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公开(公告)号：US4289794A
公开(公告)日：1981-09-15
申请号：US129513
申请日：1980-03-12
CPC分类号： A23G3/52 , A23G3/0221 , A23G3/0294
摘要： Gasified candy which produces a more pronounced popping sensation is prepared by maintaining a sugar melt at a temperature of below about 280.degree. F. during gasification. This product contains observable gas bubbles with a majority of the large bubbles having a diameter greater than about 225.mu. which is substantially larger than those in the gasified candy produced heretofore.
摘要翻译： 通过在气化期间将糖熔体保持在低于约280°F的温度来制备产生更显着爆发感的气化糖。 该产品含有可观察到的气泡，大部分大气泡的直径大于约225微米，这大大大于迄今为止生产的气化糖果中的气泡。
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62.发明授权
公开(公告)号：US4273793A
公开(公告)日：1981-06-16
申请号：US88485
申请日：1979-10-26
CPC分类号： A23G3/0294 , A23G3/0221 , A23G3/0252 , Y10S264/83
摘要： An injection molding arrangement and process for producing regularly shaped pieces of gasified candy which effect a pleasant sizzling sensation in the mouth. A confectionary solution, which may be a sugar melt, is subjected to a superatmospheric carbonating pressure in a carbonating vessel to cause absorption therein of carbon dioxide. An injection mold for forming the solution into suitably shaped pieces of candy is prepressurized at a superatmospheric carbonation pressure prior to the injection therein of the confectionary solution. The solution is then injected into the mold at a pressure substantially above the superatmospheric pressure in the carbonation vessel. The solution is then allowed to cool and solidify in the pressurized mold, producing regularly shaped pieces of carbonated candy.
摘要翻译： 一种用于生产规则形状的气化糖果片的注射成型装置和方法，其在口中产生令人愉快的嘶嘶感。 可以是糖熔体的糖食溶液在碳酸化容器中经受超大气压碳酸化压力以在其中吸收二氧化碳。 用于将溶液形成适当成形的糖果块的注塑模具在其中注入糖果溶液之前以超大气压碳酸化压力进行预加压。 然后将溶液以基本上高于碳酸化容器中的超大气压力的压力注入模具中。 然后将溶液在加压模具中冷却和固化，产生规则形状的碳酸化糖果片。
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63.发明申请METHODS FOR PRODUCING IN-SITU GROOVES IN CHEMICAL MECHANICAL PLANARIZATION (CMP) PADS, AND NOVEL CMP PAD DESIGNS 审中-公开在化学机械平面化（CMP）PADS和新型CMP垫设计中生产现场格栅的方法公开(公告)号：US20150093977A1
公开(公告)日：2015-04-02
申请号：US14562589
申请日：2014-12-05
申请人： Manish Deopura , Hem M. Vaidya , Pradip K. Roy
发明人： Manish Deopura , Hem M. Vaidya , Pradip K. Roy
IPC分类号： B24B37/26
CPC分类号： B24B37/26 , B24D15/04 , B24D18/0009 , B29C33/3842 , B29C33/405 , B29C33/424 , B29C33/565 , B29K2083/00 , B33Y80/00
摘要： Methods for producing in-situ grooves in CMP pads are provided. In general, the methods for producing in-situ grooves comprise the steps of patterning a silicone lining, placing the silicone lining in, or on, a mold, adding CMP pad material to the silicone lining, and allowing the CMP pad to solidify. CMP pads comprising novel groove designs are also described. For example, described here are CMP pads comprising concentric circular grooves and axially curved grooves, reverse logarithmic grooves, overlapping circular grooves, lassajous groves, double spiral grooves, and multiply overlapping axially curved grooves. The CMP pads may be made from polyurethane, and the grooves produced therein may be made by a method from the group consisting of silicone lining, laser writing, water jet cutting, 3-D printing, thermoforming, vacuum forming, micro-contact printing, hot stamping, and mixtures thereof.
摘要翻译： 提供了用于在CMP垫中产生原位凹槽的方法。 通常，用于制造原位槽的方法包括将硅衬里图案化，将硅衬里放置在模具中或模具上，将CMP衬垫材料添加到硅衬里，并允许CMP垫固化的步骤。 还描述了包括新颖凹槽设计的CMP垫。 例如，这里描述的是包括同心圆形槽和轴向弯曲槽，反向对数槽，重叠圆形槽，拉索格，双螺旋槽和多重重叠的轴向曲线槽的CMP垫。 CMP垫可以由聚氨酯制成，并且其中产生的凹槽可以由以下方法制成：由硅胶衬里，激光书写，水射流切割，3-D印刷，热成型，真空成型，微接触印刷， 热冲压及其混合物。
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公开(公告)号：US08715035B2
公开(公告)日：2014-05-06
申请号：US11884829
申请日：2006-02-21
申请人： Pradip K. Roy , Manish Deopura , Sudhanshu Misra
发明人： Pradip K. Roy , Manish Deopura , Sudhanshu Misra
IPC分类号： B24B49/00
摘要： The present application relates to polishing pads for chemical mechanical planarization (CMP) of substrates, and methods of fabrication and use thereof. The pads described in this invention are customized to polishing specifications where specifications include (but not limited to) to the material being polished, chip design and architecture, chip density and pattern density, equipment platform and type of slurry used. These pads can be designed with a specialized polymeric nano-structure with a long or short range order which allows for molecular level tuning achieving superior thermo-mechanical characteristics. More particularly, the pads can be designed and fabricated so that there is both uniform and nonuniform spatial distribution of chemical and physical properties within the pads. In addition, these pads can be designed to tune the coefficient of friction by surface engineering, through the addition of solid lubricants, and creating low shear integral pads having multiple layers of polymeric material which form an interface parallel to the polishing surface. The pads can also have controlled porosity, embedded abrasive, novel grooves on the polishing surface, for slurry transport, which are produced in situ, and a transparent region for endpoint detection.
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公开(公告)号：US20130059509A1
公开(公告)日：2013-03-07
申请号：US13612135
申请日：2012-09-12
申请人： Manish Deopura , Hem M. Vaidya , Pradip K. Roy
发明人： Manish Deopura , Hem M. Vaidya , Pradip K. Roy
IPC分类号： B24B37/26
CPC分类号： B24B37/26 , B24D15/04 , B24D18/0009 , B29C33/3842 , B29C33/405 , B29C33/424 , B29C33/565 , B29K2083/00 , B33Y80/00
摘要： Methods for producing in-situ grooves in CMP pads are provided. In general, the methods for producing in-situ grooves comprise the steps of patterning a silicone lining, placing the silicone lining in, or on, a mold, adding CMP pad material to the silicone lining, and allowing the CMP pad to solidify. CMP pads comprising novel groove designs are also described. For example, described here are CMP pads comprising concentric circular grooves and axially curved grooves, reverse logarithmic grooves, overlapping circular grooves, lassajous groves, double spiral grooves, and multiply overlapping axially curved grooves. The CMP pads may be made from polyurethane, and the grooves produced therein may be made by a method from the group consisting of silicone lining, laser writing, water jet cutting, 3-D printing, thermoforming, vacuum forming, micro-contact printing, hot stamping, and mixtures thereof.
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66.发明授权Methods for producing in-situ grooves in chemical mechanical planarization (CMP) pads, and novel CMP pad designs 有权用于在化学机械平面化（CMP）焊盘中产生原位槽的方法，以及新颖的CMP焊盘设计公开(公告)号：US08287793B2
公开(公告)日：2012-10-16
申请号：US11998212
申请日：2007-11-28
申请人： Manish Deopura , Hem M. Vaidya , Pradip K. Roy
发明人： Manish Deopura , Hem M. Vaidya , Pradip K. Roy
IPC分类号： B29C39/00
CPC分类号： B24B37/26 , B24D15/04 , B24D18/0009 , B29C33/3842 , B29C33/405 , B29C33/424 , B29C33/565 , B29K2083/00 , B33Y80/00
摘要： Methods for producing in-situ grooves in CMP pads are provided. In general, the methods for producing in-situ grooves comprise the steps of patterning a silicone lining, placing the silicone lining in, or on, a mold, adding CMP pad material to the silicone lining, and allowing the CMP pad to solidify. CMP pads comprising novel groove designs are also described. For example, described here are CMP pads comprising concentric circular grooves and axially curved grooves, reverse logarithmic grooves, overlapping circular grooves, lassajous grooves, double spiral grooves, and multiple overlapping axially curved grooves. The CMP pads may be made from polyurethane, and the grooves produced therein may be made by a method from the group consisting of silicone lining, laser writing, water jet cutting, 3-D printing, thermoforming, vacuum forming, micro-contact printing, hot stamping, and mixtures thereof.
摘要翻译： 提供了用于在CMP垫中产生原位凹槽的方法。 通常，用于制造原位槽的方法包括将硅衬里图案化，将硅衬里放置在模具中或模具上，将CMP衬垫材料添加到硅衬里，并允许CMP垫固化的步骤。 还描述了包括新颖凹槽设计的CMP垫。 例如，这里描述的是包括同心圆形槽和轴向弯曲槽，反向对数槽，重叠圆形槽，拉索槽，双螺旋槽和多个重叠轴向弯曲槽的CMP垫。 CMP垫可以由聚氨酯制成，并且其中产生的凹槽可以由以下方法制成：由硅胶衬里，激光书写，水射流切割，3-D印刷，热成型，真空成型，微接触印刷， 热冲压及其混合物。
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公开(公告)号：US20080253728A1
公开(公告)日：2008-10-16
申请号：US11899234
申请日：2007-09-05
IPC分类号： G02B6/10 , C03B37/022
CPC分类号： G02B6/132 , G02B6/122 , G02B6/1223 , G02B2006/12097 , G02B2006/121 , G02B2006/12169 , G02B2006/12176
摘要： The invention provides a waveguide with a waveguide core having longitudinal sidewall surfaces, a longitudinal top surface, and a longitudinal bottom surface that is disposed on a substrate. An interface layer is disposed on at least one longitudinal sidewall surface of the waveguide core. A waveguide cladding layer is disposed on at least the waveguide core sidewall and top surfaces, over the interface layer. The waveguide of the invention can be produced by forming a waveguide undercladding layer on a substrate, and then forming a waveguide core on the undercladding layer. An interface layer is then formed on at least a longitudinal sidewall surface of the waveguide core, and an upper cladding layer is formed on a longitudinal top surface and on longitudinal sidewall surfaces of the waveguide core, over the interface layer.
摘要翻译： 本发明提供一种具有波导芯的波导，波导芯具有纵向侧壁表面，纵向顶表面和设置在基底上的纵向底表面。 界面层设置在波导芯的至少一个纵向侧壁表面上。 至少在波导芯侧壁和顶表面上，在界面层上设置波导覆层。 本发明的波导可以通过在基板上形成波导管下封层，然后在下封层上形成波导芯来制造。 然后在波导芯的至少纵向侧壁表面上形成界面层，并且在该界面层上的纵向顶表面和波导芯的纵向侧壁表面上形成上覆层。
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公开(公告)号：US07425172B2
公开(公告)日：2008-09-16
申请号：US10810070
申请日：2004-03-25
申请人： Sudhanshu Misra , Pradip K. Roy
发明人： Sudhanshu Misra , Pradip K. Roy
CPC分类号： B24B53/017 , B24B37/042 , B24B37/20 , B24B49/02
摘要： A polishing pad for chemical mechanical planarization of a film on a substrate is customized by obtaining one or more characteristics of a structure on a substrate. For example, when the structure is a chip formed on a semiconductor wafer, the one or more characteristics of the structure can include chip size, pattern density, chip architecture, film material, film topography, and the like. Based on the one or more characteristics of the structure, a value for the one or more chemical or physical properties of the pad is selected. For example, the one or more chemical or physical properties of the pad can include pad material hardness, thickness, surface grooving, pore size, porosity, Youngs modulus, compressibility, asperity, and the like.
摘要翻译： 通过在衬底上获得结构的一个或多个特性来定制用于衬底上的膜的化学机械平坦化的抛光垫。 例如，当结构是形成在半导体晶片上的芯片时，结构的一个或多个特性可以包括芯片尺寸，图案密度，芯片结构，薄膜材料，薄膜形貌等。 基于结构的一个或多个特性，选择垫的一种或多种化学或物理性质的值。 例如，衬垫的一种或多种化学或物理性质可以包括衬垫材料硬度，厚度，表面开槽，孔径，孔隙率，杨氏模量，可压缩性，粗糙度等。
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69.发明申请Customized polishing pads for CMP and methods of fabrication and use thereof 有权定制的CMP抛光垫及其制造方法和使用方法公开(公告)号：US20080207100A1
公开(公告)日：2008-08-28
申请号：US11998319
申请日：2007-11-28
申请人： Pradip K. Roy , Manish Deopura , Sudhanshu Misra
发明人： Pradip K. Roy , Manish Deopura , Sudhanshu Misra
IPC分类号： B24D11/00
摘要： The present application relates to polishing pads for chemical mechanical planarization (CMP) of substrates, and methods of fabrication and use thereof. The pads described in this invention are customized to polishing specifications where specifications include (but not limited to) to the material being polished, chip design and architecture, chip density and pattern density, equipment platform and type of slurry used. These pads can be designed with a specialized polymeric nano-structure with a long or short range order which allows for molecular level tuning achieving superior thermo-mechanical characteristics. More particularly, the pads can be designed and fabricated so that there is both uniform and nonuniform spatial distribution of chemical and physical properties within the pads. In addition, these pads can be designed to tune the coefficient of friction by surface engineering, through the addition of solid lubricants, and creating low shear integral pads having multiple layers of polymeric material which form an interface parallel to the polishing surface. The pads can also have controlled porosity, embedded abrasive, novel grooves on the polishing surface, for slurry transport, which are produced in situ, and a transparent region for endpoint detection.
摘要翻译： 本申请涉及用于基板的化学机械平面化（CMP）的抛光垫及其制造和使用方法。 本发明中描述的焊盘定制为抛光规格，其中规格包括（但不限于）被抛光材料，芯片设计和结构，芯片密度和图案密度，设备平台和使用的浆料类型。 这些垫可以设计成具有长或短范围顺序的专门的聚合物纳米结构，其允许分子水平调节实现优异的热机械特性。 更具体地，可以设计和制造焊盘，使得焊盘内的化学和物理性质均匀和不均匀的空间分布。 此外，这些垫可以被设计成通过表面工程，通过添加固体润滑剂来调节摩擦系数，并且产生具有形成与抛光表面平行的界面的多层聚合材料的低剪切整体垫。 焊盘还可以具有受控的孔隙率，嵌入式研磨剂，抛光表面上的新型凹槽，用于原位生产的浆料输送，以及用于端点检测的透明区域。
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公开(公告)号：USD526762S1
公开(公告)日：2006-08-22
申请号：US29196246
申请日：2003-12-22
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