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51.发明授权公开(公告)号：US10991641B2
公开(公告)日：2021-04-27
申请号：US16867352
申请日：2020-05-05
Applicant: Texas Instruments Incorporated
Inventor： Benjamin Michael Sutton , Sreenivasan K Koduri , Subhashish Mukherjee
IPC: H01L23/495 , H01L23/522
Abstract: A coupling device provides galvanic isolation using a leadframe that is configured to support two integrated circuit chips in a coplanar manner. Each chip contains an inductive coupling coil. The lead frame includes a set of bond pads for attaching bond wires to couple to the two integrated circuit chips. Two separated die attach pads support the two chips. Each die attach pad is configured to support one of the two integrated circuit chips with a plurality of cantilevered fingers.
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公开(公告)号：US10819396B2
公开(公告)日：2020-10-27
申请号：US16773615
申请日：2020-01-27
Applicant: TEXAS INSTRUMENTS INCORPORATED
Inventor： Subhashish Mukherjee , Venugopal Gopinathan
Abstract: In described examples, a first die includes a primary LC tank oscillator having a natural frequency of oscillation to induce a forced oscillation in a secondary LC tank oscillator of a separate second die via a magnetic coupling between the primary LC tank oscillator and the secondary LC tank oscillator.
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公开(公告)号：US10804845B2
公开(公告)日：2020-10-13
申请号：US16601081
申请日：2019-10-14
Applicant: TEXAS INSTRUMENTS INCORPORATED
Abstract: For communication across a capacitively coupled channel, an example circuit includes a first plate substantially parallel to a substrate, forming a first capacitance intermediate the first plate and the substrate. A second plate is substantially parallel to the substrate and the first plate, the first plate intermediate the substrate and the second plate. A third plate is substantially parallel to the substrate, forming a second capacitance intermediate the third plate and the substrate. A fourth plate is substantially parallel to the substrate and the third plate, the third plate intermediate the substrate and the fourth plate. An inductor is connected to the first plate and the third plate, the inductor to, in combination with the first capacitance and the second capacitance, form an LC amplifier.
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公开(公告)号：US10720946B2
公开(公告)日：2020-07-21
申请号：US16361806
申请日：2019-03-22
Applicant: TEXAS INSTRUMENTS INCORPORATED
Inventor： Jagdish Chand , Subhashish Mukherjee
Abstract: A radio frequency transmitter includes a digital-to-analog converter (DAC), a load circuit, and a modulator circuit. The load circuit is coupled to an output of the DAC. The modulator circuit is coupled to the DAC and the load circuit. The modulator circuit includes a driver circuit configured to provide a bias voltage to the load circuit, and an amplifier configured to receive an output of the DAC biased by an output of the load circuit.
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公开(公告)号：US20200162130A1
公开(公告)日：2020-05-21
申请号：US16773615
申请日：2020-01-27
Applicant: TEXAS INSTRUMENTS INCORPORATED
Inventor： Subhashish Mukherjee , Venugopal Gopinathan
Abstract: In described examples, a first die includes a primary LC tank oscillator having a natural frequency of oscillation to induce a forced oscillation in a secondary LC tank oscillator of a separate second die via a magnetic coupling between the primary LC tank oscillator and the secondary LC tank oscillator.
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Patent Agency Ranking
公开(公告)号：US20200161184A1
公开(公告)日：2020-05-21
申请号：US16773692
申请日：2020-01-27
Applicant: TEXAS INSTRUMENTS INCORPORATED
Inventor： Subhashish Mukherjee , Raja Selvaraj , Venugopal Gopinathan
Abstract: An example integrated circuit die includes: lower level conductor layers, lower level insulator layers between the lower level conductor layers, lower level vias extending vertically through the lower level insulator layers, upper level conductor layers overlying the lower level conductor layers, upper level insulator layers between and surrounding the upper level conductor layers, upper level vias; at least two scribe seals arranged to form a vertical barrier extending vertically from the semiconductor substrate to a passivation layer at an upper surface of the integrated circuit die; and at least one opening extending vertically through one of the at least two scribe seals and extending through: the upper level conductor layers, the upper level via layers, the lower level conductor layers, and the lower level via layers.
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公开(公告)号：US20180006856A1
公开(公告)日：2018-01-04
申请号：US15200706
申请日：2016-07-01
Applicant: Texas Instruments Incorporated
CPC classification number: H04L27/22 , H03D3/00 , H03K19/21 , H03L7/081 , H03L7/087 , H03L7/113 , H04L7/0087 , H04L7/0331 , H04L27/2271
Abstract: Methods and apparatus for performing a high speed phase demodulation scheme using a low bandwidth phase-lock loop are disclosed. An example apparatus includes a low bandwidth phase lock loop to lock to a data signal at a first phase, the data signal capable of oscillating at the first phase or a second phase; and output a first output signal at the first phase and a second output signal at the second phase, the first output signal or the second output signal being utilized in a feedback loop of the low bandwidth phase lock loop. The example apparatus further includes a fast phase change detection circuit coupled to the low bandwidth phase lock loop to determine whether the data signal is oscillating at the first phase or the second phase; when the data signal is oscillating at the first phase, output a first logic value; and when the data signal is oscillating at the second phase, output a second logic value, the output of the fast phase change detection circuit being used to determine whether the first output signal or the second output signal will be utilized in the feedback loop of the low bandwidth phase lock loop.
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公开(公告)号：US20170180015A1
公开(公告)日：2017-06-22
申请号：US15454797
申请日：2017-03-09
Applicant: TEXAS INSTRUMENTS INCORPORATED
Inventor： Subhashish Mukherjee , Venugopal Gopinathan
CPC classification number: H04B5/0093 , H01L23/645 , H01L23/66 , H01L2223/6677 , H03B5/08 , H04B5/0075
Abstract: In described examples, a first die includes a primary LC tank oscillator having a natural frequency of oscillation to induce a forced oscillation in a secondary LC tank oscillator of a separate second die via a magnetic coupling between the primary LC tank oscillator and the secondary LC tank oscillator.
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公开(公告)号：US09596008B2
公开(公告)日：2017-03-14
申请号：US15244929
申请日：2016-08-23
Applicant: TEXAS INSTRUMENTS INCORPORATED
Inventor： Subhashish Mukherjee , Venugopal Gopinathan
CPC classification number: H04B5/0093 , H01L23/645 , H01L23/66 , H01L2223/6677 , H03B5/08 , H04B5/0075
Abstract: In apparatus for die-to-die communication, a first die includes at least a first circuit, and a second die includes at least a second circuit. The first die is separated by a fixed distance from the second die. In response to a signal, the first circuit is configured to induce a current in the second circuit via a magnetic coupling between the first circuit and the second circuit.
Abstract translation: 在管芯到管芯通信的装置中，第一管芯至少包括第一电路，第二管芯至少包括第二电路。 第一模具与第二模具分开一定距离。 响应于信号，第一电路被配置为通过第一电路和第二电路之间的磁耦合在第二电路中感应电流。
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公开(公告)号：US20160359528A1
公开(公告)日：2016-12-08
申请号：US15244929
申请日：2016-08-23
Applicant: TEXAS INSTRUMENTS INCORPORATED
Inventor： Subhashish Mukherjee , Venugopal Gopinathan
CPC classification number: H04B5/0093 , H01L23/645 , H01L23/66 , H01L2223/6677 , H03B5/08 , H04B5/0075
Abstract: In apparatus for die-to-die communication, a first die includes at least a first circuit, and a second die includes at least a second circuit. The first die is separated by a fixed distance from the second die. In response to a signal, the first circuit is configured to induce a current in the second circuit via a magnetic coupling between the first circuit and the second circuit.
Abstract translation: 在管芯到管芯通信的装置中，第一管芯至少包括第一电路，第二管芯至少包括第二电路。 第一模具与第二模具分开一定距离。 响应于信号，第一电路被配置为通过第一电路和第二电路之间的磁耦合在第二电路中感应电流。
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