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公开(公告)号：US07988399B2
公开(公告)日：2011-08-02
申请号：US12260818
申请日：2008-10-29
申请人： Peter van der Meulen
发明人： Peter van der Meulen
IPC分类号： B65G49/07
CPC分类号： H01L21/67161 , H01L21/67184 , H01L21/6719 , H01L21/67196 , H01L21/67201 , H01L21/67207 , H01L21/67742 , H01L21/67745 , Y10S414/139
摘要： In a system having a number of semiconductor processing modules sharing a common vacuum environment, a mid-entry load lock is provided to permit insertion and removal of wafers into the vacuum environment at a point between various other robotic handlers, process modules, and load locks. This arrangement permits increased flexibility in scheduling when multiple wafers are processed concurrently.
摘要翻译： 在具有共享共同的真空环境的多个半导体处理模块的系统中，提供中间入口加载锁以允许在各种其他机器人处理器，处理模块和装载锁之间的点处将晶片插入和移除到真空环境中 。 当多个晶片被同时处理时，这种布置允许调度的灵活性增加。
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公开(公告)号：US07959403B2
公开(公告)日：2011-06-14
申请号：US11846290
申请日：2007-08-28
申请人： Peter van der Meulen
发明人： Peter van der Meulen
IPC分类号： H01L21/677
CPC分类号： H01L21/67167 , B25J9/042 , H01L21/67126 , H01L21/67161 , H01L21/67173 , H01L21/67178 , H01L21/67184 , H01L21/6719 , H01L21/67196 , H01L21/67201 , H01L21/67207 , H01L21/67253 , H01L21/67259 , H01L21/67706 , H01L21/67727 , H01L21/67733 , H01L21/67736 , H01L21/67742 , H01L21/67745 , H01L21/67748 , H01L21/67754 , H01L21/67757 , H01L21/67781 , H01L21/68 , H01L21/68707 , H01L21/68735 , Y10S414/135 , Y10S414/137 , Y10S414/139 , Y10T74/20305
摘要： Methods and systems are provided for handling materials, including materials used in semiconductor manufacturing systems. The methods and systems include linear semiconductor processing facilities for vacuum-based semiconductor processing and handling, as well as linkable or extensible semiconductor processing facilities that can be flexibly configured to meet a variety of constraints.
摘要翻译： 提供了用于处理材料的方法和系统，包括在半导体制造系统中使用的材料。 该方法和系统包括用于基于真空的半导体处理和处理的线性半导体处理设备，以及可以灵活地配置以满足各种限制的可连接或可扩展的半导体处理设备。
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63.发明授权公开(公告)号：US07769482B2
公开(公告)日：2010-08-03
申请号：US11877228
申请日：2007-10-23
CPC分类号： G05B99/00 , G05B15/02 , G05B19/41865 , G05B19/41885 , G05B23/0267 , G05B2219/30 , G05B2219/31 , G05B2219/31467 , G05B2219/31472 , G05B2219/32128 , G05B2219/32267 , G05B2219/32329 , G05B2219/32335 , G05B2219/32342 , G05B2219/32351 , G05B2219/35494 , G05B2219/40411 , G05B2219/40412 , G05B2219/40413 , G05B2219/40419 , G05B2219/40424 , G05B2219/45031 , G06T7/0004 , H01L21/67161 , H01L21/67184 , H01L21/6719 , H01L21/67196 , H01L21/67201 , H01L21/67207 , H01L21/67742 , H01L21/67745 , Y02P90/18 , Y02P90/20 , Y02P90/26 , Y02P90/86
摘要： Software for controlling processes in a heterogeneous semiconductor manufacturing environment may include a wafer-centric database, a real-time scheduler using a neural network, and a graphical user interface displaying simulated operation of the system. These features may be employed alone or in combination to offer improved usability and computational efficiency for real time control and monitoring of a semiconductor manufacturing process. More generally, these techniques may be usefully employed in a variety of real time control systems, particularly systems requiring complex scheduling decisions or heterogeneous systems constructed of hardware from numerous independent vendors.
摘要翻译： 用于控制异构半导体制造环境中的处理的软件可以包括以晶圆为中心的数据库，使用神经网络的实时调度器和显示系统的模拟操作的图形用户界面。 这些特征可以单独使用或组合使用以提供用于半导体制造过程的实时控制和监视的改进的可用性和计算效率。 更一般来说，这些技术可以有用地用于各种实时控制系统中，特别是需要复杂调度决策的系统或由许多独立供应商的硬件构成的异构系统。
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公开(公告)号：US20080167890A1
公开(公告)日：2008-07-10
申请号：US11877279
申请日：2007-10-23
IPC分类号： G06Q10/00
CPC分类号： G05B99/00 , G05B15/02 , G05B19/41865 , G05B19/41885 , G05B23/0267 , G05B2219/30 , G05B2219/31 , G05B2219/31467 , G05B2219/31472 , G05B2219/32128 , G05B2219/32267 , G05B2219/32329 , G05B2219/32335 , G05B2219/32342 , G05B2219/32351 , G05B2219/35494 , G05B2219/40411 , G05B2219/40412 , G05B2219/40413 , G05B2219/40419 , G05B2219/40424 , G05B2219/45031 , G06F15/00 , G06T7/0004 , H01L21/67161 , H01L21/67184 , H01L21/6719 , H01L21/67196 , H01L21/67201 , H01L21/67207 , H01L21/67742 , H01L21/67745 , Y02P90/18 , Y02P90/20 , Y02P90/26 , Y02P90/86
摘要： Software for controlling processes in a heterogeneous semiconductor manufacturing environment may include a wafer-centric database, a real-time scheduler using a neural network, and a graphical user interface displaying simulated operation of the system. These features may be employed alone or in combination to offer improved usability and computational efficiency for real time control and monitoring of a semiconductor manufacturing process. More generally, these techniques may be usefully employed in a variety of real time control systems, particularly systems requiring complex scheduling decisions or heterogeneous systems constructed of hardware from numerous independent vendors.
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公开(公告)号：US20080134075A1
公开(公告)日：2008-06-05
申请号：US11877153
申请日：2007-10-23
IPC分类号： G06F3/048
CPC分类号： G05B99/00 , G05B15/02 , G05B19/41865 , G05B19/41885 , G05B23/0267 , G05B2219/30 , G05B2219/31 , G05B2219/31467 , G05B2219/31472 , G05B2219/32128 , G05B2219/32267 , G05B2219/32329 , G05B2219/32335 , G05B2219/32342 , G05B2219/32351 , G05B2219/35494 , G05B2219/40411 , G05B2219/40412 , G05B2219/40413 , G05B2219/40419 , G05B2219/40424 , G05B2219/45031 , G06F15/00 , G06T7/0004 , H01L21/67161 , H01L21/67184 , H01L21/6719 , H01L21/67196 , H01L21/67201 , H01L21/67207 , H01L21/67742 , H01L21/67745 , Y02P90/18 , Y02P90/20 , Y02P90/26 , Y02P90/86
摘要： Software for controlling processes in a heterogeneous semiconductor manufacturing environment may include a wafer-centric database, a real-time scheduler using a neural network, and a graphical user interface displaying simulated operation of the system. These features may be employed alone or in combination to offer improved usability and computational efficiency for real time control and monitoring of a semiconductor manufacturing process. More generally, these techniques may be usefully employed in a variety of real time control systems, particularly systems requiring complex scheduling decisions or heterogeneous systems constructed of hardware from numerous independent vendors.
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公开(公告)号：US20070285673A1
公开(公告)日：2007-12-13
申请号：US11682306
申请日：2007-03-05
IPC分类号： G01B11/14
CPC分类号： H01L21/67265 , B65G25/02 , B65G37/00 , H01L21/67161 , H01L21/67196 , H01L21/67742 , H01L21/67745 , H01L21/67748 , H01L21/68792 , Y10S414/129 , Y10S414/136
摘要： A number of wafer center finding methods and systems are disclosed herein that improve upon existing techniques used in semiconductor manufacturing.
摘要翻译： 本文公开了一些改进在半导体制造中使用的现有技术的晶片中心发现方法和系统。
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公开(公告)号：US20070264106A1
公开(公告)日：2007-11-15
申请号：US11681809
申请日：2007-03-05
申请人： Peter van der Meulen
发明人： Peter van der Meulen
IPC分类号： H01L21/677 , B25J9/06 , G06F19/00
CPC分类号： B25J9/042 , B25J9/0084 , B25J9/107 , H01L21/67161 , H01L21/6719 , H01L21/67196 , H01L21/67742 , H01L21/68707
摘要： In embodiments of the present invention improved capabilities are described for robots and robotic arms operating within a semiconductor manufacturing environment.
摘要翻译： 在本发明的实施例中，描述了在半导体制造环境中操作的机器人和机器人臂的改进的能力。
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公开(公告)号：US20050113964A1
公开(公告)日：2005-05-26
申请号：US10985844
申请日：2004-11-10
申请人： Peter van der Meulen
发明人： Peter van der Meulen
IPC分类号： B25J17/00 , B65G1/00 , B66C1/00 , F26B5/04 , F26B13/30 , G06F7/00 , G06F19/00 , H01L20060101 , H01L21/00 , H01L21/677
CPC分类号： H01L21/67167 , B25J9/042 , H01L21/67126 , H01L21/67161 , H01L21/67173 , H01L21/67178 , H01L21/67184 , H01L21/6719 , H01L21/67196 , H01L21/67201 , H01L21/67207 , H01L21/67253 , H01L21/67259 , H01L21/67706 , H01L21/67727 , H01L21/67733 , H01L21/67736 , H01L21/67742 , H01L21/67745 , H01L21/67748 , H01L21/67754 , H01L21/67757 , H01L21/67781 , H01L21/68 , H01L21/68707 , H01L21/68735 , Y10S414/135 , Y10S414/137 , Y10S414/139 , Y10T74/20305
摘要： Methods and systems are provided for handling materials in a semiconductor handling system. The methods include a sensor for detecting the position of a workpiece or a robotic component. The sensor may include a sensor for detecting both vertical and horizontal position of the robotic component. The sensor may be positioned outside the turn radius of the robotic component.
摘要翻译： 提供了用于在半导体处理系统中处理材料的方法和系统。 这些方法包括用于检测工件或机器人部件的位置的传感器。 传感器可以包括用于检测机器人部件的垂直和水平位置的传感器。 传感器可以位于机器人部件的转弯半径之外。
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公开(公告)号：US5359289A
公开(公告)日：1994-10-25
申请号：US981739
申请日：1992-11-25
申请人： Peter van der Meulen
发明人： Peter van der Meulen
IPC分类号： A61B5/055 , G01R33/24 , G01R33/387 , G01R33/3875 , G01R33/565 , G01R33/40
CPC分类号： G01R33/24 , G01R33/3875 , G01R33/56563
摘要： In known magnetic resonance devices shimming is applied on the basis of maps of field inhomogeneities obtained from two images of a slice of an object by formation of a ratio image thereof. This ratio image is processed in order to obtain shimming information. These known methods are time-consuming and cumbersome. The invention proposes a fast and simple shimming method which utilizes only one measuring sequence or a few measuring sequences. The shimming gradient (-dG) is determined from a time shift between an anticipated temporal position (t1) and a measured temporal position (t1') of a maximum of an echo resonance signal (ec) produced by the measuring sequence.
摘要翻译： 在已知的磁共振装置中，基于通过形成其比例图像从对象的切片的两个图像获得的场不均匀性的图来应用匀场。 处理该比率图像以获得匀场信息。 这些已知的方法是耗时且麻烦的。 本发明提出了一种快速简单的匀场方法，其仅使用一个测量序列或几个测量序列。 根据由测量序列产生的回波共振信号（ec）的最大值的预测时间位置（t1）和测量的时间位置（t1'）之间的时间偏移来确定匀场梯度（-dG）。
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公开(公告)号：US10586722B2
公开(公告)日：2020-03-10
申请号：US12131024
申请日：2008-05-30
申请人： Peter van der Meulen
发明人： Peter van der Meulen
IPC分类号： H01L21/677 , H01L21/673 , H01L21/67
摘要： A two piece shell is employed for intermediate and long term storage of substrates. The shell is formed of two halves that can be juxtaposed in vacuum and externally vented, with the internal vacuum retaining the halves in vacuum-sealed engagement. One of the halves also provides a vacuum-sealing perimeter for selectively sealing to a process chamber during loading and/or unloading of the shell with a substrate. A vacuum monitor or the like may be employed to monitor pressure during storage and provide alerts if the vacuum within the sealed shell is compromised.
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