公开(公告)号：US20090183907A1

公开(公告)日：2009-07-23

申请号：US12382266

申请日：2009-03-12

Applicant: Jun Ishii ,  Yasunari Ooyabu ,  Visit Thaveeprungsriporn

Inventor： Jun Ishii ,  Yasunari Ooyabu ,  Visit Thaveeprungsriporn

IPC: H05K1/16

CPC classification number: H05K1/0259 ,  G11B5/484 ,  G11B5/486 ,  H05K1/056 ,  H05K1/167 ,  H05K2201/09554 ,  Y10T428/1328 ,  Y10T428/1393 ,  Y10T428/256 ,  Y10T428/257

Abstract: A wired circuit board has a metal supporting board, an insulating layer formed on the metal supporting board, a conductive pattern formed on the insulating layer and having a pair of wires arranged in spaced-apart relation, and a semiconductive layer formed on the insulating layer and electrically connected to the metal supporting board and the conductive pattern. The conductive pattern has a first region in which a distance between the pair of wires is small and a second region in which the distance between the pair of wires is larger than that in the first region. The semiconductive layer is provided in the second region.

Abstract translation: 布线电路板具有金属支撑板，形成在金属支撑板上的绝缘层，形成在绝缘层上并具有间隔布置的一对电线的导电图案，以及形成在绝缘层上的半导体层 并且电连接到金属支撑板和导电图案。 导电图案具有第一区域，其中一对导线之间的距离小，并且一对导线之间的距离大于第一区域中的距离的第二区域。 半导体层设置在第二区域中。

公开(公告)号：US07556719B2

公开(公告)日：2009-07-07

申请号：US10833063

申请日：2004-04-28

Applicant: Jun Ishii ,  Takeshi Yoshimi

Inventor： Jun Ishii ,  Takeshi Yoshimi

IPC: C23C14/35

CPC classification number: H05K1/0259 ,  H05K1/056 ,  H05K1/167 ,  H05K3/28 ,  H05K2201/0317 ,  H05K2203/0315 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49128

Abstract: A method of producing a wired circuit board that can prevent the electrostatic damage of the components mounted on the wired circuit board effectively, while preventing operation errors of the device caused by the static electricity. After a thin metal film is formed over an entire area of a front side of an insulating cover layer and an entire surface of a conductor layer at a terminal portion thereof by sputtering, a metal oxide layer is formed on the thin metal layer by an oxidation-by-heating method or by the sputtering. According to this method, since the semi-conductor layer comprising the thin metal film and the metal oxide layer is formed on the surface of the insulating cover layer, the electrostatic damage of the components mounted on the wired circuit board can be prevented effectively. Also, the operation errors of the device caused by the construction wherein only the thin metal film is formed can also be prevented effectively. Further, the semi-conductor layer having a uniform surface resistance which falls within a preferable range can be formed, as compared with the construction wherein the metal oxide layer is formed directly on the insulating cover layer by the reactive sputtering or by the sputtering using the metallic oxide target.

Abstract translation: 一种制造布线电路板的方法，其能够有效地防止安装在布线电路板上的部件的静电损伤，同时防止由静电引起的装置的操作错误。 在绝缘覆盖层的正面的整个区域和通过溅射在其末端部分的导体层的整个表面上形成薄金属膜之后，通过氧化在金属薄层上形成金属氧化物层 通过加热方法或通过溅射。 根据该方法，由于在绝缘覆盖层的表面上形成包含金属薄膜和金属氧化物层的半导体层，因此能够有效地防止安装在布线电路基板上的部件的静电损伤。 此外，也可以有效地防止由仅形成金属薄膜的结构引起的装置的操作误差。 此外，与金属氧化物层通过反应溅射直接形成在绝缘覆盖层上的结构相比，可以形成具有均匀表面电阻的半导体层，其优选范围在优选范围内， 金属氧化物靶。

公开(公告)号：USD564018S1

公开(公告)日：2008-03-11

申请号：US29237885

申请日：2005-09-08

Applicant: Jun Ishii ,  Hisaya Ishio ,  Hitoshi Kato

Designer： Jun Ishii ,  Hisaya Ishio ,  Hitoshi Kato

公开(公告)号：US20080029293A1

公开(公告)日：2008-02-07

申请号：US11882667

申请日：2007-08-03

Applicant: Yasunari Ooyabu ,  Jun Ishii ,  Naohiro Terada

Inventor： Yasunari Ooyabu ,  Jun Ishii ,  Naohiro Terada

IPC: H05K1/00

CPC classification number: H05K1/0259 ,  G11B5/486 ,  G11B5/6094 ,  H05K1/056 ,  H05K1/167 ,  H05K3/28 ,  H05K2201/09063 ,  H05K2201/09554 ,  H05K2201/0969

Abstract: [Object] To provide a wired circuit board in which charged static electricity can be efficiently removed before mounting of electronic components and electrical stability of a wired circuit body portion can be reliably secured after the mounting of the electronic components.[Solution Means] In a suspension board with circuit 1 in which a metal supporting layer 12, an insulating base layer 13, a conductive pattern 14 having a main wired circuit 5 formed on a wired circuit body portion 2 and an auxiliary wired circuit 11 formed on an electrostatic charge removing portion 3, and an insulating cover layer 15 are sequentially laminated, a semiconductive layer 9 covering the auxiliary wired circuit 11 is formed on the insulating base layer 13 in the electrostatic charge removing portion 3. Before mounting of a magnetic head, static electricity charged on the wired circuit body portion 2 can be efficiently removed via the semiconductive layer 9. After the mounting of the magnetic head, the electrostatic charge removing portion 3 is separated from the wired circuit body portion 2 using a conduction cut-off portion 4 as a boundary, so that electrical conduction between the wired circuit body portion 2 and the electrostatic charge removing portion 3 is cut off.

Abstract translation: 提供一种布线电路板，其中在安装电子部件之前可以有效地去除带电静电，并且在安装电子部件之后可以可靠地确保布线电路主体部分的电气稳定性。 [解决方案]在具有电路1的悬挂板中，其中金属支撑层12，绝缘基底层13，形成在布线电路主体部分2上的主布线电路5的导电图案14和形成的辅助布线电路11 在静电电荷去除部分3和绝缘覆盖层15上依次层叠，在静电电荷去除部分3的绝缘基底层13上形成覆盖辅助布线电路11的半导体层9。 在安装磁头之前，可以通过半导体层9有效地去除充电在布线电路主体部分2上的静电。 在安装磁头之后，使用导通截止部分4作为边界，将静电电荷去除部分3与布线电路主体部分2分开，使得布线电路主体部分2和静电电荷 去除部分3被切断。

公开(公告)号：US20080000679A1

公开(公告)日：2008-01-03

申请号：US11808474

申请日：2007-06-11

Applicant: Katsutoshi Kamei ,  Jun Ishii ,  Yasunari Ooyabu ,  Visit Thaveeprungsriporn

Inventor： Katsutoshi Kamei ,  Jun Ishii ,  Yasunari Ooyabu ,  Visit Thaveeprungsriporn

IPC: B32B3/00 ,  H05K1/03

CPC classification number: H05K3/24 ,  H05K1/0393 ,  H05K3/108 ,  H05K3/244 ,  H05K2201/0394 ,  H05K2203/1105 ,  Y10T29/49126 ,  Y10T29/49155 ,  Y10T428/24917

Abstract: A wired circuit board has an insulating layer and a conductive pattern formed on the insulating layer and made of a copper alloy in which silver is diffused, wherein a content ratio of the silver contained in the copper alloy is more than 0.50% by weight and not more than 3.00% by weight

Abstract translation: 布线电路板具有形成在绝缘层上的绝缘层和导电图案，其由银扩散的铜合金制成，其中铜合金中所含的银的含量比大于0.50重量％，而不是 超过3.00重量％

公开(公告)号：US20080000673A1

公开(公告)日：2008-01-03

申请号：US11819596

申请日：2007-06-28

Applicant: Jun Ishii ,  Yasunari Ooyabu

Inventor： Jun Ishii ,  Yasunari Ooyabu

IPC: H05K1/02 ,  H05K1/00 ,  H05K1/16

CPC classification number: H05K1/0259 ,  G11B5/486 ,  H05K1/056 ,  H05K1/167 ,  H05K3/28 ,  H05K2201/09554

Abstract: A wired circuit board has a metal supporting board, an insulating layer formed on the metal supporting board, a conductive pattern formed on the insulating layer and having a plurality of wires arranged in mutually spaced-apart relation, and a plurality of semiconductive layers formed on the insulating layer and electrically connected to the metal supporting board and the respective wires. The semiconductive layers are provided independently of each other in correspondence to the respective wires.

Abstract translation: 布线电路板具有金属支撑板，形成在金属支撑板上的绝缘层，形成在绝缘层上并具有互相间隔布置的多根导线的导电图案，以及形成在多个半导体层上的多个半导体层 绝缘层并且电连接到金属支撑板和相应的导线。 半导体层相应于相应的导线彼此独立地设置。

公开(公告)号：US20070246247A1

公开(公告)日：2007-10-25

申请号：US11785873

申请日：2007-04-20

Applicant: Yasunari Ooyabu ,  Jun Ishii

Inventor： Yasunari Ooyabu ,  Jun Ishii

IPC: H05K1/03

CPC classification number: H05K1/0259 ,  G11B5/486 ,  H05K1/056 ,  H05K1/167 ,  H05K3/28 ,  H05K2201/09554

Abstract: The wired circuit board includes a metal supporting board, an insulating base layer formed on the metal supporting board, a conductive pattern formed on the insulating base layer, a semiconductive layer formed on the insulating base layer so as to cover the conductive pattern, and a ground connecting portion formed on the metal supporting board to be in contact with the metal supporting board and the semiconductive layer.

Abstract translation: 布线电路板包括金属支撑板，形成在金属支撑板上的绝缘基底层，形成在绝缘基底层上的导电图案，形成在绝缘基底层上以覆盖导电图案的半导体层，以及 接地连接部分形成在金属支撑板上以与金属支撑板和半导体层接触。

公开(公告)号：US20070209829A1

公开(公告)日：2007-09-13

申请号：US11713053

申请日：2007-03-02

Applicant: Jun Ishii ,  Yasunari Ooyabu

Inventor： Jun Ishii ,  Yasunari Ooyabu

IPC: H05K1/03

CPC classification number: H05K1/0259 ,  H05K1/056 ,  H05K1/167 ,  H05K3/28

Abstract: A suspension board with circuit has a metal supporting board, an insulating layer formed on the metal supporting board, a conductive pattern formed on the insulating layer and including a terminal portion for connecting to an external terminal, and an antistatic barrier layer formed on the conductive pattern. The antistatic barrier layer includes a metal thin film and a semiconductive layer having at least one end facing the terminal portion and at least the other end in contact with the metal supporting board.

Abstract translation: 具有电路的悬挂板具有金属支撑板，形成在金属支撑板上的绝缘层，形成在绝缘层上的导电图案，并且包括用于连接到外部端子的端子部分和形成在导体上的抗静电阻挡层 模式。 抗静电阻挡层包括金属薄膜和半导体层，其具有面向端子部的至少一个端部，并且至少另一端与金属支撑板接触。

公开(公告)号：US20070017695A1

公开(公告)日：2007-01-25

申请号：US11477935

申请日：2006-06-30

Applicant: Jun Ishii ,  Yasuhito Ohwaki ,  Yasuhito Funada

Inventor： Jun Ishii ,  Yasuhito Ohwaki ,  Yasuhito Funada

IPC: H05K1/09

CPC classification number: H05K3/38 ,  H05K1/056 ,  H05K3/06 ,  H05K3/205 ,  H05K3/44 ,  H05K2201/0379 ,  H05K2201/0969 ,  H05K2201/09781 ,  H05K2201/2072 ,  H05K2203/0323

Abstract: A wired circuit board that can provide an enhanced adhesion of a metal supporting board at a marginal portion of an opening formed in the metal supporting board with a simple structure to prevent stripping of the metal supporting board. In a suspension board with circuit, in order to reduce a transmission loss of a conductive pattern, a metal foil embedded in an insulating base layer is formed in a pattern comprising a first metal foil portion and a second metal foil portion surrounding the first metal foil portion spaced apart therefrom, and an opening is formed in the metal supporting board so that a marginal portion of the opening is located in a space between the first metal foil portion and the second metal foil portion.

Abstract translation: 一种布线电路板，其能够以简单的结构提供在金属支撑板上形成的开口的边缘部分处的金属支撑板的增强的附着，以防止金属支撑板的剥离。 在具有电路的悬挂板中，为了减少导电图案的传输损耗，嵌入绝缘基底层中的金属箔以包括第一金属箔部分和围绕第一金属箔的第二金属箔部分的图案形成 部分间隔开，并且在金属支撑板上形成开口，使得开口的边缘部分位于第一金属箔部分和第二金属箔部分之间的空间中。

公开(公告)号：US20060199402A1

公开(公告)日：2006-09-07

申请号：US11365845

申请日：2006-03-02

Applicant: Jun Ishii ,  Hitoki Kanagawa ,  Yasuhito Funada

Inventor： Jun Ishii ,  Hitoki Kanagawa ,  Yasuhito Funada

IPC: H01R12/00

CPC classification number: H05K1/056 ,  H05K2201/0317 ,  H05K2201/0338 ,  H05K2203/0723

Abstract: A wired circuit board that can provide a reduced transmission loss and an improved adhesion strength between a metal suspension board and a metal foil with a simple laminar structure, thereby ensuring improved long-term reliability. The wired circuit board 1 comprises a metal suspension board 2, a thin metal film 3 formed on the metal suspension board 2 by sputtering or by electrolytic plating, a metal foil 4 formed on the thin metal film 3 by electrolytic plating, an insulating base layer 5 formed on the metal foil 4 and the metal suspension board 2, and a conductive pattern 6 formed on the insulating base layer 5 as a wired circuit pattern. The wired circuit board 1 may include an insulating cover layer 7 formed on the insulating base layer 5 to cover the conductive pattern 6.

Abstract translation: 一种布线电路板，其能够以简单的层状结构提供降低的传输损耗和改善金属悬挂板和金属箔之间的粘附强度，从而确保改善的长期可靠性。 布线电路板1包括金属悬挂板2，通过溅射或电解电镀形成在金属悬挂板2上的薄金属膜3，通过电解电镀形成在金属薄膜3上的金属箔4，绝缘基底层 形成在金属箔4和金属悬挂板2上的导电图案6和形成在绝缘基底层5上的布线电路图案的导电图案6。 布线电路板1可以包括形成在绝缘基底层5上以覆盖导电图案6的绝缘覆盖层7。