公开(公告)号：US20220351891A1

公开(公告)日：2022-11-03

申请号：US17731265

申请日：2022-04-28

Applicant: CYNTEC CO., LTD.

Inventor： Chih Hung Wei ,  Min Lian Kuo

IPC: H01F27/255 ,  H01F27/29 ,  H01F27/30 ,  H01F41/02 ,  H01F41/04

Abstract: An electrical component, comprising: a magnetic body and a coil disposed in the magnetic body, wherein the magnetic body comprises a first magnetic powder and a second magnetic powder, wherein the D50 of the first magnetic powder is greater than the D50 of the second magnetic powder, wherein the D90 of the first magnetic powder is not greater than 50 um, and the D90 of the second magnetic powder is not greater than 50 um.

公开(公告)号：US20220336139A1

公开(公告)日：2022-10-20

申请号：US17720281

申请日：2022-04-13

Applicant: CYNTEC CO., LTD.

Inventor： Li-Jung Yang ,  Xiang Jun Li ,  Chenlun Huang

IPC: H01F27/28 ,  H01F27/32 ,  H01F27/24 ,  H01F27/02 ,  H01F41/04 ,  H01F41/12

Abstract: A coupled inductor has two coils made by film processes, wherein a first coil is disposed on a top surface of a magnetic sheet and a second coil is disposed on a bottom surface of the magnetic sheet, for controlling the variations of the gap between the two coils in a smaller range.

公开(公告)号：US11428716B2

公开(公告)日：2022-08-30

申请号：US17070899

申请日：2020-10-14

Applicant: CYNTEC CO., LTD.

Inventor： Po-Wen Liu

IPC: G01R19/00 ,  G01R1/20 ,  G01R15/14

Abstract: A current detection device including two conductors, a resistor and two detection portions is provided. The resistor is disposed between the two conductors. At least one of the detection portions is a detection terminal including a first terminal portion and a second terminal portion. The first terminal portion includes a first flange and a second flange, the second flange is connected to the second terminal portion, and at least one portion of the second flange is buried into at least one conductor. The first flange is buried into the at least one conductor, a distal end of the first flange does not protrude beyond the second surface, a distance is kept between the distal end of the first flange and the second surface, a gap is defined between the first flange and the second flange, and at least one portion of the gap is filled with a material of the at least one conductor.

公开(公告)号：US11355272B2

公开(公告)日：2022-06-07

申请号：US15865287

申请日：2018-01-09

Applicant: CYNTEC CO., LTD.

Inventor： Yung-Cheng Chang ,  Chih-Siang Chuang ,  Yi-Min Huang

IPC: H01F27/02 ,  H01F5/04 ,  H01F3/10 ,  H01F17/04 ,  H01F27/29

Abstract: An electronic component comprising: a body; a conductive wire in the body; and a first lead comprising a first part disposed on a first surface of the body and a second part disposed on a second surface of the body, wherein the second part of the first lead comprises a first protrusion portion and a second protrusion portion spaced apart from each other, wherein a first portion of a first terminal part of the conductive wire is disposed between the first protrusion portion and the second part of the first lead disposed on the second surface of the body, and a second portion of the first terminal part of the conductive wire is disposed between the second protrusion portion and the second part of the first lead disposed on the second surface of the body.

公开(公告)号：US20220158491A1

公开(公告)日：2022-05-19

申请号：US17522925

申请日：2021-11-10

Applicant: CYNTEC CO., LTD.

Inventor： TSUNG-CHAN WU ,  Yen-Ming Liu ,  Chien-Hui Chen

IPC: H02J50/10 ,  H02J7/00 ,  H05K7/20 ,  H02J50/70 ,  H01L35/00

Abstract: A wireless charger comprises a top cover; a metallic case; and a first thermoelectric cooler chip, disposed between a bottom surface of the top cover and a top surface of the metallic case to form a heat conductive path from the top cover to the metallic case via the first thermoelectric cooler chip for dissipating heat generated by an electronic device disposed on the top cover for wireless charging the electronic device.

公开(公告)号：US20220157512A1

公开(公告)日：2022-05-19

申请号：US17317904

申请日：2021-05-12

Applicant: CYNTEC CO., LTD.

Inventor： Min-Feng Chung ,  Kuan Yu Chiu ,  Ching Hsiang Yu

IPC: H01F27/28 ,  H01F27/24 ,  H01F41/04 ,  H01F27/32

Abstract: A structure for forming a 3D-coil transponder, wherein each group of leads is encapsulated by a separated insulating molding body and a magnetic body disposed over the plurality of separated groups of leads, wherein each said insulating molding body does not extend across two or more groups of leads.

公开(公告)号：US11031255B2

公开(公告)日：2021-06-08

申请号：US16782039

申请日：2020-02-04

Applicant: CYNTEC CO., LTD.

Inventor： Bau-Ru Lu ,  Da-Jung Chen ,  Yi-Cheng Lin

IPC: H01L23/00 ,  H01L21/48 ,  H01L23/495 ,  H01L21/768 ,  H01L25/00 ,  H01L25/16

Abstract: A method for forming a conductive structure is disclosed, the method comprising the steps of: forming a metallic frame having a plurality of metal parts separated from each other; forming an insulating layer on the top surface of the plurality of metal parts; and forming a conductive pattern layer on the insulating layer for making electrical connections with at least one portion of the plurality of metal parts.

公开(公告)号：US20210159537A1

公开(公告)日：2021-05-27

申请号：US16698131

申请日：2019-11-27

Applicant: Cyntec Co., Ltd.

Inventor： Chihung Su ,  Wenhsiung Liao

IPC: H01M10/0562 ,  H01M4/04 ,  H01M2/16

Abstract: A solid-state battery includes a first electrode; a second electrode having a first side facing a first side of the first electrode and spaced from the first electrode; and a solid electrolyte at least partially disposed in a space between the first electrode and the second electrode for providing a path for metal ions associated with the first electrode and/or the second electrode to move through. The metal ions are kept differentially distributed along the path.

公开(公告)号：US20210105898A1

公开(公告)日：2021-04-08

申请号：US16592786

申请日：2019-10-04

Applicant: CYNTEC CO., LTD.

Inventor： KAIPENG CHIANG ,  DA-JUNG CHEN ,  BAU-RU LU ,  CHUN HSIEN LU

IPC: H05K1/18 ,  H05K1/02 ,  H05K7/20 ,  H05K3/34 ,  H02M3/156

Abstract: An electronic module, such as a VRM, has a power inductor and power wave pins disposed on a bottom surface of a circuit board so as to reduce the size and increase the heat dissipation capability of the VRM.

公开(公告)号：US10854575B2

公开(公告)日：2020-12-01

申请号：US15961865

申请日：2018-04-24

Applicant: CYNTEC CO., LTD.

Inventor： Bau-Ru Lu ,  Ming-Chia Wu ,  Shao Wei Lu

IPC: H01L25/065 ,  H01L23/552 ,  H01L23/13 ,  H01L23/538 ,  H01L23/31 ,  H01L25/11 ,  H01L25/07 ,  H01L25/00 ,  H01L23/36 ,  H01L23/373 ,  H01L23/40 ,  H01L23/498 ,  H01L23/00 ,  H05K5/02 ,  H05K5/06 ,  H05K1/11 ,  H05K3/42 ,  H05K7/02 ,  H05K7/20

Abstract: The present invention discloses a three-dimensional package structure which can achieve a relatively high utilization of an internal space thereof, so that a size of electronic package structure can be reduced. The three-dimensional package structure comprises a first electronic component, a plurality of second electronic components and a plurality of conductive patterns. The first electronic component has a top surface and a bottom surface. The plurality of second electronic components are disposed over the top surface of the first electronic component. The plurality of conductive patterns are disposed over the plurality of second electronic components to electrically connect the plurality of second electronic components and the first electronic component.