Abstract:
An integrated circuit memory device includes programmed memory cells and programmable and erasable memory cells. The memory device includes a first memory array block in which programmed memory cells are arranged and a second memory array block in which programmable and erasable memory cells are arranged. The programmed memory cells in the first memory array block may be programmed with predetermined data during a semiconductor manufacturing process, and may be mask read-only memory (ROM) cells. The programmable and erasable memory cells in the second memory array block may be programmed or erased with predetermined data after the semiconductor manufacturing process, and may be electrically erasable and programmable read-only memory (EEPROM) cells or flash memory cells.
Abstract:
An integrated circuit memory device includes programmed memory cells and programmable and erasable memory cells. The memory device includes a first memory array block in which programmed memory cells are arranged and a second memory array block in which programmable and erasable memory cells are arranged. The programmed memory cells in the first memory array block may be programmed with predetermined data during a semiconductor manufacturing process, and may be mask read-only memory (ROM) cells. The programmable and erasable memory cells in the second memory array block may be programmed or erased with predetermined data after the semiconductor manufacturing process, and may be electrically erasable and programmable read-only memory (EEPROM) cells or flash memory cells.
Abstract:
An integrated circuit memory device includes programmed memory cells and programmable and erasable memory cells. The memory device includes a first memory array block in which programmed memory cells are arranged and a second memory array block in which programmable and erasable memory cells are arranged. The programmed memory cells in the first memory array block may be programmed with predetermined data during a semiconductor manufacturing process, and may be mask read-only memory (ROM) cells. The programmable and erasable memory cells in the second memory array block may be programmed or erased with predetermined data after the semiconductor manufacturing process, and may be electrically erasable and programmable read-only memory (EEPROM) cells or flash memory cells.
Abstract:
An integrated circuit memory device includes programmed memory cells and programmable and erasable memory cells. The memory device includes a first memory array block in which programmed memory cells are arranged and a second memory array block in which programmable and erasable memory cells are arranged. The programmed memory cells in the first memory array block may be programmed with predetermined data during a semiconductor manufacturing process, and may be mask read-only memory (ROM) cells. The programmable and erasable memory cells in the second memory array block may be programmed or erased with predetermined data after the semiconductor manufacturing process, and may be electrically erasable and programmable read-only memory (EEPROM) cells or flash memory cells.
Abstract:
A memory device includes a predecoder that receives a row address and responsively generates a plurality of memory block selection signals, a plurality of word line selection signals, a plurality of source line selection signals, and a plurality of sub-block selection signals including respective groups of signals that correspond to respective levels of a hierarchy of sub-blocks in a plurality of memory blocks. The device further includes a global decoder that receives the sub-block selection signals and responsively generates segment activation signals for respective segments of memory blocks that correspond to respective sub-blocks at a lowest level of the hierarchy of sub-blocks. A plurality of word line decoders are coupled to word lines of respective ones of plurality of the memory blocks, with each word line decoder configured to receive the segment activation signals, a memory block selection signal and the word line selection signals and to responsively generate word line signals on the word lines coupled thereto. A plurality of source line decoders are coupled to source lines of respective ones of the plurality of memory blocks, each source line decoder configured to receive the segment activation signals, with a memory block selection signal, and the source line selection signals and to responsively generate source line signals one the source lines coupled thereto.
Abstract:
Example embodiments provide a method and apparatus of correcting error data due to charge loss within a non-volatile memory device including a plurality of memory cells. The method of correcting error data within the non-volatile memory devices may include detecting error data in a second data group by comparing a first data group read from memory cells in response to a first voltage with the second data group read from memory cells in response to a second voltage. The second voltage is higher than the first voltage. Error data in the first data group is detected by error-correcting code (ECC). Re-writing data in the memory cells is performed by correcting error data in the first data group and error data in the second data group. A central processing unit (CPU) may detect error in the second data group. The second data group may be read through a page buffer and compared with the first data group stored in a SRAM. The detected error may be updated to the page buffer. Error data in the first data group may be updated to the page buffer. The CPU corrects error in the final error data, and the page buffer rewrites the corrected data in the plurality of memory cells.
Abstract:
A memory device includes a predecoder that receives a row address and responsively generates a plurality of memory block selection signals, a plurality of word line selection signals, a plurality of source line selection signals, and a plurality of sub-block selection signals including respective groups of signals that correspond to respective levels of a hierarchy of sub-blocks in a plurality of memory blocks. The device further includes a global decoder that receives the sub-block selection signals and responsively generates segment activation signals for respective segments of memory blocks that correspond to respective sub-blocks at a lowest level of the hierarchy of sub-blocks. A plurality of word line decoders are coupled to word lines of respective ones of plurality of the memory blocks, with each word line decoder configured to receive the segment activation signals, a memory block selection signal and the word line selection signals and to responsively generate word line signals on the word lines coupled thereto. A plurality of source line decoders are coupled to source lines of respective ones of the plurality of memory blocks, each source line decoder configured to receive the segment activation signals, with a memory block selection signal, and the source line selection signals and to responsively generate source line signals one the source lines coupled thereto.
Abstract:
Provided are a Radio Frequency IDentification (RFID) tag with a signal reception method. The RFID tag includes a demodulator that receives a read signal containing read data. The demodulator includes; a voltage generating circuit that provides a first voltage signal and a second voltage signal derived from the received read signal, an inverter that provides a data pulse signal indicative of the read data by inverting the second voltage signal using an inverting voltage defined in relation to the first voltage signal, and a buffer that recovers the read data by buffering the data pulse signal.
Abstract:
Methods and apparatuses for changing capacitance are provided. The apparatus may adjust a current supplied to a load capacitor according to the frequency of an input clock signal. When operating at a lower frequency, a capacitance may be increased such that noise immunity may be increased. When operating at a higher frequency, a capacitance may be decreased such that current consumption may be reduced.
Abstract:
A phase locked loop (PLL) integrated circuit includes a voltage-controlled oscillator (VCO) configured to generate a clock signal at an output terminal thereof. The VCO is further configured to improve the frequency response of the PLL by varying a capacitance of the output terminal concurrently with changing a frequency of the clock signal. The VCO may include a control signal generator, which is configured to generate a plurality of control signals in response to UP and DOWN pumping signals, and an oscillator, which is configured to generate the clock signal in response to the plurality of control signals. The oscillator may be a ring oscillator, which is responsive to the plurality of control signals.