公开(公告)号：US10582284B2

公开(公告)日：2020-03-03

申请号：US15169563

申请日：2016-05-31

Applicant: APPLE INC.

Inventor： Glenn K. Trainer ,  Scott C. Grinker ,  Ethan L. Huwe ,  Craig M. Stanley

IPC: H04R1/00 ,  H04R1/10 ,  G10K11/178 ,  H04R5/033 ,  H04R1/26 ,  H04R5/04 ,  H04R11/02

Abstract: A low-profile earbud is disclosed that sits securely within an ear of a user. The earbud includes a protruding portion that passes through a channel defined by the tragus and anti-tragus of the ear. In some embodiments, the protruding portion can take the form of a cable configured to supply power and transfer data to the earbud. In some embodiments, the protruding portion can provide additional space for electrical components and sensors supporting the earbud.

公开(公告)号：US20190230434A1

公开(公告)日：2019-07-25

申请号：US16375735

申请日：2019-04-04

Applicant: Apple Inc.

Inventor： Craig M. Stanley ,  Simon K. Porter ,  John H. Sheerin ,  Glenn K. Trainer ,  Jason C. Della Rosa ,  Ethan L. Huwe ,  Sean T. McIntosh ,  Erik L. Wang ,  Christopher J. Stringer ,  Molly J. Anderson

IPC: H04R1/28 ,  H01H13/02 ,  G06F3/01 ,  G06F3/02 ,  G06F3/041 ,  G06F3/0354 ,  H04R1/02 ,  H04R3/00 ,  H04R7/12 ,  H04R7/18 ,  H04R9/02 ,  H04R9/06 ,  H04R1/40 ,  H05K1/02 ,  H03K17/96 ,  H04R31/00 ,  H04R5/02 ,  H04R1/30 ,  H04R1/26 ,  G06F3/044 ,  F21V33/00 ,  F21V5/00 ,  F21V23/04 ,  F21V3/00 ,  G06F3/16 ,  H04R3/12

Abstract: This disclosure relates to speakers and more specifically to an array speaker for distributing music uniformly across a room. A number of audio drivers can be radially distributed within a speaker housing so that an output of the drivers is distributed evenly throughout the room. In some embodiments, the exit geometry of the audio drivers can be configured to bounce off a surface supporting the array speaker to improve the distribution of music throughout the room. The array speaker can include a number of vibration isolation elements distributed within a housing of the array speaker. The vibration isolation elements can be configured to reduce the strength of forces generated by a subwoofer of the array speaker.

公开(公告)号：US20190103661A1

公开(公告)日：2019-04-04

申请号：US15721532

申请日：2017-09-29

Applicant: Apple Inc.

Inventor： Benjamin A. Cousins ,  Carlo Di Nallo ,  Ethan L. Huwe ,  Jerzy S. Guterman ,  Joachim S. Hammerschmidt ,  Mattia Pascolini ,  Ruben Caballero ,  Samuel G. Parker

IPC: H01Q1/27 ,  H01Q9/04 ,  H04B1/3827 ,  H04R1/10

Abstract: An electronic device such as a wireless earbud may have antenna structures that are configured to form one or more antenna portions or antennas for transmitting and receiving wireless signals. The device may include control circuitry that is configured to selectively activate one or more antennas or antenna portions to transmit and receive wireless signals for the device. The device may include sensor circuitry that provide sensor data to the control circuitry. The control circuitry may use the sensor data to select and activate an optimal antenna based on the orientation of the earbud or the environment of the device. The antennas may be formed on opposing sides of a housing for the device. By providing configurable antenna structures, the device may be configured to adapt to the current environment and efficiently perform communications operations.

公开(公告)号：US10129625B2

公开(公告)日：2018-11-13

申请号：US15253794

申请日：2016-08-31

Applicant: Apple Inc.

Inventor： Ethan L. Huwe ,  Brad G. Boozer ,  Erik L. Wang ,  Phillip Qian

IPC: H04R1/10

Abstract: Headphone eartips with internal support components and methods for making the same are provided. Different support components may provide specific amounts and types of additional rigidity at specific portions of an exterior surface of an outer eartip body that may be expected to interface with specific portions of an ear canal geometry when an eartip subassembly is positioned within the ear canal, such that the eartip subassembly may conform to the various shapes of the ear canal while maintaining an acoustic seal.

公开(公告)号：US20180087767A1

公开(公告)日：2018-03-29

申请号：US15613073

申请日：2017-06-02

Applicant: Apple Inc.

Inventor： Glenn K. Trainer ,  Rong Liu ,  Benjamin A. Cousins ,  Yupin Sun ,  Jun Qi ,  Jason W. Brinsfield ,  Ethan L. Huwe ,  Craig M. Stanley ,  Molly J. Anderson ,  Javier Mendez

IPC: F21V33/00 ,  F21V5/00 ,  F21V3/00 ,  F21V23/04 ,  H04R1/02 ,  G06F3/16 ,  H04R1/40 ,  H04R3/12

CPC classification number: H04R1/2888 ,  F21V3/00 ,  F21V5/007 ,  F21V23/0485 ,  F21V33/0056 ,  G06F3/01 ,  G06F3/016 ,  G06F3/0202 ,  G06F3/03547 ,  G06F3/041 ,  G06F3/044 ,  G06F3/165 ,  H01H13/023 ,  H03K17/962 ,  H03K2217/960785 ,  H04R1/025 ,  H04R1/026 ,  H04R1/26 ,  H04R1/2811 ,  H04R1/2826 ,  H04R1/30 ,  H04R1/403 ,  H04R3/00 ,  H04R3/12 ,  H04R5/02 ,  H04R7/12 ,  H04R7/127 ,  H04R7/18 ,  H04R9/022 ,  H04R9/025 ,  H04R9/06 ,  H04R31/006 ,  H04R2201/028 ,  H04R2201/34 ,  H04R2201/401 ,  H04R2400/03 ,  H04R2400/13 ,  H04R2420/07 ,  H05K1/0274 ,  H05K1/141 ,  H05K2201/09063 ,  H05K2201/10106 ,  H05K2201/10378

Abstract: This disclosure relates to speakers and more specifically to an array speaker for distributing music uniformly across a room. A number of audio drivers can be radially distributed within a speaker housing so that an output of the drivers is distributed evenly throughout the room. In some embodiments, the exit geometry of the audio drivers can be configured to bounce off a surface supporting the array speaker to improve the distribution of music throughout the room. The array speaker can include a number of vibration isolation elements distributed within a housing of the array speaker. The vibration isolation elements can be configured reduce the strength of forces generated by a subwoofer of the array speaker.

公开(公告)号：US12147610B2

公开(公告)日：2024-11-19

申请号：US18199292

申请日：2023-05-18

Applicant: APPLE INC.

Inventor： Craig M. Stanley ,  Simon K. Porter ,  John H. Sheerin ,  Glenn K. Trainer ,  Ethan L. Huwe ,  Sean T. McIntosh ,  Jason C. Della Rosa ,  Christopher J. Stringer ,  Molly J. Anderson ,  Erik L. Wang

IPC: G06F3/02 ,  F21V3/00 ,  F21V5/00 ,  F21V23/04 ,  F21V33/00 ,  G06F3/01 ,  G06F3/0354 ,  G06F3/041 ,  G06F3/16 ,  H01H13/02 ,  H03K17/96 ,  H04R1/02 ,  H04R1/26 ,  H04R1/28 ,  H04R1/30 ,  H04R1/40 ,  H04R3/00 ,  H04R3/12 ,  H04R5/02 ,  H04R7/12 ,  H04R7/18 ,  H04R9/02 ,  H04R9/06 ,  H04R31/00 ,  H05K1/02 ,  G06F3/044 ,  H05K1/14

Abstract: A voice-controlled electronic device that includes a device housing having a longitudinal axis bisecting opposing top and bottom surfaces and a side surface extending between the top and bottom surfaces. The device can further include one or more microphones disposed within the device housing and distributed radially around the longitudinal axis; a processor configured to execute computer instructions stored in a computer-readable memory for interacting with a user and processing voice commands received by the one or more microphones and first transducer and second transducers configured to generate sound waves within different frequency ranges.

公开(公告)号：US20240348961A1

公开(公告)日：2024-10-17

申请号：US18626024

申请日：2024-04-03

Applicant: APPLE INC.

Inventor： Sean T. McIntosh ,  Jason C. Della Rosa ,  Samuel G. Parker ,  Benjamin A. Cousins ,  Ethan L. Huwe

IPC: H04R1/10 ,  A45C11/00 ,  A45C13/00 ,  E05F1/12 ,  E05F3/20 ,  G01V3/08 ,  H01F7/02 ,  H04B1/38 ,  H04B1/3827 ,  H04R1/02 ,  H05K5/00 ,  H05K5/02 ,  H05K5/03

CPC classification number: H04R1/1016 ,  A45C11/00 ,  A45C13/005 ,  E05F1/1261 ,  E05F3/20 ,  G01V3/081 ,  H01F7/02 ,  H04R1/023 ,  H04R1/1041 ,  H04R1/1058 ,  H04R1/1091 ,  H05K5/0086 ,  H05K5/0217 ,  H05K5/0226 ,  H05K5/03 ,  A45C2011/001 ,  E05Y2201/224 ,  E05Y2999/00 ,  H04B1/38 ,  H04B2001/3866 ,  H04R1/1025 ,  H04R2400/11 ,  H04R2420/07 ,  H04R2460/11

Abstract: Embodiments describe an eartip including an eartip body having an attachment end and an interfacing end opposite from the attachment end. The eartip body can include an inner eartip body having a sidewall extending between the interfacing end and the attachment end, the sidewall defining a channel and having a first thickness near the attachment end and a second thickness different from the first thickness at the interfacing end. The eartip can also include an attachment structure coupled to the inner eartip body at the attachment end, the attachment structure having an inner surface and an outer surface. The attachment structure can include an upper region interfacing with the sidewall and defining discrete through-holes, a lower region below the upper region where the inner surface defines a plurality of recesses positioned around the lower region, and a mesh extending across the channel and into the upper region.

公开(公告)号：US20230239605A1

公开(公告)日：2023-07-27

申请号：US18127301

申请日：2023-03-28

Applicant: APPLE INC.

Inventor： Ethan L. Huwe ,  Brad G. Boozer ,  Erik L. Wang ,  Phillip Qian

IPC: H04R1/10

CPC classification number: H04R1/1016 ,  H04R1/1058

Abstract: Headphone eartips with internal support components and methods for making the same are provided. Different support components may provide specific amounts and types of additional rigidity at specific portions of an exterior surface of an outer eartip body that may be expected to interface with specific portions of an ear canal geometry when an eartip subassembly is positioned within the ear canal, such that the eartip subassembly may conform to the various shapes of the ear canal while maintaining an acoustic seal.

公开(公告)号：US11540039B2

公开(公告)日：2022-12-27

申请号：US17207497

申请日：2021-03-19

Applicant: Apple Inc.

Inventor： Sean T. McIntosh ,  Jason C. Della Rosa ,  Samuel G. Parker ,  Benjamin A. Cousins ,  Ethan L. Huwe

IPC: H04R1/10 ,  G01V3/08 ,  A45C11/00 ,  A45C13/00 ,  E05F1/12 ,  E05F3/20 ,  H01F7/02 ,  H05K5/00 ,  H05K5/02 ,  H05K5/03 ,  H04R1/02 ,  H04B1/38 ,  H04B1/3827

Abstract: Embodiments describe an eartip including an eartip body having an attachment end and an interfacing end opposite from the attachment end. The eartip body can include an inner eartip body having a sidewall extending between the interfacing end and the attachment end, the sidewall defining a channel and having a first thickness near the attachment end and a second thickness different from the first thickness at the interfacing end. The eartip can also include an attachment structure coupled to the inner eartip body at the attachment end, the attachment structure having an inner surface and an outer surface. The attachment structure can include an upper region interfacing with the sidewall and defining discrete through-holes, a lower region below the upper region where the inner surface defines a plurality of recesses positioned around the lower region, and a mesh extending across the channel and into the upper region.

公开(公告)号：US20220155875A1

公开(公告)日：2022-05-19

申请号：US17649582

申请日：2022-02-01

Applicant: APPLE INC.

Inventor： Craig M. Stanley ,  Simon K. Porter ,  John H. Sheerin ,  Glenn K. Trainer ,  Ethan L. Huwe ,  Sean T. McIntosh ,  Jason C. Della Rosa ,  Christopher J. Stringer ,  Molly J. Anderson ,  Erik L. Wang

IPC: G06F3/02 ,  G06F3/01 ,  H04R1/02 ,  H04R1/26 ,  H04R1/30 ,  H04R5/02 ,  H04R31/00 ,  H03K17/96 ,  H05K1/02 ,  G06F3/041 ,  G06F3/0354 ,  H04R3/00 ,  H04R7/12 ,  H04R7/18 ,  H04R9/02 ,  H04R9/06 ,  H04R1/40 ,  H04R3/12 ,  H04R1/28 ,  G06F3/16 ,  F21V3/00 ,  F21V5/00 ,  F21V23/04 ,  F21V33/00 ,  H01H13/02

Abstract: A voice-controlled electronic device that includes an axisymmetric device housing having a longitudinal axis bisecting opposing top and bottom surfaces and a side surface extending between the top and bottom surfaces. The device can further include a plurality of microphones disposed within the device housing and distributed radially around the longitudinal axis; a processor configured to execute computer instructions stored in a computer-readable memory for interacting with a user and processing voice commands received by the plurality of microphones and first and second transducers configured to generate sound waves within different frequency ranges.