrate. The retainer has an inward facing retaining face for engaging and retaining the substrate against lateral movement during polishing of the substrate. The retaining face engages a substrate perimeter at more than substantially a single discrete circumferential location along the perimeter.
摘要翻译： 保持器用于抛光衬底的装置。 衬底具有上表面和下表面以及侧面，基本上圆形的周边。 该装置具有抛光垫，该抛光垫具有用于接触和抛光基底的下表面的上抛光表面。 保持器具有向内的保持面，用于在衬底的抛光期间接合和保持衬底以防止横向移动。 保持面在沿着周边的基本上一个单独的离散圆周位置处接合基底周边。
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公开(公告)号：US20090032408A1
公开(公告)日：2009-02-05
申请号：US12246834
申请日：2008-10-07
申请人： Hung Chih Chen , Rashid A. Mavliev
发明人： Hung Chih Chen , Rashid A. Mavliev
摘要： A method and apparatus for retaining electrolyte on a rotating platen using directional air flow is provided. In one embodiment, an apparatus for processing a substrate is provided. The apparatus includes a platen assembly having a surface for supporting a processing pad and disposed on a stationary base so that the platen assembly may rotate relative to the base; and an air knife coupled to the base and extended over a portion of the surface, the air knife operable to deliver a stream of air toward the pad to divert at least a portion of a fluid disposed on the pad toward a center of the pad.
摘要翻译： 提供了一种使用定向气流将电解质保持在旋转台板上的方法和装置。 在一个实施例中，提供了一种用于处理衬底的设备。 该装置包括压板组件，该压板组件具有用于支撑处理衬垫并设置在固定底座上的表面，使得压板组件可相对于底座旋转; 以及气刀，其联接到所述基座并且延伸到所述表面的一部分上，所述气刀可操作以将空气流输送到所述垫，以将设置在所述垫上的流体的至少一部分转向所述垫的中心。
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公开(公告)号：US20080268753A1
公开(公告)日：2008-10-30
申请号：US11739450
申请日：2007-04-24
IPC分类号： B24B1/00
CPC分类号： B24B37/30 , H01L21/6838
摘要： The present invention relates to a load cup configured to speed up substrate transferring to and from a carrier head and to reduce corrosion during the transferring. One embodiment of the present invention provides a non-contact substrate holder comprising a pedestal having a top surface configured to support a substrate, and at least one injection port configured to eject a high velocity liquid stream on the top surface of the pedestal, wherein the liquid stream in configured to secure the substrate on the pedestal without the substrate contacting the top surface of the pedestal.
摘要翻译： 本发明涉及一种负载杯，其被配置为加速基板向载体头转移和从载体头转移并减少转印期间的腐蚀。 本发明的一个实施例提供了一种非接触衬底保持器，其包括具有构造成支撑衬底的顶表面的基座和被配置为在基座的顶表面上喷射高速液体流的至少一个注入端口，其中， 液体流被配置成将基板固定在基座上，而基板不接触基座的顶面。
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公开(公告)号：US07331847B2
公开(公告)日：2008-02-19
申请号：US11333992
申请日：2006-01-17
申请人： Hung Chih Chen , John M. White , Shijian Li , Fred C. Redeker , Ramin Emami
发明人： Hung Chih Chen , John M. White , Shijian Li , Fred C. Redeker , Ramin Emami
CPC分类号： B24B37/30 , B24B37/12 , B24B37/32 , B24B41/007
摘要： A carrier head for chemical mechanical polishing, includes a base, a support structure attached to the base having a surface for contacting a substrate, and a retaining structure attached to the base to prevent the substrate from moving along the surface. The retaining structure and the surface define a cavity for receiving the substrate. A polishing station includes a platen, a vibration damper mounted on the platen and a substrate polishing pad mounted on the vibration damper. The vibration damper includes a material that does not rebound to its original shape when subjected to a deformation.
摘要翻译： 用于化学机械抛光的载体头包括基底，附着到具有用于接触基底的表面的基部的支撑结构以及附接到基部的保持结构，以防止基底沿着表面移动。 保持结构和表面限定用于接收基底的空腔。 抛光台包括压板，安装在压板上的振动阻尼器和安装在振动阻尼器上的衬底抛光垫。 振动阻尼器包括当经受变形时不会反弹到其原始形状的材料。
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公开(公告)号：US07198548B1
公开(公告)日：2007-04-03
申请号：US11241254
申请日：2005-09-30
申请人： Hung Chih Chen
发明人： Hung Chih Chen
IPC分类号： B24B49/00
CPC分类号： B24B41/005 , B24B37/345
摘要： A method and apparatus for chemical mechanical polishing includes a platen supports a polishing article, a robot located proximate the platen, a carrier head having a retaining ring, and a carrier heads support mechanism. The robot is configured to position a substrate on the polishing article, and the carrier heads support mechanism is configured to move the carrier head into a position that the retaining ring surrounds the substrate.
摘要翻译： 用于化学机械抛光的方法和装置包括压板支撑抛光制品，位于压板附近的机器人，具有保持环的承载头和承载头支撑机构。 机器人构造成将基板定位在抛光制品上，并且载体头支撑机构构造成将承载头移动到保持环围绕基板的位置。
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