Organic photovoltaic cell incorporating electron conducting exciton blocking layers
    51.
    发明授权
    Organic photovoltaic cell incorporating electron conducting exciton blocking layers 有权
    掺有电子传导激子阻挡层的有机光伏电池

    公开(公告)号:US08816332B2

    公开(公告)日:2014-08-26

    申请号:US13400963

    申请日:2012-02-21

    IPC分类号: H01L29/08 H01L35/24 H01L51/00

    摘要: The present disclosure relates to photosensitive optoelectronic devices including a compound blocking layer located between an acceptor material and a cathode, the compound blocking layer including: at least one electron conducting material, and at least one wide-gap electron conducting exciton blocking layer. For example, 3,4,9,10 perylenetetracarboxylic bisbenzimidazole (PTCBI) and 1,4,5,8-napthalene-tetracarboxylic-dianhydride (NTCDA) function as electron conducting and exciton blocking layers when interposed between the acceptor layer and cathode. Both materials serve as efficient electron conductors, leading to a fill factor as high as 0.70. By using an NTCDA/PTCBI compound blocking layer structure increased power conversion efficiency is achieved, compared to an analogous device using a conventional blocking layers shown to conduct electrons via damage-induced midgap states.

    摘要翻译: 本公开涉及包括位于受主材料和阴极之间的化合物阻挡层的光敏光电子器件,所述化合物阻挡层包括:至少一种电子传导材料和至少一个宽间隙电子传导激子阻挡层。 例如,当介于受体层和阴极之间时,3,4,9,10苝四羧酸双苯并咪唑(PTCBI)和1,4,5,8-四羧酸二酐(NTCDA)作为电子传导和激子阻断层发挥作用。 这两种材料都是高效的电子导体,导致高达0.70的填充因子。 与使用传统阻挡层的类似器件相比,通过使用NTCDA / PTCBI化合物阻挡层结构提高了功率转换效率,所示的传统阻挡层通过损伤诱导的中间隙状态传导电子。

    Methods of fabricating devices by low pressure cold welding
    52.
    发明授权
    Methods of fabricating devices by low pressure cold welding 有权
    低压冷焊制造装置的方法

    公开(公告)号:US08637345B2

    公开(公告)日:2014-01-28

    申请号:US13525539

    申请日:2012-06-18

    IPC分类号: H01L51/40

    摘要: Methods of transferring a metal and/or organic layer from a patterned stamp, preferably a soft, elastomeric stamp, to a substrate are provided. The patterned metal or organic layer may be used for example, in a wide range of electronic devices. The present methods are particularly suitable for nanoscale patterning of organic electronic components.

    摘要翻译: 提供了将金属和/或有机层从图案化的印模,优选软的弹性体印模转移到基底的方法。 图案化的金属或有机层可以用于例如广泛的电子器件中。 本发明的方法特别适用于有机电子元件的纳米尺度图案化。

    Concave-hemisphere-patterned organic top-light emitting device
    53.
    发明授权
    Concave-hemisphere-patterned organic top-light emitting device 有权
    凹半图案有机顶发光器件

    公开(公告)号:US08633497B2

    公开(公告)日:2014-01-21

    申请号:US12731249

    申请日:2010-03-25

    IPC分类号: H01L51/52

    摘要: A first device is provided. The first device includes an organic light emitting device, which further comprises a first electrode, a second electrode, and an organic emissive layer disposed between the first and second electrode. Preferably, the second electrode is more transparent than the first electrode. The organic emissive layer has a first portion shaped to form an indentation in the direction of the first electrode, and a second portion shaped to form a protrusion in the direction of the second electrode. The first device may include a plurality of organic light emitting devices. The indentation may have a shape that is formed from a partial sphere, a partial cylinder, a pyramid, or a pyramid with a mesa, among others. The protrusions may be formed between adjoining indentations or between an indentation and a surface parallel to the substrate.

    摘要翻译: 提供第一个设备。 第一器件包括有机发光器件,其还包括设置在第一和第二电极之间的第一电极,第二电极和有机发光层。 优选地,第二电极比第一电极更透明。 有机发光层具有成形为在第一电极的方向上形成凹陷的第一部分和形成为在第二电极的方向上形成突起的第二部分。 第一装置可以包括多个有机发光装置。 凹陷可以具有由局部球体,部分圆柱体,金字塔形或具有台面的金字塔等形成的形状。 突起可以形成在相邻的凹陷之间或者在凹陷和平行于基底的表面之间。

    Method and apparatus for depositing material using a dynamic pressure
    54.
    发明授权
    Method and apparatus for depositing material using a dynamic pressure 有权
    使用动态压力沉积材料的方法和装置

    公开(公告)号:US08535759B2

    公开(公告)日:2013-09-17

    申请号:US12823323

    申请日:2010-06-25

    IPC分类号: C23C16/00 B05D5/06

    摘要: A method of depositing organic material is provided. A carrier gas carrying organic material is ejected from a nozzle at a flow velocity that is at least 10% of the thermal velocity of the carrier gas, such that the organic material is deposited onto a substrate. In some embodiments, the dynamic pressure in a region between the nozzle and the substrate surrounding the carrier gas is at least 1 Torr, and more preferably 10 Torr, during the ejection. In some embodiments, a guard flow is provided around the carrier gas.

    摘要翻译: 提供了沉积有机材料的方法。 携带有机材料的载气以比载气的热速度的至少10%的流速从喷嘴喷出,使得有机材料沉积到基底上。 在一些实施例中,在喷射期间喷嘴和围绕载体气体的基底之间的区域中的动态压力为至少1托,更优选为10托。 在一些实施例中,围绕载气提供防护流。

    CONTINUOUS WAVE ORGANIC SEMICONDUCTOR LASERS BY TRIPLET MANAGERS
    56.
    发明申请
    CONTINUOUS WAVE ORGANIC SEMICONDUCTOR LASERS BY TRIPLET MANAGERS 审中-公开
    连续波形有机半导体激光器由TRIPLET经理

    公开(公告)号:US20130107902A1

    公开(公告)日:2013-05-02

    申请号:US13283284

    申请日:2011-10-27

    IPC分类号: H01S5/36

    CPC分类号: H01S5/36 H01S3/168 H01S5/041

    摘要: A first device is provided. The device includes an organic semiconductor laser. The organic semiconductor laser further includes an optical cavity and an organic layer disposed within the optical cavity. The organic layer includes: an organic host compound; an organic emitting compound capable of fluorescent emission; and an organic dopant compound. The organic dopant compound may also be referred to herein as a “triplet manager.” The triplet energy of the organic dopant compound is lower than or equal to the triplet energy of the organic host compound. The triplet energy of the organic dopant compound is lower or equal to than the triplet energy of the organic emitting compound. The singlet energy of the organic emitting compound is lower than the singlet energy of the organic host compound.

    摘要翻译: 提供第一个设备。 该器件包括有机半导体激光器。 有机半导体激光器还包括光腔和设置在光腔内的有机层。 有机层包括:有机主体化合物; 能够进行荧光发射的有机发光性化合物; 和有机掺杂剂化合物。 有机掺杂剂化合物在本文中也可称为“三线态管理器”。 有机掺杂剂化合物的三线态能量低于或等于有机主体化合物的三线态能量。 有机掺杂剂化合物的三重态能量低于或等于有机发光化合物的三线态能量。 有机发光化合物的单线态能量低于有机主体化合物的单线态能。

    Roll to roll fabrication of microlens arrays for low cost light outcoupling from OLEDs
    58.
    发明授权
    Roll to roll fabrication of microlens arrays for low cost light outcoupling from OLEDs 有权
    从OLED到低成本光耦合的微透镜阵列的卷对卷制造

    公开(公告)号:US08257793B2

    公开(公告)日:2012-09-04

    申请号:US12147115

    申请日:2008-06-26

    IPC分类号: B05D1/00 B05D3/00

    CPC分类号: B29D11/00365 G02B3/0031

    摘要: A patterned roller, and a method of making the patterned roller, is provided. A patterned roller may be made by first forming a first mold having a negative pattern by etching pits in a flat mold surface with an etching process. Then, a second mold is formed having a positive pattern, by pouring a first curable material into the first mold, curing the first curable material, and removing the first curable material from the first mold. Then the patterned roller having the negative pattern is formed by coating a roller with a layer of a second curable material, pre-curing the second curable material to provide a viscous but not hardened surface, and rolling the roller over the second mold to create the negative pattern in the second curable material. The second curable material is then cured. Any of the curable materials may be coated after curing, preferably with metal, to reduce sticking in subsequent steps. The patterned roller may be used to create a pattern of microlenses in a third curable material. A substrate is coated with the third curable material. The patterned roller is rolled over the third curable material to transfer the pattern to the third curable material. The third curable material may then be cured.

    摘要翻译: 提供了图案化辊,以及制造图案辊的方法。 可以通过用蚀刻工艺在平坦模具表面中蚀刻凹坑来首先形成具有负图案的第一模具来制造图案化辊。 然后,通过将第一可固化材料倒入第一模具中,固化第一可固化材料,并从第一模具中除去第一可固化材料,形成具有正图案的第二模具。 然后,具有负图案的图案辊通过用一层第二可固化材料涂覆辊来形成,预先固化第二可固化材料以提供粘性但不硬化的表面,以及将辊滚动到第二模上以产生 第二可固化材料中的负图案。 然后固化第二可固化材料。 任何可固化材料可以在固化之后,优选用金属涂覆,以减少后续步骤中的粘附。 图案化辊可用于在第三可固化材料中产生微透镜图案。 用第三可固化材料涂覆基材。 图案化辊在第三可固化材料上滚动以将图案转移到第三可固化材料。 然后可以固化第三可固化材料。

    System and Method of Forming Semiconductor Devices
    59.
    发明申请
    System and Method of Forming Semiconductor Devices 有权
    形成半导体器件的系统和方法

    公开(公告)号:US20120218719A1

    公开(公告)日:2012-08-30

    申请号:US13034776

    申请日:2011-02-25

    IPC分类号: H05K7/02 H05K13/04

    摘要: Systems and methods including bonding two or more separately formed circuit layers are provided using, for example, cold welding techniques. Processing techniques may be provided for combining inorganic and/or organic semiconductor devices in apparatus including, for example, microchips, optoelectronic devices, such as solar cells, photodetectors and organic light emitting diodes (OLEDs), and other apparatus with multi-layer circuitry. Methods of bonding preformed circuit layers may include the use of stamping and pressure bonding contacts of two or more circuit layers together. Such methods may find applicability, for example, in bonding circuitry to shaped substrates, including various rounded and irregular shapes, and may be used to combine devices with different structural properties, e.g. from different materials systems.

    摘要翻译: 使用例如冷焊技术提供包括接合两个或更多个单独形成的电路层的系统和方法。 可以提供加工技术,用于将无机和/或有机半导体器件组合在包括例如微芯片,诸如太阳能电池,光电检测器和有机发光二极管(OLED)的光电子器件的设备中,以及具有多层电路的其它设备。 键合预成型电路层的方法可以包括使用两个或多个电路层的冲压和压接触点在一起。 这种方法可以发现适用性,例如在将电路连接到成形基板上,包括各种圆形和不规则形状,并且可用于组合具有不同结构特性的装置,例如, 从不同的材料系统。