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51.
公开(公告)号:US5991022A
公开(公告)日:1999-11-23
申请号:US79875
申请日:1998-05-15
Applicant: Dale Buermann , Abdul Rahim Forouhi , Michael J. Mandella
Inventor: Dale Buermann , Abdul Rahim Forouhi , Michael J. Mandella
CPC classification number: G01J3/12 , G01B11/0625 , G01B11/0641 , G01J3/02 , G01J3/0208 , G01J3/42 , G01J4/00
Abstract: An apparatus uses reflectance spectrophotometry to characterize a sample having any number of thin films. The apparatus uses two toroidal mirrors in an optical relay to direct light reflected by the sample to a spectrophotometer. A computer then analyzes the reflected spectrum to characterize the optical properties of the sample. The optical relay allows a range of angles of reflection from the sample, and has no chromatic aberration. The optical relay is also arranged so that the non-chromatic aberration is minimized. The sample is mounted on a movable stage so that different areas of the sample may be characterized. Furthermore, a deflector and a viewer are used to allow the operator of the apparatus to view the region of the sample under study.
Abstract translation: 一种装置使用反射分光光度法来表征具有任何数量薄膜的样品。 该装置在光学继电器中使用两个环形反射镜将由样品反射的光引导到分光光度计。 然后计算机分析反射光谱以表征样品的光学性质。 光学继电器允许来自样品的一定范围的反射角度,并且没有色差。 光学继电器也被布置成使得非色差最小化。 将样品安装在可移动的载物台上,以便可以对样品的不同区域进行表征。 此外,偏转器和观察器用于允许装置的操作者观察正在研究的样品的区域。
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公开(公告)号:US5956148A
公开(公告)日:1999-09-21
申请号:US989904
申请日:1997-12-12
Applicant: Francis G. Celii
Inventor: Francis G. Celii
CPC classification number: G01B11/0641
Abstract: A semiconductor surface measurement system (100) is disclosed. In this system, a plurality of wafers (106), each having an exposed surface, are held by a wafer positioning system (104), which sequentially moves the wafers into a measurement zone. A wafer position detection system (124) detects the position of a selected wafer, and generates an output signal indicating the position of the selected wafer. A surface measurement apparatus (114 through 121, 130 through 142) measures a property of the exposed surface of the selected wafer (106) in response to the output signal of the wafer position detection system (124) when the selected wafer is in the measurement zone. The disclosed surface measurement system (100)may be used to gather real-time data concerning surface properties such as composition, roughness and epilayer thickness during multi-wafer semiconductor processing.
Abstract translation: 公开了半导体表面测量系统(100)。 在该系统中,每个具有暴露表面的多个晶片(106)由晶片定位系统(104)保持,晶片定位系统(104)将晶片顺序地移动到测量区域中。 晶片位置检测系统(124)检测所选晶片的位置,并产生指示所选晶片的位置的输出信号。 当所选晶片处于测量状态时,表面测量装置(114至121,130至142)响应于晶片位置检测系统(124)的输出信号测量所选晶片(106)的暴露表面的性质 区。 公开的表面测量系统(100)可以用于收集关于多晶片半导体处理期间的表面特性(例如组成,粗糙度和外延层厚度)的实时数据。
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公开(公告)号:US5798837A
公开(公告)日:1998-08-25
申请号:US890697
申请日:1997-07-11
Applicant: David E. Aspnes , Jon Opsal , Jeffrey T. Fanton
Inventor: David E. Aspnes , Jon Opsal , Jeffrey T. Fanton
CPC classification number: G01B11/0641 , G01J4/00 , G01N21/211
Abstract: An optical measurement system for evaluating a reference sample that has at least a partially known composition. The optical measurement system includes a reference ellipsometer and at least one non-contact optical measurement device. The reference ellipsometer includes a light generator, an analyzer and a detector. The light generator generates a beam of quasi-monochromatic light having a known wavelength and a known polarization for interacting with the reference sample. The beam is directed at a non-normal angle of incidence relative to the reference sample to interact with the reference sample. The analyzer creates interference between the S and P polarized components in the light beam after the light beam has interacted with reference sample. The detector measures the intensity of the light beam after it has passed through the analyzer. A processor determines the polarization state of the light beam entering the analyzer from the intensity measured by the detector, and determines an optical property of the reference sample based upon the determined polarization state, the known wavelength of light from the light generator and the composition of the reference sample. The processor also operates the optical measurement device to measure an optical parameter of the reference sample. The processor calibrates the optical measurement device by comparing the measured optical parameter from the optical measurement device to the determined optical property from the reference ellipsometer.
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54.
公开(公告)号:US3437811A
公开(公告)日:1969-04-08
申请号:US3437811D
申请日:1967-04-14
Applicant: ICI LTD
Inventor: WILLIS HARRY ARTHUR , BOYES WILLIAM ALLAN
CPC classification number: G01N21/21 , G01B11/0641
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55.
公开(公告)号:US3158675A
公开(公告)日:1964-11-24
申请号:US85206159
申请日:1959-11-10
Applicant: JONES & LAUGHLIN STEEL CORP
Inventor: MURRAY THOMAS P , HANYO GEORGE T
IPC: G01B11/06
CPC classification number: G01B11/0641
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56.
公开(公告)号:US11982775B2
公开(公告)日:2024-05-14
申请号:US18079477
申请日:2022-12-12
Applicant: Intrinsic Innovation LLC
Inventor: Achuta Kadambi , Ramesh Raskar , Kartik Venkataraman , Supreeth Krishna Rao , Agastya Kalra
IPC: H04N13/00 , G01B11/06 , G01B11/24 , G01S7/499 , G01S13/89 , G01S17/87 , G01S17/89 , G06T7/00 , G06T7/11 , G06T7/521 , G06T7/593 , G06T7/60 , G06T17/00 , H04N13/243 , H04N13/257
CPC classification number: G01S7/499 , G01B11/0641 , G01B11/24 , G01S13/89 , G01S17/87 , G01S17/89 , G06T7/11 , G06T7/521 , G06T7/593 , G06T7/60 , G06T17/00 , H04N13/243 , H04N13/257 , G06T2200/08 , G06T2207/10016 , G06T2207/10024 , G06T2207/10028 , G06T2207/20081 , G06T2207/20084
Abstract: A multi-modal sensor system includes: an underlying sensor system; a polarization camera system configured to capture polarization raw frames corresponding to a plurality of different polarization states; and a processing system including a processor and memory, the processing system being configured to control the underlying sensor system and the polarization camera system, the memory storing instructions that, when executed by the processor, cause the processor to: control the underlying sensor system to perform sensing on a scene and the polarization camera system to capture a plurality of polarization raw frames of the scene; extract first tensors in polarization representation spaces based on the plurality of polarization raw frames; and compute a characterization output based on an output of the underlying sensor system and the first tensors in polarization representation spaces.
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公开(公告)号:US20240027186A1
公开(公告)日:2024-01-25
申请号:US17871384
申请日:2022-07-22
Applicant: Onto Innovation Inc.
Inventor: Jian Ding , Nathan Unruh , Ju Jin , Nazar Orishchin
CPC classification number: G01B11/0641 , G01N21/21 , G01B2210/56
Abstract: Various examples include an apparatus to characterize substrate and film thicknesses of the substrate and films formed thereon. The apparatus uses one or more wavelengths of light from a light source (e.g., a swept laser) to interrogate the substrate. The light is directed substantially orthogonally to an upper surface of the substrate. A polarizer and an analyzer element are coupled between the light source and the substrate. Therefore, the polarizer and the analyzer are both located in the beam propagation path from the light source to the substrate. An optical detector is arranged substantially orthogonally to the upper surface of the substrate. The optical detector receives light returned back from the substrate. The apparatus is capable of determining the thickness of the substrate and one or more films contained thereon, regardless of substrates having optical anisotropies, such as chiral characteristics or stress-induced films. Other apparatuses and methods are also disclosed.
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公开(公告)号:US20230160688A1
公开(公告)日:2023-05-25
申请号:US17955660
申请日:2022-09-29
Applicant: Samsung Display Co., Ltd.
Inventor: JAISUN KYOUNG , YOUNGGIL PARK , JONGYUN PARK , SOOIM JEONG , DEOKHYUN HWANG
IPC: G01B11/06
CPC classification number: G01B11/0625 , G01B11/0641
Abstract: A substrate processing apparatus includes a chamber including an accommodation space, a stage disposed in the accommodation space and provided with a substrate disposed thereon, a deposition part disposed under the stage and spraying at least one deposition material to the substrate, and a measurement part disposed adjacent to the deposition part. The measurement part includes an accommodation portion provided with an opening defined through at least one surface thereof, a light source disposed in the accommodation portion and irradiating a first light, at least one transmission portion disposed in the opening, facing the light source, and receiving the first light, and a reception portion facing the at least one transmission portion and receiving the first light reflected from the at least one deposition material as a second light.
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公开(公告)号:US20180045507A1
公开(公告)日:2018-02-15
申请号:US15790181
申请日:2017-10-23
Applicant: Sensory Analytics, LLC
Inventor: Vivek Komaragiri , Greg Frisby
IPC: G01B11/06
CPC classification number: G01B11/065 , G01B11/0633 , G01B11/0641
Abstract: The present disclosure is generally directed to methods and systems for measuring the thickness of coatings or thin films on various substrates. For example, one disclosed method includes the steps of providing and directing light waves of varying wavelengths toward a moving substrate comprising a coating, linearly polarizing the light waves, converting the linearly polarized light waves to circularly polarized light waves, analyzing elliptically polarized light waves reflected by the moving substrate, capturing analyzed light waves, generating light wave data based on the captured light waves, and determining a thickness of the coating based on the light wave data.
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公开(公告)号:US09879977B2
公开(公告)日:2018-01-30
申请号:US14073538
申请日:2013-11-06
Applicant: KLA-Tencor Corporation
Inventor: Andrei V. Shchegrov
CPC classification number: G01B11/02 , G01B11/0641 , G01B11/065
Abstract: Methods and systems for achieving a small measurement box size specification across a set of metrology system parameters are presented. The small measurement box size specification is achieved by selectively constraining one or more of the sets of system parameters during measurement. A subset of measurement system parameters such as illumination wavelength, polarization state, polar angle of incidence, and azimuth angle of incidence is selected for measurement to maintain a smaller measurement box size than would otherwise be achievable if the full, available range of measurement system parameters were utilized in the measurement. In this manner, control of one or more factors that affect measurement box size is realized by constraining the measurement system parameter space. In addition, a subset of measurement signals may be selected to maintain a smaller measurement box size than would otherwise be achievable if all available measurement signals were utilized in the measurement.
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