公开(公告)号：US08932107B2

公开(公告)日：2015-01-13

申请号：US14027070

申请日：2013-09-13

Applicant: Applied Materials, Inc.

Inventor： Jeffrey Drue David ,  Boguslaw A. Swedek ,  Dominic J. Benvegnu ,  Sivakumar Dhandapani

IPC: B24B1/00 ,  B24B49/12 ,  B24B37/013 ,  B24B37/10

CPC classification number: B24B49/12 ,  B24B37/013 ,  B24B37/105

Abstract: A polishing apparatus includes a platen to hold a polishing pad having a plurality of optical apertures, a carrier head to hold a substrate against the polishing pad, a motor to generate relative motion between the carrier head and the platen, and an optical monitoring system. The optical monitoring system includes at least one light source, a common detector, and an optical assembly configured to direct light from the at least one light source to each of a plurality of separated positions in the platen, to direct light from each position of the plurality of separated positions to the substrate as the substrate passes over said each position, to receive reflected light from the substrate as the substrate passes over said each position, and to direct the reflected light from each of the plurality of separated positions to the common detector.

Abstract translation: 抛光装置包括用于保持具有多个光学孔的抛光垫的压板，用于将衬底保持在抛光垫上的载体头，用于在承载头和压板之间产生相对运动的电动机以及光学监控系统。 所述光学监视系统包括至少一个光源，公共检测器和配置成将来自所述至少一个光源的光引导到所述压板中的多个分离位置中的每一个的光学组件，以引导来自所述至少一个光源的每个位置的光 当衬底越过所述每个位置时，多个分离的位置到衬底，以在衬底经过所述每个位置时接收来自衬底的反射光，并将来自多个分离位置中的每一个的反射光引导到公共检测器 。

公开(公告)号：US08874250B2

公开(公告)日：2014-10-28

申请号：US14046237

申请日：2013-10-04

Applicant: Applied Materials, Inc.

Inventor： Jeffrey Drue David ,  Dominic J. Benvegnu ,  Harry Q. Lee ,  Boguslaw A. Swedek ,  Lakshmanan Karuppiah

IPC: G06F19/00 ,  B24B49/00 ,  G01B11/28 ,  B24B49/12 ,  G05B15/02 ,  B24B37/013

CPC classification number: G05B15/02 ,  B24B37/013 ,  B24B49/12

Abstract: Methods, systems, and apparatus for spectrographic monitoring of a substrate during chemical mechanical polishing are described. In one aspect, a computer-implemented method includes storing a library having a plurality of reference spectra, each reference spectrum of the plurality of reference spectra having a stored associated index value, measuring a sequence of spectra in-situ during polishing to obtain measured spectra, for each measured spectrum of the sequence of spectra, finding a best matching reference spectrum to generate a sequence of best matching reference spectra, determining the associated index value for each best matching spectrum from the sequence of best matching reference spectra to generate a sequence of index values, fitting a linear function to the sequence of index values, and halting the polishing either when the linear function matches or exceeds a target index or when the associated index value from the determining step matches or exceeds the target index.

Abstract translation: 描述了在化学机械抛光期间用于光谱监测基底的方法，系统和装置。 一方面，计算机实现的方法包括存储具有多个参考光谱的库，多个参考光谱的每个参考光谱具有存储的相关联的索引值，在抛光期间原位测量光谱序列以获得测量的光谱 ，对于光谱序列的每个测量光谱，找到最佳匹配参考光谱以产生最佳匹配参考光谱序列，从最佳匹配参考光谱序列确定每个最佳匹配光谱的相关索引值，以产生序列 索引值，将线性函数拟合到索引值序列，以及当线性函数匹配或超过目标索引时或者当来自确定步骤的相关索引值匹配或超过目标索引时停止抛光。

公开(公告)号：US20140316550A1

公开(公告)日：2014-10-23

申请号：US14322686

申请日：2014-07-02

Applicant: Applied Materials, Inc.

Inventor： Boguslaw A. Swedek ,  Dominic J. Benvegnu ,  Jeffrey Drue David

IPC: B24B49/12 ,  G05B15/02

Abstract: A computer implemented method of monitoring a polishing process includes, for each sweep of a plurality of sweeps of an optical sensor across a substrate undergoing polishing, obtaining a plurality of current spectra, each current spectrum of the plurality of current spectra being a spectrum resulting from reflection of white light from the substrate, for each sweep of the plurality of sweeps, determining a difference between each current spectrum and each reference spectrum of a plurality of reference spectra to generate a plurality of differences, for each sweep of the plurality of sweeps, determining a smallest difference of the plurality of differences, thus generating a sequence of smallest difference, and determining a polishing endpoint based on the sequence of smallest differences.

Abstract translation: 监测抛光过程的计算机实现的方法包括：对于经历抛光的衬底上的光学传感器的多个扫描的每次扫描，获得多个电流光谱，多个电流光谱的每个电流光谱是由 对于多个扫描的每次扫描，从基板反射白光，确定多个参考光谱的每个当前光谱和每个参考光谱之间的差异，以对于多个扫描的每次扫描产生多个差异， 确定多个差异的最小差异，从而产生最小差异的序列，并且基于最小差异的序列确定抛光端点。

公开(公告)号：US20140242878A1

公开(公告)日：2014-08-28

申请号：US13777672

申请日：2013-02-26

Applicant: Applied Materials, Inc.

Inventor： Benjamin Cherian ,  Jeffrey Drue David ,  Boguslaw A. Swedek ,  Dominic J. Benvegnu ,  Jun Qian ,  Thomas H. Osterheld

IPC: B24B49/12 ,  B24B37/013

CPC classification number: B24B49/12 ,  B24B37/013

Abstract: A method of controlling a polishing operation includes measuring a plurality of spectra at a plurality of different positions on a substrate to provide a plurality of measured spectra. For each measured spectrum of the plurality of measured spectra, a characterizing value is generated based on the measured spectrum. For each characterizing value, a goodness of fit of the measured spectrum to another spectrum used in generating the characterizing value is determined. A wafer-level characterizing value map is generated by applying a regression to the plurality of characterizing values with the plurality of goodnesses of fit used as weighting factors in the regression. A polishing endpoint or a polishing parameter of the polishing apparatus is adjusted based on the wafer-level characterizing map, and the substrate or a subsequent substrate is polished in the polishing apparatus with the adjusted polishing endpoint or polishing parameter.

Abstract translation: 控制抛光操作的方法包括测量衬底上多个不同位置处的多个光谱以提供多个测量光谱。 对于多个测量光谱的每个测量光谱，基于测量的光谱产生表征值。 对于每个特征值，确定测量的光谱与生成表征值所使用的另一光谱的拟合度。 通过将回归应用于具有多个适合度的拟合优点用作回归中的加权因子来生成晶片级特征值映射。 基于晶片级特征图调整抛光装置的抛光终点或抛光参数，并且在抛光装置中用调整的抛光终点或抛光参数对衬底或随后的衬底进行抛光。

公开(公告)号：US20140141695A1

公开(公告)日：2014-05-22

申请号：US13791617

申请日：2013-03-08

Applicant: Applied Materials, Inc.

Inventor： Jeffrey Drue David ,  Boguslaw A. Swedek ,  Doyle E. Bennett ,  Thomas H. Osterheld ,  Benjamin Cherian ,  Dominic J. Benvegnu ,  Harry Q. Lee ,  Allen L. D'Ambra ,  Jagan Rangarajan

IPC: B24B37/005

CPC classification number: B24B37/005 ,  B24B37/013 ,  B24B37/04 ,  B24B37/345

Abstract: A polishing apparatus includes a plurality of stations supported on a platform, the plurality of stations including at least two polishing stations and a transfer station, each polishing station including a platen to support a polishing pad, a plurality of carrier heads suspended from and movable along a track such that each polishing station is selectively positionable at the stations, and a controller configured to control motion of the carrier heads along the track such that during polishing at each polishing station only a single carrier head is positioned in the polishing station.

Abstract translation: 抛光装置包括支撑在平台上的多个工位，所述多个工位包括至少两个抛光站和转移站，每个抛光站包括用于支撑抛光垫的压板，多个托架头悬挂并可沿其移动 轨道，使得每个抛光站可选择性地定位在车站处;以及控制器，被配置为控制承载头沿着轨道的运动，使得在每个抛光站的抛光期间，只有单个承载头位于抛光台中。

公开(公告)号：US20140080232A1

公开(公告)日：2014-03-20

申请号：US14088933

申请日：2013-11-25

Applicant: Applied Materials, Inc.

Inventor： Dominic J. Benvegnu ,  Boguslaw A. Swedek ,  David J. Lischka

IPC: H01L21/66 ,  B24B37/013

CPC classification number: H01L22/26 ,  B24B37/013 ,  B24B49/12 ,  B24D7/12 ,  H01L21/31053 ,  H01L21/3212

Abstract: A polishing system receives one or more target parameters for a selected peak in a spectrum of light, polishes a substrate, measures a current spectrum of light reflected from the substrate while the substrate is being polished, identifies the selected peak in the current spectrum, measures one or more current parameters of the selected peak in the current spectrum, compares the current parameters of the selected peak to the target parameters, and ceases to polish the substrate when the current parameters and the target parameters have a pre defined relationship.

Abstract translation: 抛光系统接收光谱中所选峰的一个或多个目标参数，抛光衬底，在衬底被抛光时测量从衬底反射的光的当前光谱，识别当前光谱中所选择的峰，测量 当前频谱中所选峰的一个或多个当前参数将所选峰的当前参数与目标参数进行比较，并且当当前参数和目标参数具有预定关系时，停止抛光衬底。

公开(公告)号：US20140045282A1

公开(公告)日：2014-02-13

申请号：US14041113

申请日：2013-09-30

Applicant: Applied Materials, Inc.

Inventor： Harry Q. Lee ,  Boguslaw A. Swedek ,  Dominic J. Benvegnu ,  Jeffrey Drue David

IPC: H01L21/66 ,  H01L21/306

CPC classification number: H01L22/12 ,  B24B37/013 ,  B24B49/12 ,  H01L21/30625 ,  H01L2924/0002 ,  H01L2924/00

Abstract: Methods of determining a polishing endpoint are described using spectra obtained during a polishing sequence. In particular, techniques for using only desired spectra, faster searching methods and more robust rate determination methods are described.

Abstract translation: 使用在抛光顺序期间获得的光谱来描述确定抛光终点的方法。 特别地，描述了仅使用期望的光谱，更快的搜索方法和更稳定的速率确定方法的技术。

公开(公告)号：US12288724B2

公开(公告)日：2025-04-29

申请号：US17680167

申请日：2022-02-24

Applicant: Applied Materials, Inc.

Inventor： Dominic J. Benvegnu ,  Nojan Motamedi

IPC: H01L21/66 ,  G01N21/95 ,  G06T7/00 ,  G06T7/10 ,  G06T7/90 ,  H01L21/306

Abstract: A method of classification of a film non-uniformity on a substrate includes obtaining a color image of a substrate with the color image comprising a plurality of color channels, obtaining a standard color for the color image of the substrate, for each respective pixel along a path in the color image determining a difference vector between the a color of the respective pixel and the standard color to generate a sequence of difference vectors, sorting the pixels along the path into a plurality of regions including at least one normal region and at least one abnormal region based on the sequence of difference vectors, and classifying the at least one abnormal region as overpolished or underpolished based on at least one difference vector of a pixel at a boundary between the abnormal region and an adjacent normal region.

公开(公告)号：US20240017371A1

公开(公告)日：2024-01-18

申请号：US18352432

申请日：2023-07-14

Applicant: Applied Materials, Inc.

Inventor： Brian J. Brown ,  Chirantha Rodrigo ,  Ekaterina A. Mikhaylichenko ,  Boguslaw A. Swedek ,  Thomas H. Osterheld ,  Dominic J. Benvegnu ,  Lakshmanan Karuppiah

IPC: B24B37/013

CPC classification number: B24B37/013

Abstract: A chemical mechanical polishing system includes a support configured to hold a substrate face-up, a polishing article having a polishing surface smaller than an exposed surface of the substrate, a port for dispensing a polishing liquid, one or more actuators to bring the polishing surface into contact with a first portion of the exposed surface of the substrate and to generate relative motion between the substrate and the polishing pad and optically transmissive polymer window, an in-situ optical monitoring system, and a controller configured to receive a signal from the optical in-situ monitoring system and to modifying a polishing parameter based on the signal. The optical monitoring system includes a light source and a detector, the in-situ optical monitoring system configured to direct a light beam from above the support to impinge a non-overlapping second portion of the exposed surface of the substrate.

公开(公告)号：US20230390883A1

公开(公告)日：2023-12-07

申请号：US17961516

申请日：2022-10-06

Applicant: Applied Materials, Inc.

Inventor： Haoquan Fang ,  Thomas H. Osterheld ,  Benjamin Cherian ,  Jun Qian ,  Kun Xu ,  Sohrab Pourmand ,  Boguslaw A. Swedek ,  Jeonghoon Oh ,  Dominic J. Benvegnu ,  Brian J. Brown

IPC: B24B37/005 ,  B24B37/32 ,  G01N29/44 ,  G01N29/46

CPC classification number: B24B37/005 ,  B24B37/32 ,  G01N29/4436 ,  G01N29/4427 ,  G01N29/46

Abstract: A chemical mechanical polishing apparatus includes a platen supporting a polishing pad, a carrier head to hold a surface of a substrate against the polishing pad, an acoustic sensor supported on the platen, and a motor to generate relative motion between the platen and the carrier head so as to polish the substrate. The carrier head includes a retaining ring for holding the substrate, and the acoustic sensor travels in a path below the carrier head and the retaining ring. A controller is configured to analyze a signal from the acoustic sensor and determine a characteristic of the retaining ring based on the signal.