-
公开(公告)号：US20240357680A1
公开(公告)日：2024-10-24
申请号：US18625239
申请日：2024-04-03
Applicant: MEDIATEK INC.
Inventor： Tsung-Jung Lee , Ying-You Lin , Cheng-Chien Su , Kuo-Wei Chen
CPC classification number: H04W76/15 , H04L5/0053 , H04L5/0092 , H04W84/12
Abstract: A multi-link operation (MLO) Wi-Fi dual traffic identification data transmission method is adopted for an MLO Wi-Fi access point (AP) and an MLO Wi-Fi client. The method includes linking the MLO Wi-Fi client to the MLO Wi-Fi access point (AP) with a first link and a second link, rendering traffic in the first link a first block acknowledgement (BA) window with a first traffic identification (TID), rendering traffic in the second link a second block acknowledgement (BA) window with a second traffic identification (TID), using the first block acknowledgement (BA) window with the first TID to transmit data through the first link, and using the second block acknowledgement (BA) window with the second TID to transmit data through the second link.
-
62.发明公开公开(公告)号：US20240347479A1
公开(公告)日：2024-10-17
申请号：US18611681
申请日：2024-03-20
Applicant: MEDIATEK INC.
Inventor： Chu-Chia Chang , Pei-Haw Tsao , Peng-Yu Huang , Yu-Liang Hsiao , Wei-Fan Chen
IPC: H01L23/00 , H01L23/31 , H01L23/498
CPC classification number: H01L23/564 , H01L23/3128 , H01L23/49816 , H01L23/49822 , H01L24/16 , H01L2224/16227
Abstract: A semiconductor package includes a package substrate having a top surface and an opposing bottom surface. The package substrate includes a top build-up wiring layer and an upper dielectric layer covering the top build-up wiring layer. A semiconductor device and a passive component are mounted on the top surface of the package substrate in a side-by-side manner. A molding compound encapsulates the semiconductor device and the passive component on the top surface of the package substrate. A cavity is disposed between the passive component and the top surface of the package substrate. A moisture passing gap is disposed in the top build-up wiring layer of the package substrate
-
公开(公告)号：US20240346624A1
公开(公告)日：2024-10-17
申请号：US18637468
申请日：2024-04-17
Applicant: MEDIATEK INC.
Inventor： Chi-Cheng Ju , Ying-Jui Chen , Jing-Ying Chang , Shan-Lung Chao
IPC: G06T5/50
CPC classification number: G06T5/50 , G06T2207/20221
Abstract: An asymmetric image fusion method is applied to an operation device and includes acquiring a first image stream with a first frame rate, acquiring a second image stream with a second frame rate different from the first frame rate, and fusing a first reused image frame of the first image stream with a set of second image frames of the second image stream respectively for outputting a set of fused image frames.
-
公开(公告)号：US12120472B2
公开(公告)日：2024-10-15
申请号：US17691043
申请日：2022-03-09
Applicant: MediaTek Inc.
Inventor： Yu-Ju Lin , Ying-Jui Chen , Keh-Tsong Li , Pin-Chung Lin , Hung-Chih Ko , Chi-Cheng Ju
Abstract: Various schemes pertaining to generating a full-frame color image using a hybrid sensor are described. An apparatus receives sensor data from the hybrid sensor, wherein the sensor data includes partial-frame chromatic data of a plurality of chromatic channels and partial-frame color-insensitive data. The apparatus subsequently generates full-frame color-insensitive data based on the partial-frame color-insensitive data. The apparatus subsequently generates the full-frame color image based on the full-frame color-insensitive data and the partial-frame chromatic data. The apparatus provides benefits of enhancing image quality of the full-frame color image especially under low light conditions.
-
公开(公告)号：US12120293B2
公开(公告)日：2024-10-15
申请号：US17977466
申请日：2022-10-31
Applicant: MediaTek Inc.
Inventor： Cheng-Yen Chuang , Man-Shu Chiang , Chun-Chia Chen , Chih-Wei Hsu , Tzu-Der Chuang , Ching-Yeh Chen , Yu-Wen Huang
IPC: H04N19/105 , H04N19/117 , H04N19/176 , H04N19/423 , H04N19/52
CPC classification number: H04N19/105 , H04N19/117 , H04N19/176 , H04N19/423 , H04N19/52
Abstract: A video coding system generating candidates for Merge Mode with Motion Vector Difference (MMVD) with reduced resource usage is provided. The system receives data to be encoded or decoded as a current block of a current picture of a video. The system identifies multiple MMVD candidates for different offset positions based on a merge candidate of the current block. The system generates reference samples for the identified MMVD candidates. The system reconstructs the current block or encodes the current block into a bitstream by using the generated reference samples. The system processes the MMVD candidates in separate groups: a first group of vertical MMVD candidates and a second group of horizontal MMVD candidates. The system generates the reference samples for the identified MMVD candidates by applying a vertical filter to source reference samples of horizontal MMVD candidates and then applying a horizontal filter to outputs of the vertical filter.
-
Patent Agency Ranking
66.发明公开公开(公告)号：US20240334231A1
公开(公告)日：2024-10-03
申请号：US18595517
申请日：2024-03-05
Applicant: MediaTek Inc.
Inventor： Lung-Sheng Tsai , Chia-Hao Yu , Cheng-Rung Tsai , Chi-Hsuan Hsieh
CPC classification number: H04W24/10 , H04L5/0048
Abstract: Examples pertaining to measurement resource and report configuration for a communication apparatus supporting device collaboration in mobile communications are described. A user equipment (UE) receives a first report configuration associated with at least a first measurement resource allocated in a first frequency band from a network node. The UE determines information regarding a second measurement resource allocated in a second frequency band which is different from the first frequency band. The UE receives a first radio frequency (RF) signal carrying one or more reference signals on the first measurement resource and receives a second RF signal carrying identical one or more reference signals on the second measurement resource.
-
公开(公告)号：US20240332286A1
公开(公告)日：2024-10-03
申请号：US18593962
申请日：2024-03-03
Applicant: MEDIATEK INC.
Inventor： Yung-Ju Wen , Bo-Shih Huang
CPC classification number: H01L27/0266 , G05F1/569 , H01L27/0292 , H01L27/0296
Abstract: The present invention provides a power clamp cell including a power clamping circuit, a power routing and a global routing is disclosed. The power routing has at least a first vertical metal line and a first horizontal metal line, and the power routing is implemented by using a first metal layer in semiconductor process. The ground routing has at least a second vertical metal line and a second horizontal metal line, and the ground routing is implemented by using a second metal layer in the semiconductor process.
-
公开(公告)号：US12108490B2
公开(公告)日：2024-10-01
申请号：US18232814
申请日：2023-08-10
Applicant: MEDIATEK INC.
Inventor： Chiou-Wei Tsai , Cheng-Rung Tsai
CPC classification number: H04W8/24 , H04B7/0626 , H04B7/0695 , H04L5/0051 , H04W16/14 , H04W24/10
Abstract: A method for UE capability signaling for supporting reference signal based measurements in NR-U is proposed. A UE transfers its UE capability information to a mobile communication network, wherein the UE capability information includes information regarding whether the UE supports measurements of a CSI-RS on an unlicensed cell. The UE receives configuration from the mobile communication network, wherein the configuration includes information regarding radio resources of the CSI-RS on the unlicensed cell. The UE measures the CSI-RS on the unlicensed cell based on the configuration.
-
公开(公告)号：US12107059B2
公开(公告)日：2024-10-01
申请号：US17687723
申请日：2022-03-07
Applicant: MEDIATEK Inc.
Inventor： Yan-Liang Ji
IPC: H01L23/00
CPC classification number: H01L24/05 , H01L24/03 , H01L2224/02206 , H01L2224/03013 , H01L2224/03466 , H01L2224/0401 , H01L2224/05558 , H01L2224/05582 , H01L2224/05624 , H01L2224/05647 , H01L2924/0132
Abstract: A semiconductor package includes a substrate, a first insulation layer, a conductive via and a conductive trace. The substrate includes a conductive component. The first insulation layer is formed on the substrate and having a first through hole exposing the conductive component. The conductive via is formed within the first through hole. The conductive trace is directly connected to the conductive via which is located directly above the first through hole.
-
公开(公告)号：US20240321674A1
公开(公告)日：2024-09-26
申请号：US18510825
申请日：2023-11-16
Applicant: MEDIATEK INC.
Inventor： Pu-Shan HUANG , Chi-Yuan CHEN , Shih-Chin LIN
IPC: H01L23/367 , H01L23/00
CPC classification number: H01L23/3675 , H01L24/16 , H01L24/32 , H01L24/73 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2924/1611 , H01L2924/1632
Abstract: A semiconductor device is provided. The semiconductor device includes a substrate, a semiconductor die, a lid, a liquid metal, a gel and a thermal dissipation structure. The semiconductor die is disposed on the substrate. The lid is disposed on the substrate and covers the semiconductor die. The lid has an opening to expose the semiconductor die. The liquid metal is disposed on the semiconductor die. The gel is disposed between the semiconductor die and the lid. The thermal dissipation structure is disposed on the lid and covers the opening. The semiconductor die, the gel and the thermal dissipation structure form a closed space for accommodating the liquid metal.
-
-
-
-
-
-
-
-
-
Search Results
7515
records
(took 0.038 seconds)
