Abstract:
A recording method for an optical disk drive is implemented as follows. First, at least one of the level of the focusing error signal, the level of the tracking error signal, a wobble synchronization pattern loss, the error rate of demodulating a wobble signal, the frequency of buffer under-run occurrence, the temperature of the drive, the wobble jitter and the level of write power is detected. If at least one detected value exceeds the preset value, the recording will be ceased. Then, the rotation speed of the optical disk drive is decreased, and the recording is resumed with the decreased rotation speed. If at least one of the temperature of the drive, the wobble jitter and the estimated write power exceeds the reset value before recording starts, the rotation speed of the optical disk drive is decreased before recording.
Abstract:
Provided are a system and method for creating a reticle field layout (RFL). In one example, the method includes receiving information for a RFL design by a computer system directly from a user via a computer interface. The RFL design is automatically verified using predefined specification and design rules accessible to the computer system. The RFL design may be modified by adding additional features before being finalized.
Abstract:
A biosensor with multi-channel A/D conversion and a method thereof are provided. The present biosensor includes a chip generating a time-dependent analog signal in response to a content of a specific component of a specimen provided thereon, a multi-channel A/D converter, and a microprocessor. The multi-channel A/D converter has multiple channels simultaneously receiving the time-dependent analog signal in each sampling interval to convert the time-dependent analog signal to a set of digital signals. The microprocessor receives the sets of digital signals in a period of sampling time and determines the content of the specific component based on the sets of digital signals. The present biosensor provides a multi-channel A/D conversion for the time-dependent analog signal to improve the resolution of the determination of the content of the specific component.
Abstract:
A memory card ejecting structure includes an electrically insulative frame base, the frame base having a receiving unit mounted with a set of terminals for receiving a memory card and two arms forwardly extended from two opposite lateral sides of the receiving unit, the receiving unit having an endless guide groove, an ejecting member slidably mounted in the frame base and adapted for ejecting the inserted memory card out of the receiving unit, and a spring member connected between the ejecting member and one arm of the frame base, the spring member having an angled locating wire rod backwardly extended from a rear end ring thereof and positioned in the endless guide groove to hold the spring member between a stretched position and a released position.
Abstract:
An electronic device reads a layout file of a printed circuit board (PCB) to be manufactured from a storage device, obtains length information and section area information of copper cladding distributed on power source areas and ground trace areas in each of one or more layers of the PCB to be manufactured by analyzing the layout file, and calculates power loss in each of the one or more layers according to the length information, the section area information, a resistance value of the copper cladding, and preset parameters of a power supply module and an integrated circuit (IC) load to be located on the PCB. In response to a determination that the power loss in the layer exceeds a preset range, the electronic device indicates the locations of the power source areas and the ground trace areas of a layer in the PCB layout file which need to be redesigned.
Abstract:
In a method for inspecting the layout of a printed circuit board (PCB), a component to be checked is determined from an electronic layout diagram of the PCB, and a power transmission line which may be serving that component is selected. The layout diagram is checked to determine whether the component is connected to the power transmission line, and further checked to determine whether more than one ground pins of the component is connected to the power transmission line. Vias that are shared by two or more ground pins of the component are determined if more than one ground pin is connected to the power transmission line. Shared vias are marked on the layout diagram.
Abstract:
A printed circuit board (PCB) comprising a first circuit area, a second circuit area, a plurality of connecting elements, and a plurality of connecting terminals placed on the first circuit area, wherein the first circuit area are electrically connected to the second circuit area through the plurality of connecting elements, the plurality of connecting elements are arranged in sequence to extend toward the plurality of connecting terminals, to form shortest current paths from the second circuit area via corresponding one of the connecting elements to the connecting terminals, respectively, and each shortest current path between the corresponding one of the connecting elements and the corresponding one of the connecting terminals is uncoated with conductive material.
Abstract:
A system for optimizing a current overload protection circuit includes an input device, a data storage device, a central processing device, and a display. The central processing device includes a storage module, a control module, and a calculation module. The storage module stores a VI application therein. The control module receives instructions from the input device and selects virtual electronic components of the current overload protection circuit from the data storage device and connection of the selected electronic components. The current overload protection circuit is completed and run in the VI application; electronic components significantly affecting the maximum protection current are labeled. The calculation module calculates normal distribution samples of the current overload protection circuit based on the labeled electronic components. The display shows whether the current overload protection circuit meets a process capability standard.
Abstract:
The present disclosure illustrates a feedforward controlled envelope modulator and a feedforward control circuit thereof. The feedforward controlled envelope modulator comprises a linear amplifier circuit, a switching amplifier, and a feedforward control circuit. The linear amplifier circuit amplifies an input voltage signal, so as to output an output voltage signal to a load node. The switching amplifier receives a comparison signal, and outputs a switching current to the load node according to the comparison signal. The feedforward control circuit comprises a duplicate linear amplifier circuit and a hysteresis comparator. The duplicate linear amplifier circuit amplifies the input voltage signal, so as to output a reference voltage signal, wherein an amplifying gain of the duplicate linear amplifier circuit is identical to an amplifying gain of the linear amplifier circuit. The hysteresis comparator compares the output voltage signal and the reference voltage signal, so as to output the comparison signal.
Abstract:
A printed circuit board includes a plurality of power layers. Each power layer defining a number of vias arranged in a number of rows. The number of the power layers is N (N>3). The power layers are defined as a 1st, 2nd, . . . , Nth power layer. The vias of the 1st power layer are connected to other power layers by a step-shaped connection means.