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公开(公告)号：US20210180887A1
公开(公告)日：2021-06-17
申请号：US17185090
申请日：2021-02-25
发明人： Brett P. GUARRERO
IPC分类号： F28F21/04 , H01B1/18 , G21F1/04 , A47J36/02 , E01C11/00 , C09K5/06 , C09K5/04 , C04B28/00 , C04B14/02 , C09K5/14 , E01C5/06 , E01C11/26 , E01C7/14 , E04B5/48 , C04B28/02
摘要： The present invention provides a bidirectional energy-transfer system comprising: a thermally and/or electrically conductive concrete, disposed in a structural object; a location of energy supply or demand that is physically isolated from, but in thermodynamic and/or electromagnetic communication with, the thermally and/or electrically conductive concrete; and a means of transferring energy between the structural object and the location of energy supply or demand. The system can be a single node in a neural network. The thermally and/or electrically conductive concrete includes a conductive, shock-absorbing material, such as graphite. Preferred compositions are disclosed for the thermally and/or electrically conductive concrete. The bidirectional energy-transfer system may be present in a solar-energy collection system, a grade beam, an indoor radiant flooring system, a structural wall or ceiling, a bridge, a roadway, a driveway, a parking lot, a commercial aviation runway, a military runway, a grain silo, or pavers, for example.
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52.发明申请公开(公告)号：US20210172583A1
公开(公告)日：2021-06-10
申请号：US16763327
申请日：2018-11-29
发明人： Tadahito FURUYAMA
摘要： Provided are: a wavelength conversion member capable of reducing the decrease in luminescence intensity with time and the melting of component materials when irradiated with high-power excitation light; a method for manufacturing the same; and a light-emitting device using the wavelength conversion member. A wavelength conversion member 10 is made of a phosphor powder 2 and a thermally conductive filler 3 both dispersed into an inorganic binder 1, a refractive index difference between the inorganic binder 1 and the thermally conductive filler 3 being 0.2 or less, a volume ratio of a content of the inorganic binder 1 to a content of the thermally conductive filler 3 being 40:60 to 5:95.
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公开(公告)号：US11001739B2
公开(公告)日：2021-05-11
申请号：US16121254
申请日：2018-09-04
发明人： Ping Liu
IPC分类号： C09K5/14 , C08J5/18 , C01B32/205 , B32B38/00 , B32B27/28 , B32B27/08 , B32B9/04 , C01B32/05 , B32B15/08 , B32B37/10 , B32B37/02
摘要： A preparation method comprises the following steps: S1, laminating a plurality of thermoplastic polyimide films; S2, performing heat treatment while pressing the laminated thermoplastic polyimide films for bonding, wherein the temperature of heat treatment is lower than the temperature at which the thermoplastic polyimide films begin thermal decomposition, so that bonding occurs between the thermoplastic polyimide films to form a composite film; S3, heating the obtained composite film to a temperature above the temperature at which thermal decomposition begins, and then performing heat treatment, thereby obtaining the carbonized composite thermoplastic polyimide film. By the adoption of the preparation method, the TPI films can be conveniently and effectively formed into a high-quality multi-layer carbonized composite film and a multi-layer graphite composite film, and the composite films have excellent thermal diffusivity and bending resistance, so that heat dissipation of electronic equipment, precision instruments and the like can be easily realized.
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公开(公告)号：US10988656B2
公开(公告)日：2021-04-27
申请号：US16470415
申请日：2018-05-15
申请人： LG Chem, Ltd.
发明人： Seong Kyun Kang , Yoon Gyung Cho , Yang Gu Kang , Eun Suk Park , Sang Min Park , Se Woo Yang , Hyeon Choi
IPC分类号： C09K5/14 , C08G18/32 , C08G18/42 , C08G18/66 , C08G18/73 , C08K3/22 , C08K7/18 , C08K3/013 , C08L75/04 , C08L101/00
摘要： A thermally conductive resin composition is disclosed herein. The thermally conductive resin composition exhibits high thermal conductivity while having excellent handling properties. In an embodiment, a resin composition includes a resin component and 600 parts by weight or more of a thermally conductive filler relative to 100 parts by weight of the resin component. The thermally conductive filler comprise 30 to 50 wt % of a first thermally conductive filler having a D50 particle diameter of 35 μm or more, 25 to 45 wt % of a second thermally conductive filler having a D50 particle diameter in a range of 15 μm to 30 μm, and 15 to 35 wt % of a third thermally conductive filler having a D50 particle diameter of 1 to 4 μm, based on the total weight of the thermally conductive filler.
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55.发明申请公开(公告)号：US20210108121A1
公开(公告)日：2021-04-15
申请号：US16608532
申请日：2018-04-27
申请人： SANTOKU CORPORATION
摘要： This invention provides a regenerator material having a high specific heat, particularly in the temperature range of 10 to 25K, and a regenerator and a refrigerator comprising the regenerator material. The present invention specifically provides an HoCu-based regenerator material represented by general formula (1): HoCu2-xMx (1), wherein x is 0
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公开(公告)号：US10971975B2
公开(公告)日：2021-04-06
申请号：US15378743
申请日：2016-12-14
发明人： Jeffrey J. Ronning
IPC分类号： H02K9/22 , H02K1/16 , H02K3/18 , C09K5/14 , C09D201/00
摘要： A method for improving thermal conduction in a stator having electrically conductive windings wound in a plurality of gaps formed between adjacent pairs of a plurality of teeth of the stator. A plurality of interstitial spaces are formed within each of the gaps during winding of the electrically conductive windings around the teeth. A plug is arranged within each one of the gaps to close off slot openings. A thermally conductive filler compound is injected into each gap under sufficient pressure to at least substantially fill the interstitial spaces within each gap and to at least substantially encapsulate the electrically conductive windings. The thermally conductive filler compound is then allowed to set.
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公开(公告)号：US20210017437A1
公开(公告)日：2021-01-21
申请号：US16980208
申请日：2019-10-10
发明人： Katsuyuki SUZUMURA
摘要： A thermally conductive composition includes a matrix resin, a curing catalyst, and thermally conductive particles. The thermally conductive particles include, with respect to 100 parts by mass of the matrix resin component, (a) 900 parts by mass or more of aluminum nitride with an average particle size of 50 μm or more, (b) 400 parts by mass or more of aluminum nitride with an average particle size of 5 μm or less, and (c) more than 0 parts by mass and 400 parts by mass or less of alumina with an average particle size of 6 μm or less. A cured product of the thermally conductive composition has a thermal conductivity of 12 W/m·K or more and an Asker C hardness of 20 to 75. Thus, a thermally conductive composition having a hardness suitable for mounting to an electrical or electronic component and high thermal conductive properties, and a thermally conductive sheet using the thermally conductive composition are provided.
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58.发明授权公开(公告)号：US10894907B2
公开(公告)日：2021-01-19
申请号：US16302354
申请日：2017-05-17
发明人： Takahiro Nomura , Tomohiro Akiyama , Nan Sheng , Daiki Hanzaki
摘要： In the present invention, after a primary coating film is formed by boehmite treatment of the surface of a core particle in a solution comprising Al ions, a secondary coating film is formed by cooling the solution to the supersaturation temperature of the Al ions to cause deposition of a hydroxide of aluminum on the surface of the primary coating film, and an Al oxide film is formed on the surface of the core particle by heat treating the secondary coating film in an oxidizing atmosphere. Consequently, the shell is thickened by the amount of secondary coating film formed, so that the cyclic strength of the capsule can be secured and the composition change of the PCM in the production process is remarkably suppressed.
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公开(公告)号：US20210009886A1
公开(公告)日：2021-01-14
申请号：US17040733
申请日：2019-03-26
发明人： Jian WANG , Shijie SONG , Yaqin ZHANG
摘要： A polymer composition includes: from about 20 wt. % to about 80 wt. % of a polymer base resin; from about 10 wt. % to about 60 wt. % of a thermally conductive filler; and from about 5 wt. % to about 60 wt. % of a dielectric ceramic filler having a Dk of at least 20 when measured at 1.1 GHz or greater. The polymer composition exhibits a dielectric constant greater than 3.0 at 1.1 GHz when tested using a split post dielectric resonator and network analyzer on a sample size of 120 mm by 120 mm and 6 mm thickness according to ASTM D150. The polymer composition exhibits a dissipation factor of less than 0.002 at 1.1 GHz when tested using a split post dielectric resonator and network analyzer on a sample size of 120 mm by 120 mm and 6 mm thickness according to ASTM D150.
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60.发明申请公开(公告)号：US20210009885A1
公开(公告)日：2021-01-14
申请号：US16886153
申请日：2020-05-28
发明人： Toru UJIHARA , Yukihisa TAKEUCHI , Mingyu CHEN , Masashi NAGAYA
IPC分类号： C09K5/14 , C30B29/38 , C30B29/62 , C01B21/072 , C30B25/00
摘要： A method for producing AlN crystals includes using at least one element, excluding Si, that satisfies a condition under which the element forms a compound with neither Al nor N or a condition under which the element forms a compound with any of Al and N provided that the standard free energy of formation of the compound is larger than that of AlN; melting a composition containing at least Al and the element; and reacting the Al vapor with nitrogen gas at a predetermined reaction temperature to produce AlN crystals.
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