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公开(公告)号：US5876273A
公开(公告)日：1999-03-02
申请号：US625291
申请日：1996-04-01
申请人： Hiroyuki Yano , Katsuya Okumura , Norio Kimura , Tomoyuki Yahiro , Hozumi Yasuda
发明人： Hiroyuki Yano , Katsuya Okumura , Norio Kimura , Tomoyuki Yahiro , Hozumi Yasuda
CPC分类号： B24B37/30
摘要： A polishing apparatus is provided which improves uniformity across the surface of a polished wafer. The apparatus includes a wafer carrier, a guide ring coupled to a lower portion of the wafer carrier, a circular plate coupled to a first inner circumference portion of the guide ring distant from the wafer carrier, and a cavity, formed within an area bounded by the lower portion of the wafer carrier, an inner circumference of the circular plate, and a second inner circumference portion of the guide ring between the circular plate and the lower portion of the wafer carrier, the circular plate holding the wafer to be polished in the cavity.
摘要翻译： 提供了一种改善抛光晶片表面均匀性的抛光装置。 该装置包括晶片载体，联接到晶片载体的下部的引导环，耦合到远离晶片载体的引导环的第一内周部分的圆形板，以及形成在由 晶片载体的下部，圆形板的内圆周和导向环的第二内周部分在圆形板和晶片载体的下部之间，圆形板将待抛光的晶片保持在 腔。
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公开(公告)号：US08932106B2
公开(公告)日：2015-01-13
申请号：US13226800
申请日：2011-09-07
IPC分类号： B24B49/00 , B24B51/00 , B24B37/30 , B24B37/015
CPC分类号： B24B37/005 , B24B37/015 , B24B37/10 , B24B37/30 , H01L21/67017 , H01L21/67092 , H01L21/6838
摘要： A polishing apparatus is used for polishing a substrate such as a semiconductor wafer to a flat mirror finish. The polishing apparatus includes a polishing table having a polishing surface, a substrate holding apparatus configured to hold the substrate and to press the substrate against the polishing surface, and a controller. The substrate holding apparatus includes an elastic membrane configured to form a substrate holding surface which is brought into contact with the substrate, a carrier provided above the elastic membrane, at least one pressure chamber formed between the elastic membrane and the carrier, and an infrared light detector configured to measure thermal energy from the elastic membrane. The controller calculates an estimate value of a temperature of the elastic membrane using a measured value of the infrared light detector.
摘要翻译： 抛光装置用于将半导体晶片等基板研磨成平面镜面。 抛光装置包括具有抛光表面的抛光台，配置成保持基板并将基板压靠在抛光表面上的基板保持装置和控制器。 基板保持装置包括：弹性膜，其构造成形成与基板接触的基板保持面，设置在弹性膜上方的载体，形成在弹性膜与载体之间的至少一个压力室，以及红外线 检测器被配置为测量来自弹性膜的热能。 控制器使用红外光检测器的测量值来计算弹性膜的温度的估计值。
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公开(公告)号：US08357029B2
公开(公告)日：2013-01-22
申请号：US12747225
申请日：2009-02-09
申请人： Makoto Fukushima , Tetsuji Togawa , Hozumi Yasuda , Koji Saito , Osamu Nabeya , Tomoshi Inoue
发明人： Makoto Fukushima , Tetsuji Togawa , Hozumi Yasuda , Koji Saito , Osamu Nabeya , Tomoshi Inoue
IPC分类号： B24B5/00
CPC分类号： B24B37/30
摘要： A polishing apparatus is used for polishing a substrate such as a semiconductor wafer to a flat mirror finish. The polishing apparatus includes a polishing table (100) having a polishing surface (101a), a top ring body (2) configured to hold and press a substrate against the polishing surface (101a), and a retainer ring (3) provided at an outer peripheral portion of the top ring body (2) and configured to press the polishing surface (101a). A fulcrum for receiving a lateral force applied from the substrate to the retainer ring (3) during polishing of the substrate is located above a central portion of the substrate.
摘要翻译： 抛光装置用于将半导体晶片等基板研磨成平面镜面。 抛光装置包括具有抛光面（101a）的抛光台（100），被配置为将基板保持并压靠在抛光表面（101a）上的顶环体（2），以及设置在抛光表面 所述顶环体（2）的外周部分构造成按压所述抛光表面（101a）。 用于在衬底抛光期间接收从衬底施加到保持环（3）的侧向力的支点位于衬底的中心部分的上方。
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公开(公告)号：US08100743B2
公开(公告)日：2012-01-24
申请号：US12285941
申请日：2008-10-16
申请人： Osamu Nabeya , Tetsuji Togawa , Hozumi Yasuda , Koji Saito , Makoto Fukushima
发明人： Osamu Nabeya , Tetsuji Togawa , Hozumi Yasuda , Koji Saito , Makoto Fukushima
IPC分类号： B24B5/00
CPC分类号： B24B37/32
摘要： A polishing apparatus is used for polishing a substrate such as a semiconductor wafer to a flat mirror finish. The polishing apparatus includes a polishing table having a polishing surface, a top ring body configured to hold and press a substrate against the polishing surface, a retainer ring provided at an outer peripheral portion of the top ring body and configured to press the polishing surface, and a retainer ring guide fixed to the top ring body and configured to be brought into sliding contact with a ring member of the retainer ring to guide a movement of said ring member. Either one of sliding contact surfaces of the ring member and the retainer ring guide which are brought into sliding contact with each other comprises a low friction material.
摘要翻译： 抛光装置用于将半导体晶片等基板研磨成平面镜面。 抛光装置包括具有研磨面的研磨台，配置为将基板保持并压靠在研磨面上的顶环体，设置在顶环体的外周部并构造成按压抛光面的保持环， 以及保持环导向件，其固定到所述顶环主体并且被构造成与所述保持环的环形构件滑动接触以引导所述环构件的运动。 彼此滑动接触的环构件和保持器环导向件的滑动接触表面中的任一个包括低摩擦材料。
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公开(公告)号：US20090191791A1
公开(公告)日：2009-07-30
申请号：US12320471
申请日：2009-01-27
申请人： Makoto Fukushima , Tetsuji Togawa , Hozumi Yasuda , Osamu Nabeya , Shingo Saito
发明人： Makoto Fukushima , Tetsuji Togawa , Hozumi Yasuda , Osamu Nabeya , Shingo Saito
CPC分类号： B24B37/345
摘要： A polishing method can safely detach and lift up a workpiece from a polishing surface without carrying out the operation of making the workpiece overhang the polishing surface. The polishing method includes carrying out processing of a surface to be polished of a workpiece by supplying a liquid to a polishing surface while pressing the surface to be polished of the workpiece held by a holding device against the polishing surface and moving the workpiece and the polishing surface relative to each other, attracting the workpiece after the processing to the holding device while supplying the liquid to the polishing surface at a decreased flow rate, thereby detaching the workpiece from the polishing surface, and lifting up the holding device together with the workpiece on confirmation of detachment of the workpiece from the polishing surface and attachment of the workpiece to the holding device.
摘要翻译： 抛光方法可以安全地从抛光表面上分离和提起工件，而不必进行使工件伸出抛光表面的操作。 抛光方法包括：通过向抛光表面供给液体来进行待研磨表面的加工，同时将由保持装置保持的工件的待抛光表面压在抛光表面上并移动工件和抛光 相对于彼此的表面，在将处理后的工件吸收到保持装置的同时，以降低的流量向抛光表面供给液体，从而将工件从抛光表面分离，并将工件与工件一起提起 确认工件与抛光表面分离并将工件附着到保持装置上。
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公开(公告)号：US20090142996A1
公开(公告)日：2009-06-04
申请号：US12292677
申请日：2008-11-24
申请人： Hozumi Yasuda , Makoto Fukushima , Tetsuji Togawa
发明人： Hozumi Yasuda , Makoto Fukushima , Tetsuji Togawa
CPC分类号： B24B37/30
摘要： A polishing apparatus is used for polishing a substrate such as a semiconductor wafer to a flat mirror finish. The polishing apparatus includes a polishing table having a polishing surface, a polishing head having at least one elastic membrane configured to form a plurality of pressure chambers for being supplied with a pressurized fluid, and a controller configured to control supply of the pressurized fluid to the pressure chambers. The controller controls supply of the pressurized fluid so that the pressurized fluid is supplied first to the pressure chamber located at a central portion of the substrate when the substrate is brought into contact with the polishing surface, and then the pressurized fluid is supplied to the pressure chamber located at a radially outer side of the pressure chamber located at the central portion of the substrate.
摘要翻译： 抛光装置用于将半导体晶片等基板研磨成平面镜面。 抛光装置包括具有抛光表面的抛光台，具有至少一个弹性膜的抛光头，所述弹性膜被构造成形成用于供应加压流体的多个压力室，以及控制器，其构造成控制加压流体供应到 压力室。 控制器控制加压流体的供给，使得当基板与抛光表面接触时，加压流体首先被供应到位于基板的中心部分处的压力室，然后将加压流体供应到压力 位于位于基板中心部分处的压力室的径向外侧的腔室。
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公开(公告)号：US20080047667A1
公开(公告)日：2008-02-28
申请号：US11907590
申请日：2007-10-15
IPC分类号： B24B57/00
摘要： A substrate holding apparatus has a substrate holder body with a substrate holding side facing a polishing surface and holding a substrate on the substrate holding side and a retainer ring fixedly secured to the substrate holder body. The retainer ring is arranged to surround an outer periphery of the substrate held by the substrate holder body so that the retainer ring engages with the polishing surface radially outside the substrate as the polishing of the substrate is effected. The substrate holder body is provided with a membrane having inside and outside surfaces. The inside surface cooperates with a surface of the substrate holder body to define a fluid pressure chamber to which a fluid pressure is applied. The outer surface engages with the substrate held by the substrate holder body.
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公开(公告)号：US20070004324A1
公开(公告)日：2007-01-04
申请号：US10534507
申请日：2003-10-24
IPC分类号： B24B29/00
摘要： A polishing apparatus includes a polishing object holding mechanism for holding an object to be polished, and a table having a polishing surface. The polishing object held by the polishing object holding mechanism is pressed against the polishing surface of the table and polished by relative movement between the polishing object held by the holding mechanism and the polishing surface of the table. An elastic sheet 11 is stretched over the upper surface of the table, and a polishing pad 16 having a polishing surface on the upper side thereof is replaceably stretched over the elastic sheet 11. Thus, the function performed by an underlayer pad member of a double-layer polishing pad that has heretofore frequently been used in a chemical/mechanical polishing (CMP) apparatus is imparted to the table of the chemical/mechanical polishing (CMP) apparatus, thereby achieving cost reduction of chemical/mechanical polishing (CMP) process and stabilizing process performance such as polishing rate uniformity within a substrate surface to be polished.
摘要翻译： 抛光装置包括用于保持待抛光物体的抛光对象保持机构和具有抛光表面的工作台。 由抛光对象保持机构保持的研磨物被压在工作台的研磨面上，并通过由保持机构保持的研磨对象物与工作台的研磨面之间的相对移动进行研磨。 弹性片材11在桌子的上表面上被拉伸，并且在其上侧具有抛光表面的抛光垫16可更换地拉伸在弹性片材11上。 因此，在化学/机械抛光（CMP）装置中已经使用了迄今为止经常被用于化学/机械抛光（CMP）装置的双层抛光垫的底层衬垫构件所执行的功能被赋予到化学/机械抛光（CMP）装置的工作台 实现化学/机械抛光（CMP）工艺的成本降低和稳定处理性能，例如待抛光的基板表面内的抛光速率均匀性。
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59.发明授权Workpiece polishing apparatus comprising a fluid pressure bag provided between a pressing surface and the workpiece and method of use thereof 失效工件抛光装置，包括设置在挤压表面和工件之间的流体压力袋及其使用方法公开(公告)号：US06435949B1
公开(公告)日：2002-08-20
申请号：US09652148
申请日：2000-08-31
IPC分类号： B24B100
摘要： A polishing apparatus is used for polishing a workpiece such as a semiconductor wafer to a flat mirror finish. The polishing apparatus comprises a turntable having a polishing surface, a top ring for holding a workpiece and pressing the workpiece against the polishing surface, a holding surface of the top ring for holding the workpiece, and a retainer ring for retaining the workpiece within the holding surface of the top ring. The holding surface is deformable by fluid having variable pressure, and the retainer ring presses the polishing surface under a variable pressing force.
摘要翻译： 抛光装置用于将诸如半导体晶片的工件抛光到平面镜面。 抛光装置包括具有抛光表面的转台，用于保持工件的顶环和将工件压靠在抛光表面上的压板，用于保持工件的顶环的保持表面和用于将工件保持在保持件内的保持环 顶环的表面。 保持表面由具有可变压力的流体变形，并且保持环以可变的压力按压抛光表面。
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公开(公告)号：US06432258B1
公开(公告)日：2002-08-13
申请号：US09499472
申请日：2000-02-07
申请人： Norio Kimura , Hozumi Yasuda
发明人： Norio Kimura , Hozumi Yasuda
IPC分类号： C23F102
摘要： A polishing apparatus for polishing a workpiece such as a semiconductor wafer has a turntable with an abrasive cloth mounted on an upper surface thereof, and a top ring for holding a workpiece and pressing the workpiece against the abrasive cloth under a first pressing force to polish the workpiece. A guide ring is vertically movably disposed around the top ring, and pressed against the abrasive cloth under a variable second pressing force. The first and second pressing forces are variable independently of each other, and the second pressing force is determined based on the first pressing force.
摘要翻译： 用于抛光诸如半导体晶片的工件的抛光装置具有安装在其上表面上的研磨布的转台和用于保持工件的顶环，并且在第一按压力下将工件压靠在研磨布上以抛光 工件。 引导环可垂直移动地设置在顶环周围，并以可变的第二按压力压靠研磨布。 第一和第二按压力彼此独立地变化，并且基于第一按压力来确定第二按压力。
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