摘要:
An electron radiation curing type adhesive which is excellent for adhesion between a polyester film and a metal material, and which is excellent in retort resistance or the like where the adhesive is used for food cans. There is also disclosed a metal plate laminated with a polyester film. The electron radiation curing type adhesive is composed of a resin composition in which 2 to 200 weight part of polyester group oligomer having unsaturated double-bonds, with respect to 100 weight parts of polyester resin, has added thereto 0.5 to 250 PHR of a stress relaxation agent. The polyester film and a metal plate are laminated with each other by means of the above-mentioned adhesive, and then the film and the metal plate are bonded together by heating and curing the adhesive by irradiation using electron radiation.
摘要:
An adhesive composition comprising a polymer, a tackifier, and a plasticizing amount in the range of 5-40% by weight, 1,4-cyclohexane dimethanol dibenzoate.
摘要:
Disclosed are certain copolyesters comprising an acid component of (1) 60 to 75 mol % of terephthalic acid, and (2) 25 to 40 mol % of a dicarboxylic acid, and a glycol component of (1) 55 to 65 mol % 1,4-butanediol, and (2) 35 to 45 mol % one or more other aliphatic diols. The copolyester or formulation thereof with a tackifying resin has excellent properties for use as a glue gun adhesive.
摘要:
An adhesive resin composition is described, comprising: (A) a thermoplastic copolyester resin prepared from (1) a dicarboxylic acid component comprising from 40 to 100 mol % of terephthalic acid and from 0 to 60 mol % of other aromatic dicarboxylic acid and (2) a low molecular weight glycol component comprising from 40 to 100 mol % of 1,4-butanediol and from 0 to 60 mol % of diethylene glycol or 1,6-hexanediol and further from 0 to 10 mol %, based on the total carboxylic acid, of polytetramethylene glycol having a molecular weight of from 600 to 6,000, which has a melting point of from 90.degree. to 160.degree. C. and a reduced viscosity of at least 0.5; and (B) an ethylene copolymer having at least one functional group selected from an epoxy group, a carboxylic acid group, and a dicarboxylic anhydride gruop; and if desired, (C) a thermoplastic resin other than the resin (A), and if further desired, (D) a polyfunctional epoxy compound. This composition exhibits excellent adhesion to synthetic resins such as polyvinyl chloride, polyesters, and polyolefins and also to metals such as aluminum and has excellent adhesive durability against moisture.
摘要:
Copolyesters formed from 1,4-butanediol and a dicarboxylic acid mixture of, relative to the polyester, 8-12 mol % of sebacic acid or of an amount equal by weight of a saturated aliphatic dicarboxylic acid having 6 to 36 C atoms, 26-32 mol % of terephthalic acid and 7.5 to 12 mol % of isophthalic acid are hot melt adhesives which are characterized by resistance to ageing even at elevated temperatures, good adhesive strength and a relatively high heat resistance of the bonded areas.
摘要:
Thermoplastic copolyesters which have a minimum relative viscosity of 1.4 and contain, based on the polyester, (a) 40-50 mol % of units of terephthalic acid, (b) 0-10 mol % of units of aliphatic, cycloaliphatic or other aromatic dicarboxylic acids, (c) 15-30 mol % of units of ethylene glycol, (d) 34.5-15 mol % of units of diethylene glycol and (e) 0.5-5 mol % of units of polybutylene glycol with a molecular weight of 650 or the same amount by weight with a molecular weight of between 400 and 4,000, it being possible for up to 10 mol % of the units of ethylene glycol and/or diethylene glycol to be replaced by units of alkylenediols having 3 to 10 C atoms and/or units of a bisphenol dihydroxyalkyl ether, are outstandingly suitable as hot-melt adhesives.
摘要:
This invention provides a heat-sealing thermoplastic adhesive of a thermoplastic polymer which is resistant to washing and dry-cleaning, which contains from about 0.05 to about 5% by weight, based on the weight of said polymer, of at least one hydrophobic silicone compound.The invention further provides a process for heat-sealing a substrate which has been at least partly hydrophobized with a silicone compound, which comprises the steps of coating with a heat-sealing thermoplastic adhesive of a thermoplastic polymer which is resistant to washing and dry-cleaning and which contains from about 0.5 to about 5% by weight, based on the weight of said polymer, of at least one hydrophobic silicone compound, sintering, fixing and heat-sealing.The adhesives according to the invention are useful for the bonding of substrates which have been hydrophobically finished with silicone compounds, such as raincoat fabrics.
摘要:
A hot melt adhesive for textiles which comprises a thermoplastic linear block copolyether-polyester consisting essentially of a dicarboxylic acid unit derived from 40 to 60 mol % of terephthalic acid and 60 to 40 mol % of isophthalic acid, glycol unit derived from 1,4-butanediol and a polyether unit derived from polytetramethylene glycol having a molecular weight of about 600 to 1,300, wherein the amount of the polyether unit is 10 to 33 % by weight on the basis of the block copolyether-polyester and the block copolyether-polyester has a relative viscosity of 1.3 to 1.7 and a melting point of 95.degree. to 145.degree. C. The hot melt adhesive affords a large adhesive bond strength without spoiling the softness and liveliness of the textiles.
摘要:
Disclosed are polyesters composed of terephthalic acid, suberic acid and 1,4-cyclohexanedimethanol, wherein the suberic acid is within a critical range of 60 to 90 mole percent. These polyesters exhibit desirable adhesive properties.