摘要:
A method and device providing a strained Si film with reduced defects is provided, where the strained Si film forms a fin vertically oriented on a surface of a non-conductive substrate. The strained Si film or fin may form a semiconductor channel having relatively small dimensions while also having few defects. The strained Si fin is formed by growing Si on the side of a relaxed SiGe block. A dielectric gate, such as, for example, an oxide, a high “k” material, or a combination of the two, may be formed on a surface of the strained Si film. Additionally, without substantially affecting the stress in the strained Si film, the relaxed SiGe block may be removed to allow a second gate oxide to be formed on the surface previously occupied by the relaxed SiGe block. Accordingly, a semiconductor device having a strained Si fin vertically oriented on a non-conductive substrate may be formed where the strained Si film is oriented such that it may form a channel of small dimensions allowing access to both sides and top in order to from single gate, double gate, or more gate MOSFETs and finFETs with a channel having a reduced number of defects and/or reduced dimensions.
摘要:
Methods for fabricating a CMOS structure use a first gate stack located over a first orientation region of a semiconductor substrate. A second gate material layer is located over the first gate stack and a laterally adjacent second orientation region of the semiconductor substrate. A planarizing layer is located upon the second gate material layer. The planarizing layer and the second gate material layer are non-selectively etched to form a second gate stack that approximates the height of the first gate stack. An etch stop layer may also be formed upon the first gate stack. The resulting CMOS structure may comprise different gate dielectrics, metal gates and silicon gates.
摘要:
A CMOS structure and a method for fabricating the CMOS structure include a first transistor located within a first semiconductor substrate region having a first polarity. The first transistor includes a first gate electrode that includes a first metal containing material layer and a first silicon containing material layer located upon the first metal containing material layer. The CMOS structure also includes a second transistor located within a laterally separated second semiconductor substrate region having a second polarity that is different than the first polarity. The second transistor includes a second gate electrode comprising a second metal containing material layer of a composition that is different than the first metal containing material layer, and a second silicon containing material layer located upon the second metal containing material layer. The first silicon containing material layer and the first semiconductor substrate region comprise different materials. The second silicon containing material layer and the second semiconductor substrate region also comprise different materials.
摘要:
A method is presented for a time-aware strategy utilized within message-initiated constraint-based routing for digital message communication among nodes in an ad-hoc network, in which each node includes attributes. The method includes determining local attributes for each of the nodes and defining constraints on the attributes. Each node is provided access to the attributes of each neighboring node, with a neighboring node being a node that is one hop away. Each message transmitted over the network has a message type, which includes a destination specification, route specification, and objective specification. Constraint checking and cost estimation checking are performed for each message type. The message that is routed within the network includes the address of a sending node, address of the source node, route constraints, destination constraints specified with a time bound, the number of route constraints, the number of destination constraints, message identification number, sequence identification number, and routing objectives.
摘要:
A method for forming a patterned structure within a microelectronic structure uses a non-directly imageable organic material layer located over a substrate and a directly imageable inorganic material layer located upon the non-directly imageable organic material layer. The directly imageable inorganic material layer is directly imaged to form a patterned inorganic material layer. The patterned inorganic material layer is used as a first etch mask within a first etch method that etches the non-directly imageable organic material layer to form a patterned organic material layer. At least the patterned organic material layer is used as a second etch mask within a second etch method that etches the substrate to form a patterned structure within the substrate.
摘要:
One embodiment of the present invention provides a system that locates a set of target transmitting mechanism using a mobile sensing infrastructure. During operation, the system determines a reference frame of a sensing mechanism by detecting signals from at least two transmitting mechanisms. The system further determines locations of the target transmitting mechanism relative to the reference frame using the sensing mechanism. In addition, the system produces a result to indicate the locations of the target transmitting mechanisms.
摘要:
A semiconductor device includes a semiconductor substrate having at least one gap, extending under a portion of the semiconductor substrate. A gate stack is on the semiconductor substrate. A strain layer is formed in at least a portion of the at least one gap. The strain layer is formed only under at least one of a source region and a drain region of the semiconductor device.
摘要:
Multiple integration schemes for manufacturing dual gate semiconductor structures are disclosed. By employing the novel integration schemes, polysilicon gate MOSFETs and high-k dielectric metal gate MOSFETs are formed on the same semiconductor substrate despite differences in the composition of the gate stack and resulting differences in the etch rates. A thin polysilicon layer is used for one type of gate electrodes and a silicon-containing layer are used for the other type of gate electrodes in these integration schemes to balance the different etch rates and to enable etching of the two different gate stacks.
摘要:
A field effect device is disclosed which has a body formed of a crystalline semiconductor material and has at least one vertically oriented section and at least one horizontally oriented section. The device is produced in SOI technology by fabricating first a formation of the device in masking insulators, and then transferring this formation through several etching steps into the SOI layer. The segmented field effect device combines FinFET, or fully depleted silicon-on-insulator FETs, type devices with fully depleted planar devices. This combination allows device width control with FinFET type devices. The segmented field effect device gives high current drive for a given layout area. The segmented field effect devices allow for the fabrication of high performance processors.