Abstract:
A memory system includes a memory and a memory controller operating to control the memory. The memory includes a random accessible memory including a memory cell array operable in a random access mode, a NAND flash memory, and a selection circuit making the memory controller operate either one of the random accessible memory or the NAND flash memory.
Abstract:
A method for programming a flash memory device with a plurality of memory cells. A selected memory cell is programmed under a condition where a bulk area is biased with a high voltage. A program pass/fail of the memory cell is verified with the high voltage applied to the bulk area.
Abstract:
A memory system and corresponding method for executing boot code stored therein are provided, the memory system including a mode decoder, a first memory in signal communication with the mode decoder, a second memory in signal communication with the mode decoder, and a mode generator in signal communication with the mode decoder for generating a signal indicative of selecting one of the first and second memories as the boot memory; and the method for executing boot code including initially booting the system from a first memory, programming a second memory for subsequent booting, programming a mode generator to subsequently boot the system from the second memory, and subsequently booting the system from the second memory.
Abstract:
An integrated circuit memory system includes an integrated circuit device having a random access memory array, a non-volatile memory array (e.g., flash memory array) and a data transfer circuit therein. The memory arrays and data transfer circuit may be included in a common integrated circuit chip. The random access memory (RAM) array includes a plurality of columns of RAM cells and a first plurality of bit lines, which are electrically connected to the plurality of columns of RAM cells. The non-volatile memory array includes a plurality of columns of non-volatile memory cells and a second plurality of bit lines, which are electrically connected to a plurality of columns of non-volatile memory cells. The data transfer circuit is electrically connected to the first and second pluralities of bit lines. The data transfer circuit is configured to support direct bidirectional communication between the first and second pluralities of bit lines.
Abstract:
A memory system includes a memory and a memory controller operating to control the memory. The memory includes a random accessible memory including a memory cell array operable in a random access mode, a NAND flash memory, and a selection circuit making the memory controller operate either one of the random accessible memory or the NAND flash memory.
Abstract:
A memory card includes: a first memory chip responding to all commands input externally; and a second memory chip responding to commands, among the commands input externally, relevant to reading, programming, and erasing operations with data. Card identification information stored in the first memory chip includes capacity information corresponding to a sum of sizes of the first and second memory chips. The plurality of memory chips of the memory card are useful in designing the memory card with storage capacity in various forms.
Abstract:
A method of operating a non-volatile memory device includes maintaining a write voltage at a predetermined voltage level for programming and/or erasing a memory cell of the non-volatile memory device during a time between execution of consecutive write operations. For example, the write voltage may be activated at the predetermined voltage level responsive to an initial write command, and discharge of the write voltage may be prevented responsive to a signal indicating consecutive write commands. Related devices are also discussed.
Abstract:
An integrated circuit memory device includes programmed memory cells and programmable and erasable memory cells. The memory device includes a first memory array block in which programmed memory cells are arranged and a second memory array block in which programmable and erasable memory cells are arranged. The programmed memory cells in the first memory array block may be programmed with predetermined data during a semiconductor manufacturing process, and may be mask read-only memory (ROM) cells. The programmable and erasable memory cells in the second memory array block may be programmed or erased with predetermined data after the semiconductor manufacturing process, and may be electrically erasable and programmable read-only memory (EEPROM) cells or flash memory cells.
Abstract:
A phase locked loop (PLL) integrated circuit includes a voltage-controlled oscillator (VCO) configured to generate a clock signal at an output terminal thereof. The VCO is further configured to improve the frequency response of the PLL by varying a capacitance of the output terminal concurrently with changing a frequency of the clock signal. The VCO may include a control signal generator, which is configured to generate a plurality of control signals in response to UP and DOWN pumping signals, and an oscillator, which is configured to generate the clock signal in response to the plurality of control signals. The oscillator may be a ring oscillator, which is responsive to the plurality of control signals.
Abstract:
An integrated circuit memory device includes programmed memory cells and programmable and erasable memory cells. The memory device includes a first memory array block in which programmed memory cells are arranged and a second memory array block in which programmable and erasable memory cells are arranged. The programmed memory cells in the first memory array block may be programmed with predetermined data during a semiconductor manufacturing process, and may be mask read-only memory (ROM) cells. The programmable and erasable memory cells in the second memory array block may be programmed or erased with predetermined data after the semiconductor manufacturing process, and may be electrically erasable and programmable read-only memory (EEPROM) cells or flash memory cells.