公开(公告)号：US20070105288A1

公开(公告)日：2007-05-10

申请号：US11588331

申请日：2006-10-27

申请人： Hidekazu Miyairi ,  Chiho Kokubo ,  Koki Inoue

发明人： Hidekazu Miyairi ,  Chiho Kokubo ,  Koki Inoue

IPC分类号： H01L21/84

CPC分类号： H01L21/02672 ,  H01L21/02675 ,  H01L21/2022 ,  H01L21/2026 ,  H01L27/1277

摘要： A manufacturing method of a semiconductor device with improved operating characteristics and reliability is provided. An amorphous semiconductor film is formed over a substrate, doped with a metal element promoting crystallization, and crystallized by first heat treatment to form a crystalline semiconductor film; a first oxide film formed over the crystalline semiconductor film is removed and a second oxide film is formed; the crystalline semiconductor film having the second oxide film formed thereover is irradiated with first laser light; a semiconductor film containing a rare gas element is formed over the second oxide film; the metal element contained in the crystalline semiconductor film is gettered to the semiconductor film containing a rare gas element by second heat treatment; the semiconductor film containing a rare gas element and the second oxide film are removed; and the crystalline semiconductor film is irradiated with second laser light in an atmosphere containing oxygen.

摘要翻译： 提供了具有改进的操作特性和可靠性的半导体器件的制造方法。 在衬底上形成非晶半导体膜，掺杂有促进结晶的金属元素，并通过第一热处理结晶以形成晶体半导体膜; 去除在结晶半导体膜上形成的第一氧化膜，形成第二氧化膜; 用第一激光照射其上形成有第二氧化膜的结晶半导体膜; 在第二氧化物膜上形成含有稀有气体元素的半导体膜; 包含在结晶半导体膜中的金属元素通过第二热处理被吸收到含有稀有气体元素的半导体膜上; 去除含有稀有气体元素和第二氧化物膜的半导体膜; 在含氧气氛中用第二激光照射结晶半导体膜。

公开(公告)号：US07179699B2

公开(公告)日：2007-02-20

申请号：US10920316

申请日：2004-08-18

申请人： Hidekazu Miyairi ,  Atsuo Isobe ,  Tomoaki Moriwaka ,  Akihisa Shimomura

发明人： Hidekazu Miyairi ,  Atsuo Isobe ,  Tomoaki Moriwaka ,  Akihisa Shimomura

IPC分类号： H01L21/00

CPC分类号： H01L21/02691 ,  C30B1/00 ,  C30B29/06 ,  H01L21/02529 ,  H01L21/02532 ,  H01L21/02683 ,  H01L21/2022 ,  H01L21/2026 ,  H01L21/76825 ,  H01L21/76828 ,  H01L27/1281 ,  H01L29/045 ,  H01L29/42384 ,  H01L29/66757 ,  H01L29/78603 ,  H01L29/78654 ,  H01L29/78675 ,  H01L29/78684

摘要： The objective of the invention is to provide a method of fabricating semiconductor device using a laser crystallization method capable of preventing a grain boundary from being formed on the channel-forming region of a TFT and preventing the mobility of the TFT from extremely deteriorating, on-current from decreasing, or off-current from increasing due to a grain boundary and a semiconductor device fabricated by the fabrication method. Striped (banded) or rectangular concave and convex portions are formed. Then, a semiconductor film formed on an insulating film is irradiated with a laser beam diagonally to the longitudinal direction of concave and convex portions on the insulating film.

摘要翻译： 本发明的目的是提供一种使用能够防止在TFT的沟道形成区域上形成晶界并防止TFT的迁移率极度恶化的激光晶化方法的半导体器件的制造方法， 电流来自由晶界引起的增加或截止电流，以及通过制造方法制造的半导体器件。 形成带状（带状）或矩形凹凸部。 然后，在绝缘膜上形成的半导体膜被照射在绝缘膜上的凹凸部的纵向方向上对角线的激光束。

公开(公告)号：US07141823B2

公开(公告)日：2006-11-28

申请号：US10254670

申请日：2002-09-26

申请人： Takashi Hamada ,  Hidekazu Miyairi ,  Takuya Matsuo ,  Naoki Makita ,  Katsumi Nomura

发明人： Takashi Hamada ,  Hidekazu Miyairi ,  Takuya Matsuo ,  Naoki Makita ,  Katsumi Nomura

IPC分类号： H01L31/072

CPC分类号： H01L29/78696 ,  H01L27/12 ,  H01L29/42384 ,  H01L29/66757 ,  H01L29/78621 ,  H01L29/78627 ,  H01L29/78675 ,  H01L2029/7863

摘要： In a TFT with a GOLD structure, there is provided a structure which is able to improve an operating characteristic and reliability and reduce an off current value in order to reduce power consumption of a semiconductor device. The surface of LDD region (4) overlapped with a portion (7a) of a gate electrode through a gate insulating film (6) interposed therebetween is extremely flattened. Thus, it is possible to obtain a TFT structure which is capable of reducing a parasitic capacitance in the LDD region of the TFT with the GOLD structure, reducing an off current value, improving reliability, and enabling high speed operation.

摘要翻译： 在具有GOLD结构的TFT中，提供了能够提高工作特性和可靠性并降低截止电流值以降低半导体器件的功耗的结构。 通过栅绝缘膜（6）与栅电极的部分（7a）重叠的LDD区（4）的表面极其平坦化。 因此，可以获得能够降低具有GOLD结构的TFT的LDD区域中的寄生电容的TFT结构，从而降低截止电流值，提高可靠性并实现高速运行。

公开(公告)号：US07138306B2

公开(公告)日：2006-11-21

申请号：US10252828

申请日：2002-09-24

申请人： Koichiro Tanaka ,  Hidekazu Miyairi ,  Aiko Shiga ,  Akihisa Shimomura ,  Atsuo Isobe

发明人： Koichiro Tanaka ,  Hidekazu Miyairi ,  Aiko Shiga ,  Akihisa Shimomura ,  Atsuo Isobe

IPC分类号： H01L21/00

CPC分类号： H01L21/02675 ,  B23K26/0604 ,  B23K26/0608 ,  B23K26/0732 ,  B23K26/0736 ,  B23K26/0738 ,  B23K26/352 ,  B23K2101/40 ,  H01L21/02532 ,  H01L21/02592 ,  H01L21/268 ,  H01L21/283 ,  H01L27/1285 ,  H01L27/1296 ,  H01L27/14625

摘要： The present invention is characterized in that by laser beam being slantly incident to the convex lens, an aberration such as astigmatism or the like is occurred, and the shape of the laser beam is made linear on the irradiation surface or in its neighborhood. Since the present invention has a very simple configuration, the optical adjustment is easier, and the device becomes compact in size. Furthermore, since the beam is slantly incident with respect to the irradiated body, the return beam can be prevented.

公开(公告)号：US07015083B2

公开(公告)日：2006-03-21

申请号：US10944933

申请日：2004-09-21

申请人： Shunpei Yamazaki ,  Setsuo Nakajima ,  Hidekazu Miyairi

发明人： Shunpei Yamazaki ,  Setsuo Nakajima ,  Hidekazu Miyairi

IPC分类号： H01L21/84

CPC分类号： H01L21/0237 ,  H01L21/02488 ,  H01L21/02532 ,  H01L21/02667 ,  H01L21/02672 ,  H01L21/02686 ,  H01L27/12 ,  H01L27/1277 ,  H01L27/1285 ,  H01L27/3244 ,  H01L29/66757 ,  H01L29/78621 ,  H01L29/78675 ,  H01L2251/5315

摘要： After crystallization of a semiconductor film is performed by irradiating first laser light (energy density of 400 to 500 mJ/cm2) in an atmosphere containing oxygen, an oxide film formed by irradiating the first laser light is removed. It is next performed to irradiate second laser light under an atmosphere that does not contain oxygen (at a higher energy density than that of the first laser light irradiation), thus to increase the flatness of the semiconductor film.

摘要翻译： 通过在含有氧的气氛中照射第一激光（能量密度为400〜500mJ / cm 2）的能量密度进行半导体膜的结晶化后，除去通过照射第一激光而形成的氧化膜 。 接下来，在不含氧的气氛（比第一激光照射的能量密度高的环境）下照射第二激光，从而增加半导体膜的平坦度。

公开(公告)号：US20050205869A1

公开(公告)日：2005-09-22

申请号：US11107822

申请日：2005-04-18

申请人： Shunpei Yamazaki ,  Atsuo Isobe ,  Tamae Takano ,  Hidekazu Miyairi

发明人： Shunpei Yamazaki ,  Atsuo Isobe ,  Tamae Takano ,  Hidekazu Miyairi

IPC分类号： H01L21/20 ,  H01L21/77 ,  H01L21/84 ,  H01L27/12 ,  H01L29/04

CPC分类号： H01L21/02691 ,  H01L21/02678 ,  H01L21/02683 ,  H01L21/2022 ,  H01L27/12 ,  H01L27/1281

摘要： To provide devices relating to a manufacturing method for a semiconductor device using a laser crystallization method, which is capable of reducing a cost involved in a design change, preventing a grain boundary from developing in a channel formation region of a TFT, and preventing a remarkable reduction in mobility of the TFT, a decrease in an ON current, and an increase in an OFF current due to the grain boundary and to a semiconductor device formed by using the manufacturing method. In a semiconductor device according to the present invention, among a plurality of TFTs formed on a base film, some TFTs are electrically connected to form logic elements. The plurality of logic elements are used to form a circuit. The base film has a plurality of projective portions having a rectangular or stripe shape. Island-like semiconductor films included in each of the plurality of TFTs are formed between the plurality of projective portions and also, are crystallized by a laser light scanned in a longitudinal direction of the projective portions.

公开(公告)号：US06933527B2

公开(公告)日：2005-08-23

申请号：US10330025

申请日：2002-12-27

申请人： Atsuo Isobe ,  Koji Dairiki ,  Hiroshi Shibata ,  Chiho Kokubo ,  Tatsuya Arao ,  Masahiko Hayakawa ,  Hidekazu Miyairi ,  Akihisa Shimomura ,  Koichiro Tanaka ,  Shunpei Yamazaki ,  Mai Akiba

发明人： Atsuo Isobe ,  Koji Dairiki ,  Hiroshi Shibata ,  Chiho Kokubo ,  Tatsuya Arao ,  Masahiko Hayakawa ,  Hidekazu Miyairi ,  Akihisa Shimomura ,  Koichiro Tanaka ,  Shunpei Yamazaki ,  Mai Akiba

IPC分类号： H01L21/20 ,  H01L21/336 ,  H01L21/77 ,  H01L21/84 ,  H01L27/12 ,  H01L29/786 ,  H01L29/104 ,  H01L31/036 ,  H01L31/0376 ,  H01L31/20

CPC分类号： H01L21/02683 ,  H01L21/2022 ,  H01L27/1281 ,  H01L27/1296 ,  H01L29/66757 ,  H01L29/78603 ,  H01L29/78675 ,  H01L29/78696

摘要： It is a problem to provide a semiconductor device production system using a laser crystallization method capable of preventing grain boundaries from forming in a TFT channel region and further preventing conspicuous lowering in TFT mobility due to grain boundaries, on-current decrease or off-current increase. An insulation film is formed on a substrate, and a semiconductor film is formed on the insulation film. Due to this, preferentially formed is a region in the semiconductor film to be concentratedly applied by stress during crystallization with laser light. Specifically, a stripe-formed or rectangular concavo-convex is formed on the semiconductor film. Continuous-oscillation laser light is irradiated along the striped concavo-convex or along a direction of a longer or shorter axis of rectangle.

摘要翻译： 提供一种使用能够防止在TFT沟道区域中形成晶界的激光晶体化方法的半导体器件制造系统的问题，并且进一步防止由于晶界引起的TFT迁移率的明显降低，导通电流降低或截止电流增加 。 在基板上形成绝缘膜，在绝缘膜上形成半导体膜。 由此，优选形成半导体膜中通过激光在结晶期间通过应力集中施加的区域。 具体地，在半导体膜上形成条状或矩形凹凸。 连续振荡激光沿着条纹凹凸或长轴或短轴方向照射。

公开(公告)号：US06884668B2

公开(公告)日：2005-04-26

申请号：US10370055

申请日：2003-02-21

申请人： Shunpei Yamazaki ,  Atsuo Isobe ,  Tamae Takano ,  Hidekazu Miyairi

发明人： Shunpei Yamazaki ,  Atsuo Isobe ,  Tamae Takano ,  Hidekazu Miyairi

IPC分类号： H01L21/20 ,  H01L21/77 ,  H01L21/84 ,  H01L27/12 ,  H01L21/00 ,  H01L29/04

CPC分类号： H01L21/02691 ,  H01L21/02678 ,  H01L21/02683 ,  H01L21/2022 ,  H01L27/12 ,  H01L27/1281

摘要： To provide devices relating to a manufacturing method for a semiconductor device using a laser crystallization method, which is capable of reducing a cost involved in a design change, preventing a grain boundary from developing in a channel formation region of a TFT, and preventing a remarkable reduction in mobility of the TFT, a decrease in an ON current, and an increase in an OFF current due to the grain boundary and to a semiconductor device formed by using the manufacturing method. In a semiconductor device according to the present invention, among a plurality of TFTs formed on a base film, some TFTs are electrically connected to form logic elements. The plurality of logic elements are used to form a circuit. The base film has a plurality of projective portions having a rectangular or stripe shape. Island-like semiconductor films included in each of the plurality of TFTs are formed between the plurality of projective portions and also, are crystallized by a laser light scanned in a longitudinal direction of the projective portions.

摘要翻译： 为了提供与使用激光结晶法的半导体器件的制造方法相关的装置，其能够降低设计变化中涉及的成本，防止晶界在TFT的沟道形成区域中发展，并且防止显着 TFT的迁移率的降低，导通电流的降低以及由于晶界引起的关断电流的增加以及通过使用该制造方法形成的半导体器件。 在根据本发明的半导体器件中，在形成在基膜上的多个TFT中，一些TFT电连接形成逻辑元件。 多个逻辑元件用于形成电路。 基膜具有多个具有矩形或条状的突出部分。 包含在多个TFT中的多个TFT中的岛状半导体膜形成在多个投影部之间，并且通过沿着投影部的纵向扫描的激光而结晶化。

公开(公告)号：US06803296B2

公开(公告)日：2004-10-12

申请号：US10157233

申请日：2002-05-30

申请人： Hidekazu Miyairi

发明人： Hidekazu Miyairi

IPC分类号： H01L2120

CPC分类号： H01L21/02686 ,  H01L21/02683 ,  H01L21/2026 ,  H01L27/1214 ,  H01L27/1274 ,  H01L29/66757 ,  H01L29/78621 ,  H01L29/78645 ,  H01L29/78648 ,  H01L29/78675

摘要： To obtain a TFT, in which an off-current value is low and the fluctuation is suppressed, and an electronic equipment provided with the TFT. A film deposition temperature is set to substantially the same between a base insulating film and an amorphous semiconductor film to improve flatness of the semiconductor film. Then, laser light irradiation is conducted.

摘要翻译： 为了获得其中截止电流值低并且波动被抑制的TFT以及设置有TFT的电子设备。 基底绝缘膜和非晶半导体膜之间的成膜温度设定为基本相同，以提高半导体膜的平坦度。 然后，进行激光照射。

公开(公告)号：US06777713B2

公开(公告)日：2004-08-17

申请号：US10265634

申请日：2002-10-08

申请人： Hidekazu Miyairi ,  Aiko Shiga ,  Katsumi Nomura ,  Naoki Makita ,  Takuya Matsuo

发明人： Hidekazu Miyairi ,  Aiko Shiga ,  Katsumi Nomura ,  Naoki Makita ,  Takuya Matsuo

IPC分类号： H01L2900

CPC分类号： H01L27/12 ,  G02F1/1362 ,  H01L21/0237 ,  H01L21/02488 ,  H01L21/02532 ,  H01L21/02667 ,  H01L21/02672 ,  H01L21/02686 ,  H01L27/1277 ,  H01L29/66757 ,  H01L29/78621 ,  H01L29/78675

摘要： By adding a novel improvement to the technique disclosed in JP 8-78329 A, a manufacturing method in which film characteristics of a semiconductor film having a crystalline structure are improved is provided. In addition, a TFT having superior TFT characteristics, such as field effect mobility, which uses the semiconductor film as an active layer, and a method of manufacturing the TFT, are also provided. A metallic element which promotes the crystallization of silicon is added to a semiconductor film having an amorphous structure and an oxygen concentration within the film of less than 5×1018/cm3. The semiconductor film having an amorphous structure is then heat-treated, forming a semiconductor film having a crystalline structure. Subsequently, an oxide film on the surface is removed. Oxygen is introduced to the semiconductor film having a crystalline structure, and processing is performed such that the concentration of oxygen within the film is from 5×1018/cm3 to 1×1021/cm3. After removing an oxide film on the surface of the semiconductor film, the semiconductor film surface is leveled by irradiating laser light under an inert gas atmosphere or in a vacuum.

摘要翻译： 通过添加对JP 8-78329A中公开的技术的新颖改进，提供了具有改善晶体结构的半导体膜的膜特性的制造方法。 此外，还提供了具有优异TFT特性的TFT，例如使用半导体膜作为有源层的场效应迁移率，以及TFT的制造方法。 将促进硅结晶的金属元素加入到膜内的非晶结构和氧浓度小于5×10 18 / cm 3的半导体膜中。 然后对具有非晶结构的半导体膜进行热处理，形成具有晶体结构的半导体膜。 随后，除去表面上的氧化物膜。 将氧气引入具有晶体结构的半导体膜，并且进行处理，使得膜内的氧浓度为5×10 18 / cm 3至1×10 21 / cm 3。 在去除半导体膜表面上的氧化物膜之后，通过在惰性气体气氛或真空中照射激光来平整半导体膜表面。