公开(公告)号：US20130044799A1

公开(公告)日：2013-02-21

申请号：US13396615

申请日：2012-02-15

Applicant: Pang-Chang Lan ,  Chih-Yao Wu ,  Ling-San Meng ,  Ping-Cheng Yeh ,  Yu-Chih Jen

Inventor： Pang-Chang Lan ,  Chih-Yao Wu ,  Ling-San Meng ,  Ping-Cheng Yeh ,  Yu-Chih Jen

IPC: H04B7/06

CPC classification number: H04B7/0478 ,  H04B7/0663 ,  H04L1/0009 ,  H04L1/06

Abstract: A method of reducing quantization error caused by precoding for a receiver in a wireless communication system is disclosed. The method comprising measuring channel information of a channel between the receiver and a transmitter in the wireless communication system; determining at least one precoding matrix from at least one codebook according to the channel information of the channel; determining at least one geometric coefficient according to a Geodesic interpolation algorithm and the at least one precoding matrix, for the at least one precoding matrix, respectively; and feeding back the at least one precoding matrix and the at least one geometric coefficient to the transmitter.

Abstract translation: 公开了一种减少由无线通信系统中的接收机的预编码引起的量化误差的方法。 该方法包括在无线通信系统中测量接收机与发射机之间的信道的信道信息; 根据所述信道的信道信息，从至少一个码本确定至少一个预编码矩阵; 对于所述至少一个预编码矩阵，分别确定根据大地测量插值算法和所述至少一个预编码矩阵的至少一个几何系数; 以及将所述至少一个预编码矩阵和所述至少一个几何系数反馈给所述发射机。

公开(公告)号：US20130009313A1

公开(公告)日：2013-01-10

申请号：US13433061

申请日：2012-03-28

Applicant: Po-Shing Chiang ,  Ping-Cheng Hu ,  Yu-Fang Tsai

Inventor： Po-Shing Chiang ,  Ping-Cheng Hu ,  Yu-Fang Tsai

IPC: H01L23/48 ,  H01L21/60

CPC classification number: H01L23/488 ,  H01L21/4832 ,  H01L21/56 ,  H01L23/49541 ,  H01L23/49582 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/49 ,  H01L2924/00014 ,  H01L2924/181 ,  H01L2224/45099 ,  H01L2924/00012

Abstract: A semiconductor device package including a substrate, first and second solder joints, a die pad, leads and enhancement elements surrounding the die pad, a chip electrically connected to the leads, and a package body encapsulating the chip, portions of the leads, and portions of the enhancement elements, but leaving exposed at least a side surface of each enhancement element. Side surfaces of the enhancement elements and the package body are coplanar. The substrate includes first pads corresponding to the leads and second pads corresponding to the enhancement elements. The first solder joints are disposed between the first pads and the leads. The second solder joints are disposed between the second pads and the enhancement elements. The second solder joints contact side surfaces of the enhancement elements. The surface area of the second pads is greater than the surface area of the corresponding enhancement elements.

Abstract translation: 一种半导体器件封装，包括基板，第一和第二焊点，芯片焊盘，引线和围绕芯片焊盘的增强元件，与引线电连接的芯片以及封装芯片，引线部分和部分 的增强元件，但是留下每个增强元件的至少一个侧表面。 增强元件和封装主体的侧表面是共面的。 衬底包括对应于引线的第一焊盘和对应于增强元件的第二焊盘。 第一焊点设置在第一焊盘和引线之间。 第二焊点设置在第二焊盘和增强元件之间。 第二焊点接触增强元件的侧表面。 第二焊盘的表面积大于相应增强元件的表面积。

公开(公告)号：US20120218308A1

公开(公告)日：2012-08-30

申请号：US13404163

申请日：2012-02-24

Applicant: Hung-Yi Lin ,  Wen-Shiu Hsu ,  Jung-Hsing Wang ,  Ping-Cheng Hsieh

Inventor： Hung-Yi Lin ,  Wen-Shiu Hsu ,  Jung-Hsing Wang ,  Ping-Cheng Hsieh

IPC: G09G5/00

CPC classification number: G06F3/0482 ,  G06F3/04842 ,  G06F3/04883 ,  G06F2203/04805 ,  G06F2203/04806

Abstract: A display control method of a touch control screen and an electronic device applying the same are provided. According to the method, small user interfaces are magnified, and the user selects a target user interface according to a magnified zone. The method includes steps of: forming a touch boundary according to a position signal of a touch point; determining whether the touch boundary collides with a user interface; executing an image magnifying action according to the touch boundary and displaying the magnified zone on the touch control screen if the touch boundary collides with the user interface at the touch control screen; vanishing the touch point on the touch control screen after moving the touch point to a target user interface to execute a corresponding function of the target user interface via a control application module.

Abstract translation: 提供了一种触摸控制屏幕的显示控制方法和应用它的电子设备。 根据该方法，放大了小的用户界面，并且用户根据放大区域选择目标用户界面。 该方法包括以下步骤：根据触摸点的位置信号形成触摸边界; 确定触摸边界是否与用户界面相撞; 如果触摸边界与触摸控制屏幕上的用户界面相冲突，则根据触摸边界执行图像放大动作并且在触摸控制屏幕上显示放大区域; 在将触摸点移动到目标用户界面之后，触摸控制屏幕上的触摸点消失，以经由控制应用模块执行目标用户界面的相应功能。

公开(公告)号：US20120218307A1

公开(公告)日：2012-08-30

申请号：US13402005

申请日：2012-02-22

Applicant: Hung-Yi Lin ,  Wen-Shiu Hsu ,  Jung-Hsing Wang ,  Ping-Cheng Hsieh

Inventor： Hung-Yi Lin ,  Wen-Shiu Hsu ,  Jung-Hsing Wang ,  Ping-Cheng Hsieh

IPC: G09G5/00

CPC classification number: G06F3/0482 ,  G06F3/04842 ,  G06F3/04883 ,  G06F2203/04805 ,  G06F2203/04806

Abstract: A display control method of a touch control screen and an electronic device applying the same are provided. The method is for enlarging a specific zone at the touch control screen and for the user to edit or selection at the enlarged zone. The method includes steps of: determining whether a plurality of first touch points stay at the touch control screen over a predetermined time; enlarging a partial zone image for showing an enlarged zone on the touch control screen; providing a second touch point on the enlarged zone for generating a corresponding position signal; and scaling the position signal, generating a converted signal and inputting the converted signal to a control module.

Abstract translation: 提供了一种触摸控制屏幕的显示控制方法和应用它的电子设备。 该方法用于在触摸控制屏幕上放大特定区域，并使用户在放大区域进行编辑或选择。 该方法包括以下步骤：确定多个第一触摸点是否在预定时间内停留在触摸控制屏幕处; 扩大用于在触摸控制屏幕上显示放大区域的部分区域图像; 在所述放大区域上提供第二触摸点以产生对应的位置信号; 并且缩放位置信号，产生转换的信号并将转换的信号输入到控制模块。

公开(公告)号：US20120155124A1

公开(公告)日：2012-06-21

申请号：US12972794

申请日：2010-12-20

Applicant: Chaur-Ping CHENG ,  Chih-Hsing Fang ,  Wen-Wei Chan ,  Po-Yuan Chen

Inventor： Chaur-Ping CHENG ,  Chih-Hsing Fang ,  Wen-Wei Chan ,  Po-Yuan Chen

IPC: H02M3/337

CPC classification number: H02M7/487 ,  H02M3/337 ,  H02M2001/007

Abstract: A three-phase power supply with a three-phase three-level DC/DC converter includes a full-bridge thyristor converter with three-set four in-series power switch elements, a three-phase isolated transformer, a full-bridge rectifier, a rectifying circuit, and a low-pass filtering circuit. The three-phase power supply is used to deliver power energy from the AC input voltage to the load. The power switch elements, which separated to each other at 120-degree phase differences, are controlled through a phase shift scheme. Therefore, the three-level circuit structure is provided to reduce withstanding voltage of the power switch elements, further the zero-voltage switching (ZVS) is achieved by the isolated transformer and the power switch elements to increase the efficiency of the DC/DC converter.

Abstract translation: 具有三相三电平DC / DC转换器的三相电源包括具有三组四个串联电源开关元件的全桥晶闸管转换器，三相隔离变压器，全桥整流器， 整流电路和低通滤波电路。 三相电源用于将电力能量从交流输入电压输送到负载。 通过相移方案控制以120度相位差彼此分离的功率开关元件。 因此，提供三电平电路结构以降低功率开关元件的耐受电压，进一步通过隔离变压器和功率开关元件实现零电压开关（ZVS），以提高DC / DC转换器的效率 。

公开(公告)号：US20120119342A1

公开(公告)日：2012-05-17

申请号：US12944695

申请日：2010-11-11

Applicant: Pao-Huei Chang Chien ,  Ping-Cheng Hu ,  Po-Shing Chiang ,  Wei-Lun Cheng ,  Hsueh-Te Wang ,  Hsiao-Chuan Chang ,  Tsung-Yueh Tsai ,  Yi-Shao Lai ,  Ping-Feng Yang

Inventor： Pao-Huei Chang Chien ,  Ping-Cheng Hu ,  Po-Shing Chiang ,  Wei-Lun Cheng ,  Hsueh-Te Wang ,  Hsiao-Chuan Chang ,  Tsung-Yueh Tsai ,  Yi-Shao Lai ,  Ping-Feng Yang

IPC: H01L23/495 ,  H01L21/58 ,  H01L21/56

CPC classification number: H01L21/4832 ,  H01L21/561 ,  H01L23/3107 ,  H01L23/49503 ,  H01L23/49548 ,  H01L23/49582 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/49 ,  H01L24/97 ,  H01L2224/32245 ,  H01L2224/32257 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/4911 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/078 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2924/30107 ,  H01L2224/83 ,  H01L2224/85 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2924/00012

Abstract: The advanced quad flat non-leaded package structure includes a carrier, a chip, a plurality of wires, and a molding compound. The carrier includes a die pad and a plurality of leads. The inner leads of the leads are designed to possess incurved sidewalls for enhancing the adhesion between the inner leads and the surrounding molding compound.

Abstract translation: 先进的四边形扁平无铅封装结构包括载体，芯片，多根导线和模塑料。 载体包括管芯焊盘和多个引线。 引线的内引线被设计成具有弯曲的侧壁，用于增强内引线和周围模塑料之间的粘附。

公开(公告)号：US20120108047A1

公开(公告)日：2012-05-03

申请号：US12917339

申请日：2010-11-01

Applicant: Ying-Cheng Chuang ,  Hung-Ming Tsai ,  Sheng-Wei Yang ,  Ping-Cheng Hsu ,  Ming-Cheng Chang

Inventor： Ying-Cheng Chuang ,  Hung-Ming Tsai ,  Sheng-Wei Yang ,  Ping-Cheng Hsu ,  Ming-Cheng Chang

IPC: H01L21/768 ,  H01L21/28

CPC classification number: H01L27/10876 ,  H01L21/28531 ,  H01L21/76897 ,  H01L27/10855 ,  H01L27/10888

Abstract: A method of forming a conductive contact includes forming a structure comprising an upper surface joining with a sidewall surface. The sidewall surface contains elemental-form silicon. Silicon is epitaxially grown from the sidewall surface. Dielectric material is formed over the upper surface and the epitaxially-grown silicon. A conductive contact is formed through the dielectric material to conductively connect with the upper surface.

Abstract translation: 形成导电接触的方法包括形成包括与侧壁表面接合的上表面的结构。 侧壁表面含有元素型硅。 硅从侧壁表面外延生长。 电介质材料形成在上表面和外延生长的硅上。 通过电介质材料形成导电接触，以与上表面导电连接。

公开(公告)号：US08147160B2

公开(公告)日：2012-04-03

申请号：US12236296

申请日：2008-09-23

Applicant: Chun Yuen To ,  Ho Ping Cheng

Inventor： Chun Yuen To ,  Ho Ping Cheng

IPC: B42F13/20

CPC classification number: B42F13/26

Abstract: A ring binder mechanism includes a housing and a ring support supported by the housing for movement relative thereto. Each ring of a plurality of rings includes first and second ring members. The first ring member is mounted on the ring support for movement with the ring support relative to the housing between a closed position and an opened position. An actuator is mounted for pivotal movement relative to the housing for moving the rings from their closed position to their opened position. The actuator includes a lower arm having a contact surface engageable with a lower surface of the ring support when the rings are in their opened position and out of engagement with the ring support when the rings are in their closed position. The contact surface defines an angle between its outer surface and a horizontal plane between about 16 degrees and about 55 degrees.

Abstract translation: 环形活页夹机构包括壳体和由壳体支撑的环形支撑件，用于相对于其移动。 多个环的每个环包括第一和第二环构件。 第一环构件安装在环支撑件上，使得环支撑件相对于壳体在关闭位置和打开位置之间移动。 安装致动器以相对于壳体枢转运动，用于将环从其关闭位置移动到其打开位置。 所述致动器包括下臂，当所述环处于其打开位置时，所述下臂具有可与所述环支撑件的下表面接合的接触表面，并且当所述环处于其闭合位置时，所述下臂与所述环形支撑件脱离接合。 接触表面在其外表面和约16度至约55度之间的水平平面之间形成一角度。

公开(公告)号：US08135219B2

公开(公告)日：2012-03-13

申请号：US11682920

申请日：2007-03-07

Applicant: Chia-Yen Chang ,  Hsin-Ping Cheng

Inventor： Chia-Yen Chang ,  Hsin-Ping Cheng

IPC: G06K9/62 ,  G03H1/00 ,  G03H1/26 ,  G03H5/32

CPC classification number: G11B7/0065 ,  G11B7/00375

Abstract: A method of detecting and compensating fail pixels in a holographic storage system. The method includes steps of: providing a plurality of image frames to show on a data plane for all pixels on the data plane being capable of outputting a light state or a dark state; sequentially recording the image frames into a storage medium; detecting the image frames by using a detecting apparatus for all pixels on the detecting apparatus being capable of outputting sensing signals corresponding to the light state and the dark state; defining a sensing difference value, which is a difference of the sensing signal outputting the light state and the dark state generated by one pixel; comparing the sensing difference value with a threshold value; and defining the corresponding pixel is a fail pixel if the sensing difference value is smaller than the threshold value.

Abstract translation: 一种在全息存储系统中检测和补偿失败像素的方法。 该方法包括以下步骤：提供多个图像帧以在数据平面上显示能够输出光状态或暗状态的数据平面上的所有像素; 顺序地将图像帧记录到存储介质中; 通过使用检测装置的检测装置来检测图像帧，所述检测装置能够输出对应于光状态和暗状态的感测信号; 定义感测差值，其是输出光状态的感测信号与由一个像素产生的暗状态的差; 将感测差值与阈值进行比较; 并且如果感测差值小于阈值，则定义相应像素是失效像素。

公开(公告)号：US08120152B2

公开(公告)日：2012-02-21

申请号：US12192761

申请日：2008-08-15

Applicant: Pao-Huei Chang Chien ,  Ping-Cheng Hu ,  Chien-Wen Chen

Inventor： Pao-Huei Chang Chien ,  Ping-Cheng Hu ,  Chien-Wen Chen

IPC: H01L23/495

CPC classification number: H01L21/4832 ,  H01L23/3107 ,  H01L23/49548 ,  H01L23/49582 ,  H01L24/48 ,  H01L24/73 ,  H01L24/97 ,  H01L2224/32145 ,  H01L2224/32245 ,  H01L2224/32257 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/07802 ,  H01L2924/12041 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/30105 ,  H01L2224/85 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A semiconductor package and related methods are described. In one embodiment, the package includes a die pad, a first plurality of leads disposed in a lead placement area around the die pad, a second plurality of leads disposed in corner regions of the lead placement area, a semiconductor chip on the die pad and coupled to each lead, and a package body. Each lead includes an upper sloped portion and a lower sloped portion. An average of surface areas of lower surfaces of each of the second plurality of leads is at least twice as large as an average of surface areas of lower surfaces of each of the first plurality of leads. The package body substantially covers the upper sloped portions of the leads. The lower sloped portions of the leads at least partially extend outwardly from a lower surface of the package body.

Abstract translation: 描述半导体封装和相关方法。 在一个实施例中，封装包括管芯焊盘，设置在管芯焊盘周围的引线放置区域中的第一多个引线，设置在引线放置区域的拐角区域中的第二多个引线，管芯焊盘上的半导体芯片， 连接到每个引线和一个封装体。 每个引线包括上倾斜部分和下倾斜部分。 第二多个引线中的每一个的下表面的平均面积至少是第一多个引线中的每一个的下表面的平均表面积的两倍。 封装主体基本上覆盖引线的上倾斜部分。 引线的下倾斜部分至少部分地从包装体的下表面向外延伸。