Abstract:
A system for defect detection and photoluminescence measurement of a sample may include a radiation source configured to target radiation to the sample. The system may also include an optics assembly positioned above the sample to receive a sample radiation. The system may also include a filter module configured to receive the sample radiation collected by the optics assembly. The filter module may separate the sample radiation collected by the optics assembly into a first radiation portion and a second radiation portion. The system may also include a defect detection module configured to receive the first radiation portion from the filter module. The system may further include a photoluminescence measurement module configured to receive the second radiation portion from the filter module. The defect detection module and the photoluminescence measurement module may be configured to receive the respective first radiation portion and the second radiation portion substantially simultaneously.
Abstract:
A system for defect detection and photoluminescence measurement of a sample may include a radiation source configured to target radiation to the sample. The system may also include an optics assembly positioned above the sample to receive a sample radiation. The system may also include a filter module configured to receive the sample radiation collected by the optics assembly. The filter module may separate the sample radiation collected by the optics assembly into a first radiation portion and a second radiation portion. The system may also include a defect detection module configured to receive the first radiation portion from the filter module. The system may further include a photoluminescence measurement module configured to receive the second radiation portion from the filter module. The defect detection module and the photoluminescence measurement module may be configured to receive the respective first radiation portion and the second radiation portion substantially simultaneously.
Abstract:
A method and apparatus to measure specular reflection intensity, specular reflection angle, near specular scattered radiation, and large angle scattered radiation and determine the location and type of defect present in a first and a second transparent solid that have abutting surfaces. The types of defects include a top surface particle, an interface particle, a bottom surface particle, an interface bubble, a top surface pit, and a stain. The four measurements are conducted at multiple locations along the surface of the transparent solid and the measured information is stored in a memory device. The difference between an event peak and a local average of measurements for each type of measurement is used to detect changes in the measurements. Information stored in the memory device is processed to generate a work piece defect mapping indicating the type of defect and the defect location of each defect found.
Abstract:
An optical inspector includes a radiating source, a time varying beam reflector, a telecentric scan lens, a first and second lens, a field stop, and a detector. The radiating source irradiates a first position of on the time varying beam reflector with a source beam. The time varying beam reflector directs the source beam to the telecentric scan lens, which in turn directs the source beam to a sample. The first lens focuses scattered radiation from the sample to generate multiple scan lines at a first focal plane. The field stop is positioned at the first focal plane to block one or more scan lines at the first focal plane. The scan line not blocked by the field stop propagates to the second lens. The second lens de-scans the scan line and generates a point of scattered radiation at a second focal plane where the detector input is located.
Abstract:
An apparatus for detecting top scattered light from a substrate. A source directs a light onto a position on the substrate. The light thereby reflects off in a specular beam, scatters off the top surface, and scatters off a bottom surface of the substrate. An objective receives the top and bottom scattered light. The objective has a first focal point focused on the position on the top surface of the substrate, and a second focal point focused on a pinhole field stop. The pinhole field stop passes the top scattered light that is focused on the pinhole field stop, and blocks the bottom scattered light. A sensor receives and quantifies the top scattered light.
Abstract:
In one embodiment, a surface scanning system comprises a radiation directing assembly that scans a surface using a Cartesian scanning pattern; and a radiation collecting assembly that collects radiation reflected from the surface. A scattered radiation collection system is included that measures the scattered light from the surface.
Abstract:
Scratches, pits and particles which are smaller or larger than the beam size may be measured and identified by single and multiple beam techniques. In one embodiment, the invention uses a pair of orthogonally oriented laser beams, one in the radial and one in the circumferential direction. In another embodiment, two pairs of orthogonally oriented laser beams are used. The scattered light from radial and circumferential beams allows the detection and classification of particles, pits and scratches. In other embodiments, single beam techniques are used to classify radial and circumferential defects.
Abstract:
A system and method for measuring a phase difference between first and second reflected polarized light signal components, including transmitting a first incident light signal toward a first object, wherein the first object is a magnetic disk and/or a glass substrate. Seperating from a reflected light signal, a first mixed reflected polarized light signal component having a first phase and a second mixed reflected polarized light signal component having a second phase that is different from said first phase, wherein said mixed reflected polarized light signal components comprises both P-polarized and S-polarized light relative to a plane of incidence of said reflected light signal. Detecting the intensities of said first and second mixed reflected polarized light signal components, and determining a difference in phase between said first and second mixed reflected polarized light signal component based upon said first and second intensities.
Abstract:
A method is provided for automatically focusing a light signal on a surface of a substrate. The method is independent of the substrate material and is effective for both opaque and transparent substrates. A method is also provided for calibrating a system to allow for automatic focusing of a light signal.