摘要:
Controlled laser texturing of a magnetic recording disk is accomplished by use of a textured test band on the disk and an analyzing laser system to provide feedback to the texturing laser. The analyzing laser system determines, from diffracted laser light, the average height of the laser-induced bumps formed in the test band by the texturing laser. The analyzing laser beam is directed to the substrate surface and overlaps a group of individual bumps formed in a repetitive pattern. A scanning linear photodector array receives light diffracted from the surface. The digitized output of the array is the angular distribution of diffracted light intensities and is used to compute the average height of the bumps in the test band. The disk is then translated radially so that the texturing laser is aligned with the region of the disk where the textured landing zone is to be placed. Then, in response to the computed value of average bump height in the test band, a correction signal or signals is output to modify one or more parameters of the texturing laser so that the texturing laser can form bumps of the correct average height in the textured landing zone.
摘要:
An angle independent optical surface inspector capable of generating a light beam, directing the light beam to a sample, and de-scanning a reflected light beam that is reflected from the sample, thereby generating a first de-scanned light beam. The de-scanning is performed at approximately one focal length of a de-scanning lens from an irradiation location where the light beam irradiates the sample. The optical inspector also capable of focusing the first de-scanned light beam, thereby generating a focused light beam, and measuring the location of the focused light beam. The measuring of the location is performed at approximately one focal length of a focusing lens from the focusing lens. The incident angle of the light beam is within ten degrees of Brewster's angle. The focusing is performed by an achromatic lens.
摘要:
A system for defect detection and photoluminescence measurement of a sample may include a radiation source configured to target radiation to the sample. The system may also include an optics assembly positioned above the sample to receive a sample radiation. The system may also include a filter module configured to receive the sample radiation collected by the optics assembly. The filter module may separate the sample radiation collected by the optics assembly into a first radiation portion and a second radiation portion. The system may also include a defect detection module configured to receive the first radiation portion from the filter module. The system may further include a photoluminescence measurement module configured to receive the second radiation portion from the filter module. The defect detection module and the photoluminescence measurement module may be configured to receive the respective first radiation portion and the second radiation portion substantially simultaneously.
摘要:
An apparatus for inspecting an edge of a substrate. A light source produces a light beam, and a two-dimensional beam deflector receives the light beam and creates a semi-annular scanning beam. A first flared parabolic surface receives the semi-annular scanning beam and directs the semi-annular scanning beam onto the edge of the substrate, thereby creating specularly reflected light from the edge of the substrate. A second flared parabolic surface receives and directs the specularly reflected light to a detector. The detector receives the directed specularly reflected light and produces signals. An analyzer analyzes the signals and detects defects at the edge of the substrate.
摘要:
An apparatus for inspecting an edge of a substrate. A light source produces a light beam, and a two-dimensional beam deflector receives the light beam and creates a semi-annular scanning beam. A first flared parabolic surface receives the semi-annular scanning beam and directs the semi-annular scanning beam onto the edge of the substrate, thereby creating specularly reflected light from the edge of the substrate. A second flared parabolic surface receives and directs the specularly reflected light to a detector. The detector receives the directed specularly reflected light and produces signals. An analyzer analyzes the signals and detects defects at the edge of the substrate.
摘要:
In one embodiment, a system to measure defects on a surface of a wafer and an edge of the wafer using a single tool comprises a scatterometer to identify at least one defect region on the surface and a surface profile height measuring tool to measure one or more characteristics of the surface in the defect region with a surface profile height measuring tool.
摘要:
In one embodiment, a system to inspect a surface comprises an assembly to direct a first radiation beam onto a surface in a first plane of incidence, a first detector to generate a first signal from a portion of the radiation reflected from the first radiation beam, a first spatial filter interposed between the surface and the first detector, a first ellipsoidal mirror to collect scattered light, a second detector to generate a second signal from the scattered portion of the beam, and a processor to generate, from the first and second signals, a data set representing one or more characteristics of the surface using the first and second signals.
摘要:
A system to detect pits in a surface comprises first and second radiation targeting assemblies to target a second radiation beam onto a surface, a first radiation collecting assembly that collects radiation scattered from the surface, a processor coupled to the first radiation collecting assembly, a memory module coupled to the processor and comprising logic instructions which, when executed by the processor, configure the processor to generate a first signal from radiation scattered from the first radiation beam, generate a second signal from radiation scattered from the second radiation beam, record the first signal and the second signal at an array of different positions on the surface, calculate a median value for the first signal and the second signal over the array of different positions on the surface, and use the first signal, the second signal, and the median value to detect pits in the surface.
摘要:
A material independent optical profilometer system and method for measuring at least one of either a height or a slope of an object such as a thin film disk, a silicon wafer, or a glass substrate is disclosed.