摘要:
An electrostatic discharge (ESD) protection circuit is disclosed. This invention relates an electrostatic discharge protection circuit for multi-power and mixed-voltage integrated circuit. In the electrostatic discharge protection circuit of the invention, an ESD protection cell formed with voltage selector, control circuit and transistor is used to connect with a independent power and ESD bus is used to connect with each ESD protection cell so that each power is isolated from each other during normal operation. Therefore, each power can be operated independently and circuit will be prevented from ESD during ESD discharging.
摘要:
A Mask ROM testing device is described. The Mask ROM testing device comprises a substrate, a plurality of buried bit-lines in the substrate and a plurality of word-lines on the substrate perpendicular to the buried bit-lines. Each buried bit-line has two end portions with a combined length of about 3˜30 &mgr;m and can have an N-type conductivity or a P-type conductivity.
摘要:
A method of fabricating a non-volatile memory, in which a charge-trapping layer consisting of insulating materials and bar-like conductive layers to be patterned into the gates are formed at first. The buried bit-lines are formed in the substrate between the bar-like conductive layers. Each of the buried bit-lines extends into the substrate under a portion of an adjacent high-K spacer, but not to the substrate under an adjacent bar-like conductive layer. High-K spacers are formed on the side-walls of the bar-like conductive layers. Then the bar-like conductive layers are patterned into the gates, and word-lines are formed on the substrate to electrically connect with the gates. The material of the high-K spacer has a dielectric constant and the high-K spacer has a width, such that a channel will extend to the substrate under the high-K spacer and connect with the buried bit-line when the non-volatile memory is operated.
摘要:
An ESD protection structure for protecting an internal circuit comprising a primary protection device, a secondary protection device, and a substrate pickup is presented. The primary protection device and secondary protection device share a common source, and this common source implementation lowers the trigger voltage of the primary protection device to be about the same as the trigger voltage of the secondary protection device, thereby eliminating the need to use an isolation resistor between the primary and secondary protection devices.
摘要:
A method of fabricating a MOS transistor. First, a substrate having a gate electrode and spacers on the gate electrode sidewalls is provided. A source/drain region is formed in the substrate outside the outer edge of the spacer sidewalls. A self-aligned silicide layer is formed over the exposed surface of the gate electrode and the source/drain regions. A portion of the spacers is removed by etching to form a sharp-angled triangular spacer on the sidewalls of the gate electrode. A pocket implantation of the substrate is carried out to form a pocket region inside the substrate under the side edges of the gate electrode. By controlling the setting of the energy level and the implant angle in the pocket implantation, a precise distribution of the dopants at desired locations within the substrate is reproduced. Finally, the sharp-angled spacers are removed and then a light implantation is conducted to form source/drain extension regions in the substrate on each side of the gate electrode.
摘要:
A semiconductor device is formed on a substrate having an ESD region and an internal region. A protective layer is formed over a portion of the ESD region to be protected from formation of silicide and suicide is formed on portions of the Internal and ESD region which remain unprotected by the protective layer. A portion of the protective layer is removed to form the remaining portions of the protective layer into sidewall spacers adjacent to a gate electrode included in the ESD region.
摘要:
A memory cell having an asymmetric source and drain connection to buried bit-lines providing a Fowler-Nordheim tunneling region and a non-tunneling region defined by a bird's beak encroachment on each of the cells. A nonvolatile semiconductor memory device comprising row and column arrangement of the cells in which adjacent columns of cells share a single bit-line. The method for manufacturing a memory cell having asymmetric source and drain regions and comprising the steps of: (1) forming a dielectric covering a semiconductor substrate of a first conductivity type; (2) forming a column of floating gates on the dielectric; (3) forming an inhibit mask adjacent a first side of the column of floating gates; (4) implanting a dopant adjacent the first side and a second side of the column of floating gates, the first dopant having a second conductivity type opposite the first conductivity type; (5) forming a thermal oxide adjacent the first and second side of the column of floating gates such that the dopant adjacent the first side of the column is separated from the floating gates by the dielectric and the dopant adjacent the second side of the column is separated from the floating gates by a bird's beak encroachment of the thermal oxide formation; and (6) completing formation of control gate dielectric and control gates.
摘要:
An electrostatic discharge tolerant device includes a semiconductor body having a first conductivity type, and a pad. A surrounding well having a second conductivity type is laid out in a ring to surround an area for an electrostatic discharge circuit in the semiconductor body. The surrounding well is relatively deep, and in addition to defining the area for the electrostatic discharge circuit, provides the first terminal of a diode formed with the semiconductor body. Within the area surrounded by the surrounding well, a diode coupled to the pad and a transistor coupled to the voltage reference are connected in series and form a parasitic device in the semiconductor body.
摘要:
A semiconductor device includes a first well region of a first conductivity type, a second well region of a second conductive type within the first well region. A first region of the first conductivity type and a second region of the second conductivity type are disposed within the second well region. A third region of the first conductivity type and a fourth region of the second conductivity type are disposed within the first well region, wherein the third region and the fourth region are separated by the second well region. The semiconductor device also includes a switch device coupled to the third region.
摘要:
An RC delay circuit for providing electrostatic discharge (ESD) protection is described. The circuit employs an NMOS transistor and a PMOS transistor to produce a large effective resistance using a relatively small circuit layout area.