公开(公告)号：US11678579B2

公开(公告)日：2023-06-13

申请号：US17225468

申请日：2021-04-08

申请人： THE UNIVERSITY OF HONG KONG

发明人： Shien-Ping Feng ,  Chang Liu ,  Qikai Li

IPC分类号： H10N10/856 ,  C08F251/00 ,  C08J3/075 ,  H10N10/01 ,  H10N10/13 ,  H10N10/17

CPC分类号： H10N10/856 ,  C08F251/00 ,  C08J3/075 ,  H10N10/01 ,  H10N10/13 ,  H10N10/17

摘要： An ionic thermoelectric (i-TE) hydrogel that converts heat into electricity based on the Soret effect, and devices and methods incorporating the ionic thermoelectric hydrogel. The ionic thermoelectric hydrogel includes poly(acrylamide) crosslinked with an alginate, 1-ethyl-3-methylimidazolium tetrafluoroborate, and a poly glycol.

公开(公告)号：US20230180609A1

公开(公告)日：2023-06-08

申请号：US18061020

申请日：2022-12-02

申请人： The Government of the United States of America, as represented by the Secretary of the Navy

发明人： Boris N. Feigelson ,  Kevin P. Anderson ,  Benjamin L. Greenberg ,  James A. Wollmershauser ,  Alan G. Jacobs

IPC分类号： H10N10/01 ,  C04B35/117 ,  C04B35/488 ,  C04B35/626 ,  C04B35/64 ,  C04B35/628 ,  H10N10/852

CPC分类号： H10N10/01 ,  C04B35/117 ,  C04B35/488 ,  C04B35/6261 ,  C04B35/64 ,  C04B35/62884 ,  C04B35/62813 ,  C04B35/62823 ,  H10N10/852 ,  C04B2235/428 ,  C04B2235/3217 ,  C04B2235/3244 ,  C04B2235/5454 ,  C04B2235/614 ,  C04B2235/781 ,  C04B2235/785

摘要： Thermoelectric (TE) nanocomposite material that includes at least one component consisting of nanocrystals. A TE nanocomposite material in accordance with the present invention can include, but is not limited to, multiple nanocrystalline structures, nanocrystal networks or partial networks, or multi-component materials, with some components forming connected interpenetrating networks including nanocrystalline networks. The TE nanocomposite material can be in the form of a bulk solid having semiconductor nanocrystallites that form an electrically conductive network within the material. In other embodiments, the TE nanocomposite material can be a nanocomposite thermoelectric material having one network of p-type or n-type semiconductor domains and a low thermal conductivity semiconductor or dielectric network or domains separating the p-type or n-type domains that provides efficient phonon scattering to reduce thermal conductivity while maintaining the electrical properties of the p-type or n-type semiconductor.

公开(公告)号：US11658095B2

公开(公告)日：2023-05-23

申请号：US16370703

申请日：2019-03-29

申请人： Intel Corporation

发明人： Kelly Lofgreen ,  Chandra Mohan Jha ,  Krishna Vasanth Valavala

IPC分类号： H01L23/38 ,  H01L23/48 ,  H01L23/00 ,  H01L25/18 ,  H10N10/82 ,  H10N10/01

CPC分类号： H01L23/38 ,  H01L23/481 ,  H01L24/09 ,  H01L24/17 ,  H01L25/18 ,  H10N10/01 ,  H10N10/82 ,  H01L2924/1434

摘要： An IC package, comprising a first IC component comprising a first interconnect on a first surface thereof; a second IC component comprising a second interconnect on a second surface thereof. The second component is above the first component, and the second surface is opposite the first surface. A thermoelectric cooling (TEC) device is between the first surface and the second surface. The TEC device is electrically coupled to the first interconnect and to the second interconnect.

公开(公告)号：US20240363484A1

公开(公告)日：2024-10-31

申请号：US18308411

申请日：2023-04-27

申请人： Texas Instruments Incorporated

发明人： Archana Venugopal ,  Jingjing Chen

IPC分类号： H01L23/38 ,  H10N10/01 ,  H10N10/17

CPC分类号： H01L23/38 ,  H10N10/01 ,  H10N10/17

摘要： An electronic device includes a semiconductor die with first and second sides, a semiconductor layer extending to the first side, an array of unit cells arranged in rows columns, and a conductive reference terminal in the semiconductor layer that laterally surrounds the array, the first and second sides being spaced apart from one another by a thickness distance of 50 μm or less, and the respective unit cells including: a circuit component in the semiconductor layer; a holey semiconductor portion in the semiconductor layer that laterally surrounds the respective circuit component and includes holes that extend from the metallization structure toward the first side; and a conductive control terminal in the semiconductor layer that laterally surrounds the respective holey semiconductor portion, and an adhesive layer extends between the first side of the semiconductor die and a die attach pad.

公开(公告)号：US12114573B2

公开(公告)日：2024-10-08

申请号：US17685402

申请日：2022-03-03

申请人： National Cheng Kung University

发明人： Chia-Yun Chen ,  Kuan-Yi Kuo ,  Po-Hsuan Hsiao ,  Yi-Yin Lin

IPC分类号： H10N10/857 ,  C08K9/02 ,  C09D165/00 ,  H10N10/01 ,  H10N10/17

CPC分类号： H10N10/857 ,  C08K9/02 ,  C09D165/00 ,  H10N10/01 ,  H10N10/17 ,  C08K2201/011

摘要： A method for manufacturing a thermoelectric polymer film includes steps as follows. A conductive polymer liquid and a plurality of carbon nanotubes are mixed to form a mixture. The mixture is coated on a substrate to form a film precursor. Two electrode parts are arranged on the film precursor. An electric field is applied to the film precursor through the two electrode parts at a room temperature, so as to change an arrangement of the plurality of carbon nanotubes, such that the thermoelectric polymer film is formed.

公开(公告)号：US12114569B2

公开(公告)日：2024-10-08

申请号：US18061012

申请日：2022-12-02

申请人： The Government of the United States of America, as represented by the Secretary of the Navy

发明人： Boris N. Feigelson ,  Kevin P. Anderson ,  Benjamin L Greenberg ,  James A. Wollmershauser ,  Alan G. Jacobs

IPC分类号： H10N10/01 ,  C04B35/117 ,  C04B35/488 ,  C04B35/626 ,  C04B35/628 ,  C04B35/64 ,  C09C1/28 ,  C09C3/00 ,  C09C3/04 ,  C09C3/06 ,  H10N10/852 ,  H10N10/857

CPC分类号： H10N10/01 ,  C04B35/117 ,  C04B35/488 ,  C04B35/6261 ,  C04B35/62813 ,  C04B35/62823 ,  C04B35/62884 ,  C04B35/64 ,  C09C1/28 ,  C09C3/006 ,  C09C3/041 ,  C09C3/043 ,  C09C3/063 ,  H10N10/852 ,  H10N10/857 ,  C01P2002/60 ,  C01P2002/88 ,  C01P2004/64 ,  C01P2006/32 ,  C01P2006/40 ,  C04B2235/3217 ,  C04B2235/3244 ,  C04B2235/428 ,  C04B2235/5445 ,  C04B2235/5454 ,  C04B2235/614 ,  C04B2235/781 ,  C04B2235/785 ,  C04B2235/9607

摘要： Thermoelectric (TE) nanocomposite material that includes at least one component consisting of nanocrystals. A TE nanocomposite material in accordance with the present invention can include, but is not limited to, multiple nanocrystalline structures, nanocrystal networks or partial networks, or multi-component materials, with some components forming connected interpenetrating networks including nanocrystalline networks. The TE nanocomposite material can be in the form of a bulk solid having semiconductor nanocrystallites that form an electrically conductive network within the material. In other embodiments, the TE nanocomposite material can be a nanocomposite thermoelectric material having one network of p-type or n-type semiconductor domains and a low thermal conductivity semiconductor or dielectric network or domains separating the p-type or n-type domains that provides efficient phonon scattering to reduce thermal conductivity while maintaining the electrical properties of the p-type or n-type semiconductor.

公开(公告)号：US20240334832A1

公开(公告)日：2024-10-03

申请号：US18574080

申请日：2022-02-25

申请人： Sumitomo Electric Industries, Ltd. ,  Toyota School Foundation

发明人： Kotaro HIROSE ,  Masahiro ADACHI ,  Tsunehiro TAKEUCHI

IPC分类号： H10N10/817 ,  H10N10/01 ,  H10N10/82 ,  H10N10/851

CPC分类号： H10N10/817 ,  H10N10/01 ,  H10N10/82 ,  H10N10/8556

摘要： A thermoelectric conversion element includes a first electrode, a thermoelectric conversion material portion configured to convert heat into electricity, an intermediate layer arranged on the thermoelectric conversion material portion, a conductive bonding material arranged in between the intermediate layer and the first electrode to bond the first electrode to the intermediate layer, and a second electrode connected to the thermoelectric conversion material portion. The intermediate layer includes a first layer arranged on the thermoelectric conversion material portion and containing a dopant, and a second layer arranged on the first layer and configured to suppress diffusion of elements. The intermediate layer has an interface resistivity of not less than 0.0001 mΩcm2 and not more than 0.5 mΩcm2.

公开(公告)号：US12108676B2

公开(公告)日：2024-10-01

申请号：US17998917

申请日：2021-05-20

申请人： Denka Company Limited

发明人： Yasuaki Sakurai ,  Masahide Yamada ,  Jun Watanabe

IPC分类号： H10N10/855 ,  H10N10/01 ,  H10K85/00

CPC分类号： H10N10/855 ,  H10N10/01 ,  H10K85/00

摘要： An n-type material for thermoelectric conversion obtained by doping a p-type material for thermoelectric conversion with a dopant, the p-type material for thermoelectric conversion containing a carbon nanotube and a conductive resin, in which the dopant contains an anion that is a complex ion, an alkali metal cation, and a cation scavenger.

公开(公告)号：US20240324462A1

公开(公告)日：2024-09-26

申请号：US18735133

申请日：2024-06-05

申请人： TIANMA JAPAN, LTD. ,  Akita Prefecture

发明人： Nobuya SEKO ,  Kazuyuki Ise

IPC分类号： H10N10/17 ,  H10N10/01 ,  H10N10/81 ,  H10N10/854

CPC分类号： H10N10/17 ,  H10N10/01 ,  H10N10/81 ,  H10N10/854

摘要： A thermoelectric transducer includes a substrate, a thermoelectric film on the substrate, a first electrode on the substrate, and a second electrode on the substrate, the second electrode being different from the first electrode in work function. The first electrode and the second electrode are in contact with the same side of the thermoelectric film. The outer edge of the thermoelectric film is located inner than the outer edge of the substrate.

公开(公告)号：US20240298543A1

公开(公告)日：2024-09-05

申请号：US18587644

申请日：2024-02-26

申请人： Melexis Technologies NV

发明人： Carl VAN BUGGENHOUT

IPC分类号： H10N10/17 ,  H10N10/01 ,  H10N10/13

CPC分类号： H10N10/17 ,  H10N10/01 ,  H10N10/13

摘要： A method of manufacturing a thermal sensor (106) comprises providing a first part (102) of a body of the sensor (106), the first part (102) of the body being configured to define a first part (114) of a chamber (310). A second part (104) of the body of the sensor (106) is also provided, the second part (104) of the body being configured to define a second part (118) of the chamber (310). A getter material (112) is disposed in the first part (114) of the body of the sensor (106), and the first part (102) and the second part (104) of the body of the sensor (106) are brought together so that the first and second parts (102, 104) of the chamber (310) define the chamber (310). The chamber (310) is backfilled with a gas to a pressure greater than 10 mbar, and the first part (102) of the body is bonded to the second part (104) of the body so as to seal hermetically the chamber (310).