摘要:
A method of forming a conductive contact includes forming a structure comprising an upper surface joining with a sidewall surface. The sidewall surface contains elemental-form silicon. Silicon is epitaxially grown from the sidewall surface. Dielectric material is formed over the upper surface and the epitaxially-grown silicon. A conductive contact is formed through the dielectric material to conductively connect with the upper surface.
摘要:
A method of forming a conductive contact includes forming a structure comprising an upper surface joining with a sidewall surface. The sidewall surface contains elemental-form silicon. Silicon is epitaxially grown from the sidewall surface. Dielectric material is formed over the upper surface and the epitaxially-grown silicon. A conductive contact is formed through the dielectric material to conductively connect with the upper surface.
摘要:
A method of creating a trench having a portion of a bulb-shaped cross-section in silicon is disclosed. The method comprises forming at least one trench in silicon and forming a liner in the at least one trench. The liner is removed from a bottom surface of the at least one trench to expose the underlying silicon. A portion of the underlying exposed silicon is removed to form a cavity in the silicon. At least one removal cycle is conducted to remove exposed silicon in the cavity to form a bulb-shaped cross-sectional profile, with each removal cycle comprising subjecting the silicon in the cavity to ozonated water to oxidize the silicon and subjecting the oxidized silicon to a hydrogen fluoride solution to remove the oxidized silicon. A semiconductor device structure comprising the at least one trench comprising a cavity with a bulb-shaped cross-sectional profile is also disclosed.
摘要:
A method of creating a trench having a portion of a bulb-shaped cross-section in silicon is disclosed. The method comprises forming at least one trench in silicon and forming a liner in the at least one trench. The liner is removed from a bottom surface of the at least one trench to expose the underlying silicon. A portion of the underlying exposed silicon is removed to form a cavity in the silicon. At least one removal cycle is conducted to remove exposed silicon in the cavity to form a bulb-shaped cross-sectional profile, with each removal cycle comprising subjecting the silicon in the cavity to ozonated water to oxidize the silicon and subjecting the oxidized silicon to a hydrogen fluoride solution to remove the oxidized silicon. A semiconductor device structure comprising the at least one trench comprising a cavity with a bulb-shaped cross-sectional profile is also disclosed.
摘要:
A memory process is described. A substrate is provided, having therein trenches and conductive lines buried in the trenches and having thereon an array area, wherein each of the conductive lines has an array portion in the array area. A contact area apart from the array area is defined on the substrate, wherein each of the conductive lines has a contact portion in the contact area. The substrate between the contact portions of the conductive lines is etched down to below the tops of the conductive layers to form gaps between the contact portions of the conductive lines. The gaps are then filled with an insulating layer.
摘要:
The present invention provides a dynamic network address translation system and method of transparent private network device. With the NAT approach, the first device in a public network can be connected to a second device in a private network. The first packet for the connection is sent from the first device in the public network to the second device in the private network. Before establishing the connection, the first device exchanges information between the NAPT router of the private network. The NAPT router maintains its translation table according to the information. Then, the first device sends a connection request to a specific port of the NAPT router, and the packet will be transformed and routed properly to the second device.
摘要:
Methods are disclosed for forming connections to a memory array and a periphery of the array. The methods include forming stacks of conductive materials on the array and the periphery and forming a step between the periphery stack and the array stack. The step is removed during subsequent processing, and connections are formed from the conductive materials remaining on the array and the periphery. In some embodiments, the step is removed before any photolithographic processes.
摘要:
A flash memory including a substrate having a recess, a buried bit line, a word line, a single side insulating layer, a floating gate, a tunneling dielectric layer, a control gate, and an inter-gate dielectric layer is provided. The buried bit line extends below the recess of the substrate along a first direction. The word line is on the substrate, and extends above the recess along a second direction. The single side insulating layer is on a first sidewall of the recess. The floating gate is on a second sidewall of the recess to be opposite to the single side insulating layer. The tunneling dielectric layer is sandwiched by the floating gate and the substrate to contact the buried bit line. The control gate fills the recess and contacts the word line. The inter-gate dielectric layer is sandwiched by the control gate and the floating gate.
摘要:
A compensation system for a vehicle has a main reservoir, a vapor collector, an expansion tube, a working liquid supplying reservoir and an oil tank. The main reservoir is connected with the vapor collector via a heat absorbing pipe. The expansion tube is connected to the vapor collector. Two turbines are rotatably received in the expansion tube and are connected to a generator. The supplying reservoir is connected to the expansion tube. The oil tank encloses the expansion tube and absorbs the heat of the waste gas dissipated from the engine. Accordingly, the turbines will be actuated to rotate by means of expansion of volume of the working liquid sprayed into the expansion tube to actuate the generator to operate. The waste heat dissipated from the engine of the vehicle can be efficiently reused.
摘要:
A memory process is described. A substrate is provided, having therein trenches and conductive lines buried in the trenches and having thereon an array area, wherein each of the conductive lines has an array portion in the array area. A contact area apart from the array area is defined on the substrate, wherein each of the conductive lines has a contact portion in the contact area. The substrate between the contact portions of the conductive lines is etched down to below the tops of the conductive layers to form gaps between the contact portions of the conductive lines. The gaps are then filled with an insulating layer.