Bulk annealing of glass sheets
    61.
    发明授权
    Bulk annealing of glass sheets 有权
    玻璃板的散装退火

    公开(公告)号:US09340443B2

    公开(公告)日:2016-05-17

    申请号:US14047251

    申请日:2013-10-07

    Abstract: Surface modification layers and associated heat treatments, that may be provided on a sheet, a carrier, or both, to control both room-temperature van der Waals (and/or hydrogen) bonding and high temperature covalent bonding between the thin sheet and carrier. The room-temperature bonding is controlled so as to be sufficient to hold the thin sheet and carrier together during vacuum processing, wet processing, and/or ultrasonic cleaning processing, for example. And at the same time, the high temperature covalent bonding is controlled so as to prevent a permanent bond between the thin sheet and carrier during high temperature processing, as well as maintain a sufficient bond to prevent delamination during high temperature processing.

    Abstract translation: 可以在片材,载体或两者上提供表面改性层和相关的热处理,以控制薄板和载体之间的室温范德华(和/或氢)键合和高温共价键合。 例如,在真空处理,湿法处理和/或超声波清洗处理中,室温粘合被控制为足以将薄片和载体保持在一起。 同时控制高温共价键,以防止在高温加工过程中薄片和载体之间的永久性结合,并且保持足够的粘结以防止在高温加工过程中的分层。

    GLASS STRUCTURES AND METHODS OF CREATING AND PROCESSING GLASS STRUCTURES
    67.
    发明申请
    GLASS STRUCTURES AND METHODS OF CREATING AND PROCESSING GLASS STRUCTURES 审中-公开
    玻璃结构和玻璃结构的加工和加工方法

    公开(公告)号:US20140342148A1

    公开(公告)日:2014-11-20

    申请号:US13894999

    申请日:2013-05-15

    Abstract: A glass structure and a method for creating the glass structure include a glass carrier layer and a flexible glass substrate. The glass structure includes an intermediate layer at least temporarily bonding the flexible glass substrate to the glass carrier layer. The intermediate layer includes a first debond layer attached to an adhesion layer. The first debond layer is at least partially resistant to a high temperature processing of the glass structure at a temperature of greater than or equal to about 500° C. The first debond layer is configured to enable the flexible glass substrate to be debonded from the glass carrier layer after the high temperature processing of the glass structure. A method for processing the glass structure includes debonding the flexible glass substrate from the glass carrier layer after the high temperature process.

    Abstract translation: 玻璃结构和用于制造玻璃结构的方法包括玻璃载体层和柔性玻璃基底。 玻璃结构包括至少将柔性玻璃基板临时粘合到玻璃载体层的中间层。 中间层包括附着在粘合层上的第一脱粘层。 第一脱粘层在大于或等于约500℃的温度下至少部分地抵抗玻璃结构的高温处理。第一剥离层被配置为使得柔性玻璃基板能够从玻璃脱粘 载体层经高温处理后的玻璃结构。 处理玻璃结构的方法包括在高温处理之后从玻璃载体层剥离柔性玻璃基板。

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