公开(公告)号：US11451714B2

公开(公告)日：2022-09-20

申请号：US17118037

申请日：2020-12-10

Applicant: MPI CORPORATION

Inventor： Ping-Ying Wu ,  Yung-Chin Liu ,  Hsuan-Chiao Huang

IPC: H04N5/235 ,  G06T7/00

Abstract: A light emitting element detecting method includes the steps of generating a first control signal to open a shutter of an image capturing device which captures an image toward a light outlet of a light emitting element, generating a pulse signal to light up the light emitting element, generating a second control signal to close the shutter of the image capturing device and obtaining a detection image, and determining the light emitting status of the light outlet of the light emitting element according to the detection image. As a result, the present invention can accurately detect whether the light outlet of the light emitting element has the problem of emitting no light or flashing.

公开(公告)号：US11353501B2

公开(公告)日：2022-06-07

申请号：US17094408

申请日：2020-11-10

Applicant: MPI Corporation

Inventor： Lin-Lin Chih ,  Chien-Hung Chen ,  Guan-Jhih Liou ,  Yu-Hsun Hsu

IPC: G01R31/28

Abstract: A wafer inspection method, wherein a motorized chuck stage is controlled by a control rod to be displaced between an upper position and a lower position along Z-axis direction, to change a relative position of a wafer on the motorized chuck stage relative to a probe. The control rod is movable between an upper and an lower limit positions. The wafer inspection method includes: determining a position of the control rod based on a measurement signal; determining a first moving direction and a moving distance of the control rod based on a change of the measurement signal; generating a control signal based on the moving distance of the control rod; controlling the motorized chuck stage to be displaced along a second moving direction opposite to the first moving direction; and controlling an objective lens module to keep focusing on the wafer when the motorized chuck stage is on the move.

公开(公告)号：US20220155366A1

公开(公告)日：2022-05-19

申请号：US17524833

申请日：2021-11-12

Applicant: MPI Corporation

Inventor： Volker Hansel ,  Sebastian Giessmann ,  Frank Fehrmann ,  Chien-Hung Chen

IPC: G01R31/28

Abstract: The semiconductor inspecting method includes following steps. First, a first position of a probe needle from above is defined by adopting a vision system of a semiconductor inspecting system. Then, a first relative vertical movement between the probe needle and the pad is made by adopting a driving system of the semiconductor inspecting system. Thereafter, a minimum change in position of the probe needle corresponding to the first position is recognized by adopting the vision system of the semiconductor inspecting system. Next, the first relative vertical movement is stopped by adopting the driving system of the semiconductor inspecting system.

公开(公告)号：US11262401B2

公开(公告)日：2022-03-01

申请号：US16854926

申请日：2020-04-22

Applicant: MPI Corporation

Inventor： Stojan Kanev ,  Chia-Hung Hung

IPC: G01R31/28

Abstract: A wafer probe station includes a thermal chuck, a chuck stage, a platen, some probes, a first focusing device, a second focusing device and a thermal plate. The thermal chuck heats up to an operational temperature and holds a device under test (DUT). The chuck stage connects with the thermal chuck and moves the thermal chuck. The thermal chuck locates between the chuck stage and the platen. The probes are disposed on the platen and configured to contact with the DUT. The first focusing device is disposed on the platen to focus on the DUT. The second focusing device is disposed on the chuck stage to focus on the probes. The thermal plate locates between the second focusing device and the platen and is configured to heat up to the operational temperature. The thermal plate has a through hole aligning with the second focusing device.

公开(公告)号：US11150269B2

公开(公告)日：2021-10-19

申请号：US16990283

申请日：2020-08-11

Applicant: MPI CORPORATION

Inventor： Hui-Pin Yang ,  Shang-Jung Hsieh ,  Yu-Wen Chou ,  Ching-Fang Yu ,  Huo-Kang Hsu ,  Chin-Tien Yang

IPC: G01R1/073 ,  G01R1/067

Abstract: A probe head includes a probe seat, a first spring probe penetrating through upper, middle and lower dies of the probe seat for transmitting a first test signal, and at least two shorter second spring probes penetrating through the lower die for transmitting a second test signal with higher frequency. Two second spring probes are electrically connected in a way that top ends thereof are abutted against two electrically conductive contacts on a bottom surface of the middle die electrically connected by a connecting circuit therein. The lower die has a communicating space and at least two lower installation holes communicating therewith and each accommodating a second spring probe partially located in the communicating space. The probe head is adapted for concurrent high and medium or low frequency signal tests, meets fine pitch and high frequency testing requirements and prevents probe cards from too complicated circuit design.

公开(公告)号：US11143674B2

公开(公告)日：2021-10-12

申请号：US16459076

申请日：2019-07-01

Applicant: MPI CORPORATION

Inventor： Tzu Yang Chen ,  Chia Ju Wei

IPC: G01R1/067 ,  G01R1/073

Abstract: A probe head includes a linear probe which is flattened at least one of tail, body and head portions thereof and thereby defined with first and second width axes, along which each of the tail, body and head portions is defined with first and second widths, and upper and lower die units having upper and lower installation holes respectively, wherein the tail and head portions are inserted respectively, which are offset from each other along the second width axis so that the body portion is curved. The first and second widths of the body portion are respectively larger and smaller than the first and second widths of at least one of the tail and head portions. As a result, the probes of the same probe head are consistent in bending direction and moving behavior and prevented from rotation, drop and escape.

公开(公告)号：US20210048451A1

公开(公告)日：2021-02-18

申请号：US16990612

申请日：2020-08-11

Applicant: MPI CORPORATION

Inventor： Chin-Tien YANG ,  Hui-Pin YANG ,  Shang-Jung HSIEH ,  Tsung-Yi CHEN ,  Yu-Hao CHEN ,  Jhin-Ying LYU

IPC: G01R1/067 ,  G01R1/073

Abstract: A probe head includes a probe seat having upper, middle and lower dies, an electrically conductive layer inside the probe seat, a first spring probe penetrating through the probe seat, and at least two shorter second spring probes penetrating through the lower die in a way that top ends of the second spring probes are located inside the probe seat and abutted against the electrically conductive layer. Another probe head includes the aforesaid probe seat, an electrically conductive layer partially inside the probe seat and partially outside the probe seat, a first spring probe penetrating through the probe seat, and a shorter second spring probe penetrating through the lower die in a way that a top end of the second spring probe is located inside the probe seat and abutted against the electrically conductive layer. As such, fine pitch requirement and different high frequency testing requirements are fulfilled.

公开(公告)号：US10655893B2

公开(公告)日：2020-05-19

申请号：US15042791

申请日：2016-02-12

Applicant: MPI CORPORATION

Inventor： Michael Roy Saint Pierre ,  Helge Jacob Krystad ,  Ying-Chiao Chang ,  Yueh-Ying Lee

IPC: F25B6/04 ,  F25B47/02 ,  F25B49/02 ,  F25B40/00

Abstract: A cooling system includes a cooling device, a controller and a defrosting unit. The cooling device has a compressor, a condenser, an expander, an evaporator, a cooling channel and a coolant. The coolant is functioned in the evaporator to thermally exchange with a working fluid in a pipe. The controller is adapted for controlling the temperature of the working fluid by controlling the cooling device. The defrosting unit has a switch disposed on the cooling channel and located between the compressor and the condenser, and a defrosting channel connected with the switch. After passing through the switch, the coolant is optionally fed to anyone of the cooling channel and the defrosting channel. After flowing through the defrosting channel, the coolant passes through the evaporator and then flows back to the compressor. As a result, the cooling system is capable of fast defrosting without using a heater.

公开(公告)号：US10101362B2

公开(公告)日：2018-10-16

申请号：US14553590

申请日：2014-11-25

Applicant: MPI CORPORATION

Inventor： Wei-Cheng Ku ,  Hao Wei ,  Yu-Hao Chen ,  Chih-Hao Ho

IPC: G01R1/067

Abstract: A probe module, which is provided between a tester and a DUT for transmitting electrical signals therebetween, includes a signal transmitting member, a plurality of probes, a positioning member, and a signal connector. The signal transmitting member has a circuit and two grounding. The probes are electrical connected to the circuit and the groundings of the signal transmitting member. The positioning member is made of an insulating material, and provided on the probes. The signal connector is adapted to be electrically connected to the tester, wherein the signal connector has a signal transmission portion and a grounding portion; the signal transmission portion is electrically connected to the circuit of the signal transmitting member, and the grounding portion is electrically connected to the at least one grounding of the signal transmitting member.

公开(公告)号：US10096505B2

公开(公告)日：2018-10-09

申请号：US15414873

申请日：2017-01-25

Applicant: MPI Corporation

Inventor： Lin-Lin Chih ,  Chien-Hung Chen ,  Cheng-Rong Yang ,  Stojan Kanev

IPC: G01R31/01 ,  H01L21/677 ,  A47B88/497 ,  A47B88/457 ,  G01K13/00 ,  G01R31/28 ,  H01L21/673 ,  A47B88/988

Abstract: A wafer cassette includes a case, a plurality of wafer trays, and a plurality of transmission mechanisms. The wafer trays are disposed in the case. Each of the wafer trays includes a central opening, a first groove, and a second groove. The diameter of the second groove is greater than that of the first groove. A bottom surface of the second groove is higher than that of the first groove. The first and second grooves surround the central opening. Each of the transmission mechanisms is connected to the corresponding wafer tray to move the wafer tray between a pick-up position and a received position. Since the wafer tray has grooves with different diameters, the wafer tray is capable of receiving wafers with different sizes.