公开(公告)号：US08149512B2

公开(公告)日：2012-04-03

申请号：US12557118

申请日：2009-09-10

申请人： Woon-bae Kim ,  Kyu-dong Jung ,  Seung-wan Lee

发明人： Woon-bae Kim ,  Kyu-dong Jung ,  Seung-wan Lee

IPC分类号： G02B1/06 ,  G02B26/02 ,  G02F1/07

CPC分类号： B29D11/0074 ,  G02B3/14 ,  G02B5/005 ,  G02B26/004

摘要： Micro-shutter device applicable to display devices including a flexible display device and method of manufacturing same are provided. Micro-shutter device includes membrane. Frame including receiving hole in its center portion is bonded to membrane. Transparent substrate is bonded to frame to encapsulate optical fluid received in receiving hole. Actuator varies refractive power produced by change in curvature of fluid lens formed in the center portion of the receiving hole due to bending of a periphery of the fluid lens. A reflector is disposed to correspond to the fluid lens and be spaced apart from the membrane, such that light intensity transferred to a user is adjusted depending on the refractive power produced by a change in curvature of the fluid lens. Therefore, the device has improved optical efficiency compared to using liquid crystal and a polarizing film, and can have a flexible structure for application to a flexible display device.

摘要翻译： 提供了适用于包括柔性显示装置的显示装置及其制造方法的微快门装置。 微快门装置包括膜。 在其中心部分包​​括接收孔的框架粘合到膜上。 透明基板粘合到框架上以封装容纳在接收孔中的光学流体。 致动器改变由于流体透镜的周边弯曲而在接收孔的中心部分形成的流体透镜的曲率变化产生的屈光力。 反射器设置成对应于流体透镜并且与膜间隔开，使得根据由流体透镜的曲率变化产生的屈光力来调节传递给使用者的光强度。 因此，与使用液晶和偏振膜相比，该装置具有改善的光学效率，并且可以具有用于柔性显示装置的柔性结构。

公开(公告)号：US08045318B2

公开(公告)日：2011-10-25

申请号：US12652948

申请日：2010-01-06

申请人： Seung-tae Choi ,  Ji-hyuk Lim ,  Woon-bae Kim ,  Eun-seok Park ,  Jeong-yub Lee

发明人： Seung-tae Choi ,  Ji-hyuk Lim ,  Woon-bae Kim ,  Eun-seok Park ,  Jeong-yub Lee

IPC分类号： H01G5/00

CPC分类号： H01G5/0132

摘要： A tunable capacitor using an electrowetting phenomenon includes a first electrode; a second electrode which is spaced apart from the first electrode and faces the first electrode; a fluidic channel which is disposed between the first electrode and the second electrode; a first insulating layer which is disposed between the first electrode and the fluidic channel; and a conductive fluid which is disposed in the fluidic channel and moves along the fluidic channel when a direct current (DC) potential difference occurs between the first and second electrodes. Accordingly, it is possible to fabricate the tunable capacitor with the simplified fabrication process, good reliability and durability, and no restriction on the tuning range.

摘要翻译： 使用电润湿现象的可调谐电容器包括第一电极; 第二电极，与第一电极间隔开并面向第一电极; 设置在第一电极和第二电极之间的流体通道; 布置在第一电极和流体通道之间的第一绝缘层; 以及当在第一和第二电极之间发生直流（DC）电位差时，布置在流体通道中并沿着流体通道移动的导电流体。 因此，可以以简化的制造工艺，良好的可靠性和耐久性制造可调电容器，并且对调谐范围没有限制。

公开(公告)号：US07626258B2

公开(公告)日：2009-12-01

申请号：US11657056

申请日：2007-01-24

申请人： Ji-hyuk Lim ,  Jun-sik Hwang ,  Woon-bae Kim

发明人： Ji-hyuk Lim ,  Jun-sik Hwang ,  Woon-bae Kim

IPC分类号： H01L23/12 ,  H01L23/42

CPC分类号： B81B7/007 ,  B81B2207/095

摘要： A cap wafer, fabrication method, and a semiconductor chip are provided. The cap wafer includes a cap wafer substrate; a penetrated electrode formed to penetrate the cap wafer substrate; and an electrode pad connected with a lower portion of the penetrated electrode on a lower surface of the cap wafer substrate, wherein the penetrated electrode has an oblique section which gradually widens from an upper surface to the lower surface of the cap wafer substrate. The fabrication method includes forming an oblique-via hole on a lower surface of a cap wafer substrate, the oblique-via hole having an oblique section which gradually narrows in a direction moving away from the lower surface of the cap wafer substrate; and forming a penetrated electrode in the oblique-via hole. The semiconductor chip includes a base wafer; a cap wafer; a cavity; a penetrated electrode; and a pad bonding layer.

摘要翻译： 提供盖晶片，制造方法和半导体芯片。 盖晶片包括盖晶片基板; 形成为穿透盖晶片基板的穿透电极; 以及在所述盖片基板的下表面与所述被穿透电极的下部连接的电极焊盘，其中，所述被穿透电极具有从所述盖晶片基板的上表面向下表面逐渐变宽的倾斜部。 该制造方法包括在盖晶片基板的下表面上形成倾斜通孔，该倾斜通孔具有在从盖晶片基板的下表面移开的方向上逐渐变窄的倾斜截面; 并且在所述倾斜通孔中形成穿透电极。 半导体芯片包括基底晶片; 盖晶片; 一个空腔 穿透电极; 和焊垫接合层。

公开(公告)号：US20090166511A1

公开(公告)日：2009-07-02

申请号：US12185910

申请日：2008-08-05

申请人： Jong-oh KWON ,  Yoon-chul Son ,  Kyu-dong Jung ,  Woon-bae Kim

发明人： Jong-oh KWON ,  Yoon-chul Son ,  Kyu-dong Jung ,  Woon-bae Kim

IPC分类号： G01J1/44

CPC分类号： G01J1/02 ,  G01J1/0204 ,  G01J1/0219 ,  G01J1/0271 ,  G01J1/04 ,  G01J1/0411 ,  H01L27/14618 ,  H01L27/14625 ,  H01L2924/0002 ,  H04N5/2253 ,  H04N5/2254 ,  H04N5/2257 ,  H01L2924/00

摘要： An image sensor module capable of facilitating an electrical and mechanical connection of an electric component and a fabrication thereof are disclosed. The image sensor module includes a sensor chip; at least one lens disposed above the sensor chip; at least one electric component disposed with respect to the at least one lens to adjust optical characteristics of the at least one lens; a housing accommodating and closing up the sensor chip, the at least one lens and the at least one electric component, and having an opening to expose the at least one lens to an outside thereof; and a wiring part longitudinally disposed on an inner surface of the housing, and including at least one conducting wire having a first connecting terminal exposed to the outside of the housing to allow the at least one conducting wire to electrically connect a terminal pad of the at least one electric component with an external electronic device and a second connecting terminal connected to the terminal pad of the at least one electric component.

摘要翻译： 公开了能够促进电气部件的电气和机械连接及其制造的图像传感器模块。 图像传感器模块包括传感器芯片; 设置在所述传感器芯片上方的至少一个透镜; 相对于所述至少一个透镜布置的至少一个电气部件，以调节所述至少一个透镜的光学特性; 容纳和封闭传感器芯片的壳体，所述至少一个透镜和所述至少一个电气部件，并且具有用于将所述至少一个透镜暴露于其外部的开口; 以及纵向设置在所述壳体的内表面上的布线部分，并且包括至少一个导线，其具有暴露于所述壳体的外部的第一连接端子，以允许所述至少一根导线电连接所述壳体的端子垫 至少一个具有外部电子设备的电气部件和连接到所述至少一个电气部件的端子焊盘的第二连接端子。

公开(公告)号：US20090115875A1

公开(公告)日：2009-05-07

申请号：US12119611

申请日：2008-05-13

申请人： Min-seog CHOI ,  Seung-wan Lee ,  Woon-bae Kim ,  Eun-sung Lee ,  Kyu-dong Jung ,  Che-heung Kim

发明人： Min-seog CHOI ,  Seung-wan Lee ,  Woon-bae Kim ,  Eun-sung Lee ,  Kyu-dong Jung ,  Che-heung Kim

IPC分类号： H04N5/335 ,  H01L31/0232

CPC分类号： H04N5/335 ,  H01L24/97 ,  H01L27/14618 ,  H01L27/14683 ,  H01L2224/16 ,  H01L2924/15788 ,  H01L2924/3511 ,  H04N5/2253 ,  H04N5/2257 ,  H04N5/3696 ,  H01L2924/00

摘要： An image sensor module having a sensor chip closely adhered on a concave surface and a fabrication method thereof are disclosed. The image sensor module includes at least one sensor chip, at least one sensor chip-mounting structure comprising a substrate and a polymer layer formed on the substrate, the polymer layer having an concave surface formed on an upper part thereof by a polymer molding method, so that the sensor chip is bent and bonded on the concave surface, and at least one lens fixed on the at least one sensor chip-mounting structure above the sensor chip.

摘要翻译： 公开了一种具有密封在凹面上的传感器芯片的图像传感器模块及其制造方法。 图像传感器模块包括至少一个传感器芯片，至少一个传感器芯片安装结构，包括基板和形成在基板上的聚合物层，所述聚合物层通过聚合物模塑法在其上部形成有凹形表面， 使得传感器芯片弯曲并接合在凹面上，以及固定在传感器芯片上方的至少一个传感器芯片安装结构上的至少一个透镜。

公开(公告)号：US07452809B2

公开(公告)日：2008-11-18

申请号：US11240771

申请日：2005-10-03

申请人： Moon-chul Lee ,  Woon-bae Kim ,  Jun-sik Hwang ,  Chang-youl Moon

发明人： Moon-chul Lee ,  Woon-bae Kim ,  Jun-sik Hwang ,  Chang-youl Moon

IPC分类号： H01L21/44 ,  H01R43/00

CPC分类号： B81C1/00301 ,  Y10T29/49117

摘要： A fabrication method of a packaging substrate includes the steps of: forming a recess by etching a predetermined area of a lower surface of a substrate; depositing a seed layer on an upper surface of the substrate; in the recess, etching predetermined area(s) of the lower surface of the substrate and forming at least one via hole that reaches the seed layer; and plating the inside of the via hole by using the seed layer, and forming electrode(s) for electrically coupling the upper and lower parts of the substrate. First and second pads coupled to the electrode(s) may be formed on the upper and lower parts of the substrate, respectively. Thus, using the second pads as bonding materials, the packaging process becomes easier, which resultantly simplifies the fabrication process of the packaging substrate and the packaging process.

摘要翻译： 包装基板的制造方法包括以下步骤：通过蚀刻基板的下表面的预定区域来形成凹部; 在基板的上表面上沉积种子层; 在所述凹部中蚀刻所述基板的下表面的预定区域并形成到达所述籽晶层的至少一个通孔; 并且通过使用晶种层对通孔的内部进行电镀，以及形成用于电耦合衬底的上部和下部的电极。 分别连接到电极的第一和第二焊盘分别形成在衬底的上部和下部。 因此，使用第二焊盘作为粘合材料，封装过程变得更容易，从而简化了封装衬底的制造过程和封装过程。

公开(公告)号：US07442622B2

公开(公告)日：2008-10-28

申请号：US11505420

申请日：2006-08-17

申请人： Sung-gyu Kang ,  Seung-mo Lim ,  Jae-chang Lee ,  Woon-bae Kim

发明人： Sung-gyu Kang ,  Seung-mo Lim ,  Jae-chang Lee ,  Woon-bae Kim

IPC分类号： H01L21/30

CPC分类号： H01L21/187 ,  H01L21/2007

摘要： A silicon direct bonding (SDB) method by which void formation caused by gases is suppressed. The SDB method includes: preparing two silicon substrates having corresponding bonding surfaces; forming trenches having a predetermined depth in at least one bonding surface of the two silicon substrates; forming gas discharge outlets connected to the trenches on at least one of the two silicon substrates to vertically penetrate the bonding surface; cleaning the two silicon substrates; closely contacting the two silicon substrates to each other; and thermally treating the two substrates to bond them to each other. The trenches are formed along at least a part of a plurality of dicing lines, and both ends of the trenches are clogged. Gases generated during a thermal treatment process can be smoothly and easily discharged through the trenches and the gas discharge outlet such that a void is prevented from being formed in the junctions of the two silicon substrates due to the gases.

摘要翻译： 抑制由气体引起的空隙形成的硅直接接合（SDB）方法。 SDB方法包括：制备具有相应粘合表面的两个硅衬底; 在所述两个硅衬底的至少一个接合表面中形成具有预定深度的沟槽; 形成连接到所述两个硅衬底中的至少一个上的沟槽的气体放电出口，以垂直地穿透所述接合表面; 清洁两个硅衬底; 使两个硅衬底彼此紧密接触; 并对两个基板进行热处理以将它们彼此粘合。 沟槽沿着多个切割线的至少一部分形成，并且沟槽的两端被堵塞。 在热处理过程中产生的气体可以通过沟槽和气体排出口平滑且容易地排出，从而防止由于气体而在两个硅衬底的接合处形成空隙。

公开(公告)号：US20070176250A1

公开(公告)日：2007-08-02

申请号：US11447969

申请日：2006-06-07

申请人： Moon-chul Lee ,  Jun-sik Hwang ,  Ji-hyuk Lim ,  Woon-bae Kim

发明人： Moon-chul Lee ,  Jun-sik Hwang ,  Ji-hyuk Lim ,  Woon-bae Kim

IPC分类号： H01L29/84

CPC分类号： H03H9/1092 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/16195 ,  H01L2924/00014

摘要： A wafer level package for a surface acoustic wave (SAW) device and a fabrication method thereof. The SAW device wafer level package includes a SAW device in which a SAW element is formed on a top surface of a device wafer, a cap wafer which is bonded with a top surface of the SAW device and has a viahole penetrating the cap wafer, and a conductive member to fill a part of the viahole. The viahole has a first via portion and a second via portion, the first via portion has a gradually smaller diameter from a bottom surface of the cap wafer until a certain depth, and the second via portion has a gradually greater diameter from the first via portion until a top surface of the cap wafer.

摘要翻译： 一种用于表面声波（SAW）器件的晶片级封装及其制造方法。 SAW器件晶片级封装包括SAW器件，其中SAW元件形成在器件晶片的顶表面上，盖晶片与SAW器件的顶表面结合并具有穿透盖晶片的通孔，以及 用于填充通孔的一部分的导电构件。 通孔具有第一通孔部分和第二通孔部分，第一通孔部分具有从盖子晶片的底表面到一定深度的逐渐变小的直径，并且第二通孔部分具有从第一通孔部分 直到盖晶片的顶表面。

公开(公告)号：US20060094158A1

公开(公告)日：2006-05-04

申请号：US11240771

申请日：2005-10-03

申请人： Moon-chul Lee ,  Woon-bae Kim ,  Jun-sik Hwang ,  Chang-youl Moon

发明人： Moon-chul Lee ,  Woon-bae Kim ,  Jun-sik Hwang ,  Chang-youl Moon

IPC分类号： H01L21/50

CPC分类号： B81C1/00301 ,  Y10T29/49117

摘要： A fabrication method of a packaging substrate includes the steps of: forming a recess by etching a predetermined area of a lower surface of a substrate; depositing a seed layer on an upper surface of the substrate; in the recess, etching predetermined area(s) of the lower surface of the substrate and forming at least one via hole that reaches the seed layer; and plating the inside of the via hole by using the seed layer, and forming electrode(s) for electrically coupling the upper and lower parts of the substrate. First and second pads coupled to the electrode(s) may be formed on the upper and lower parts of the substrate, respectively. Thus, using the second pads as bonding materials, the packaging process becomes easier, which resultantly simplifies the fabrication process of the packaging substrate and the packaging process.

摘要翻译： 包装基板的制造方法包括以下步骤：通过蚀刻基板的下表面的预定区域来形成凹部; 在基板的上表面上沉积种子层; 在所述凹部中蚀刻所述基板的下表面的预定区域并形成到达所述籽晶层的至少一个通孔; 并且通过使用晶种层对通孔的内部进行电镀，以及形成用于电耦合衬底的上部和下部的电极。 分别连接到电极的第一和第二焊盘分别形成在衬底的上部和下部。 因此，使用第二焊盘作为粘合材料，封装过程变得更容易，从而简化了封装衬底的制造过程和封装过程。

公开(公告)号：US06633513B1

公开(公告)日：2003-10-14

申请号：US09599500

申请日：2000-06-23

申请人： Woon-bae Kim ,  Byoung-chan Lee ,  Hyung-gae Shin ,  Cheol-sung Yeon ,  Sang-hun Lee ,  Jong-woo Shin

发明人： Woon-bae Kim ,  Byoung-chan Lee ,  Hyung-gae Shin ,  Cheol-sung Yeon ,  Sang-hun Lee ,  Jong-woo Shin

IPC分类号： G11B1100

CPC分类号： G11B7/1387 ,  G11B5/17 ,  G11B5/313 ,  G11B11/10534 ,  G11B11/10554 ,  G11B11/1058 ,  G11B2007/13725

摘要： A magneto-optical head for magneto-optical writing and reading systems having an improved construction for a field modulating coil and a miniature objective lens, and a method of manufacturing the magneto-optical head. The magneto-optical head is mounted at the end of a slide-arm movable over a magneto-optical recording medium by hydrodynamics and includes: a lens mounted at the end of the slide-arm, for focusing incident light to form a light spot on the magneto-optical recording medium; a coil member including at least two stacked coil layers, and an insulating layer interposed between adjacent coil layers for electrically insulating the adjacent coil layers from one another, the stacked coil layers being planar coils with a spiral structure and having electrical contacts for electrical connection therebetween; and a connection member interposed between the lens and the coil member, for connecting the coil member to one side of the lens, facing the magneto-optical recording medium, and for electrically connecting the coil layers to an external power supply. The coil member is manufactured using a semiconductor fabrication process.

摘要翻译： 一种用于磁光写入和读取系统的磁光头，其具有用于场调制线圈和微型物镜的改进的结构，以及制造磁光头的方法。 磁光头安装在滑动臂的端部，通过流体动力学在磁光记录介质上移动，并且包括：安装在滑臂的端部的透镜，用于聚焦入射光以形成光点 磁光记录介质; 包括至少两个堆叠的线圈层的线圈构件和插入相邻线圈层之间的用于将相邻线圈层彼此电绝缘的绝缘层，所述堆叠线圈层是具有螺旋结构的平面线圈，并且具有用于电连接的电触点 ; 以及插入在透镜和线圈构件之间的连接构件，用于将线圈构件连接到透镜的一侧，面对磁光记录介质，并将线圈层电连接到外部电源。 线圈构件使用半导体制造工艺制造