METHOD FOR MANUFACTURING THIN FILM TRANSISTOR, AND THIN FILM TRANSISTOR

    公开(公告)号:US20230317826A1

    公开(公告)日:2023-10-05

    申请号:US18022620

    申请日:2022-03-09

    CPC classification number: H01L29/66742 H01L29/401 H01L29/7869

    Abstract: A method for manufacturing a thin film transistor, and a thin film transistor are provided. The method includes: forming an active layer on a substrate by a single patterning process; forming a gate insulating layer by deposition on a side of the active layer away from the substrate; forming a first via hole and a second via hole penetrating through the gate insulating layer by a single patterning process, the first and second via holes being located at two ends of the active layer respectively; and forming a first electrode, a gate electrode, and a second electrode on the gate insulating layer by a single patterning process, the first and second electrodes being connected to the active layer through the first and second via holes, respectively, and an orthographic projection of the gate electrode on the substrate at least partially overlapping that of the active layer on the substrate.

    THIN FILM TRANSISTOR AND MANUFACTURING METHOD THEREOF, DISPLAY SUBSTRATE, AND DISPLAY DEVICE

    公开(公告)号:US20220223745A1

    公开(公告)日:2022-07-14

    申请号:US17761549

    申请日:2021-05-18

    Abstract: A thin film transistor, a manufacturing method thereof, a display substrate, and a display device are provided. The thin film transistor includes: a substrate, an active layer, a gate, a source and a drain. The active layer is arranged on the substrate and formed as a grid, including silicon nanowires extending along a first direction, the active layer includes source and drain regions oppositely arranged along the first direction, and a channel region located therebetween. The gate is arranged on the substrate, and an orthographic projection of the gate onto the substrate overlaps with orthographic projections for silicon nanowires in the channel region onto the substrate. The source and drain are arranged on the substrate, the source contacts silicon nanowires in the source region, and the drain contacts silicon nanowires in the drain region.

    ARRAY SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME AND DISPLAY DEVICE

    公开(公告)号:US20210225893A1

    公开(公告)日:2021-07-22

    申请号:US16765216

    申请日:2019-12-06

    Abstract: A method of manufacturing an array substrate includes: forming a first semiconductor pattern and a first insulating layer group sequentially on a base substrate; forming a second semiconductor pattern and a second insulating layer group sequentially on the first insulating layer group; forming two first via holes in the first insulating layer group and the second insulating layer group to expose the first semiconductor pattern, annealing the exposed first semiconductor pattern and then removing an oxide layer on a surface of the first semiconductor pattern; forming connecting wires in the first via holes; forming second via holes in the second insulating layer group to expose the second semiconductor pattern, and forming a first source electrode and a first drain electrode in the second via holes such that the first source electrode or the first drain electrode covers and is connected to one of the connecting wires.

    DISPLAY PANEL AND METHOD FOR FABRICATING THE SAME

    公开(公告)号:US20200066758A1

    公开(公告)日:2020-02-27

    申请号:US16531231

    申请日:2019-08-05

    Abstract: A display panel and a method for fabricating the same are provided. The display panel includes: a base substrate; a first thin film transistor on one side of the base substrate, the first thin film transistor comprising: a first active layer, a first protection layer, a second protection layer, a first source and a first drain; wherein the first protection layer and the second protection layer are on one side of the first active layer away from the base substrate, and are separated from each other; the first protection layer and the second protection layer are configured to protect the first active layer from being etched during forming of a via-hole corresponding to the first source and/or a via-hole corresponding to the first drain,

    LIGHT-EMITTING SUBSTRATE AND DISPLAY DEVICE

    公开(公告)号:US20240379631A1

    公开(公告)日:2024-11-14

    申请号:US18691021

    申请日:2021-10-22

    Abstract: A light-emitting substrate and a display device are disclosed, the light-emitting substrate includes: a base substrate including a light-emitting region; a plurality of first pads on a side of the base substrate and in the light-emitting region, where a material of the first pads includes Cu; and an oxidation protection layer on a side of the first pads away from the base substrate, where the plurality of first pads is used for bonding connection with a plurality of light-emitting units through the oxidation protection layer, a material of the oxidation protection layer includes CuNiX, and X includes one or any combination of Al, Sn, Pb, Au, Ag, In, Zn, Bi, Mg, Ga, V, W, Y, Zr, Mo, Nb, Pt, Co or Sb.

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