摘要:
A sheet feeding apparatus includes a sheet feeding roller that comes in contact with stacked sheets and feeds sheets one by one from the top, wherein an air outlet is provided so that air can be blown onto the upper part of the stacked sheets from the lateral side in the sheet feeding direction, and a floatation suppression member for suppressing floatation of the sheets is provided between the air outlet and the sheet feeding roller and spaced apart from the uppermost surface of the stacked sheets.
摘要:
An inventive semiconductor integrated circuit device includes multiple transistor banks over a substrate. The banks are arranged to be substantially parallel to each other in a planar layout of the device. Each said bank includes a plurality of unit transistors, each including a base, an emitter and a collector. In the planar layout of the device, a position of a first one of the transistors is shifted from a position of a second one of the transistors in a direction in which the banks extend. The first and second transistors belong to first and second ones of the banks, respectively, which are adjacent to each other. The second transistor is closer to the first transistor than any other transistor in the second bank.
摘要:
A via hole having a bottom is formed in a substrate and then a conductor layer is formed at least over a sidewall of the via hole. Thereafter, the substrate is thinned by removing a portion of the substrate opposite to another portion of the substrate in which the via hole is formed such that the conductor layer is exposed.
摘要:
A nitride semiconductor device includes a semiconductor substrate, and a nitride semiconductor layer formed on the semiconductor substrate. The semiconductor substrate includes a normal region and an interface current block region surrounding the normal region. The nitride semiconductor layer includes an element region and an isolation region surrounding the element region. The element region is formed over the normal region. The interface current block region contains impurities, and forms a potential barrier against carriers generated at an interface between the nitride semiconductor layer and the semiconductor substrate.
摘要:
A bidirectional switching device includes a semiconductor multilayer structure made of a nitride semiconductor, a first ohmic electrode and a second ohmic electrode which are formed on the semiconductor multilayer structure, and a first gate electrode and a second gate electrode. The first gate electrode is covered with a first shield electrode having a potential substantially equal to that of the first ohmic electrode. The second gate electrode is covered with the second shield electrode having a potential substantially equal to that of the second ohmic electrode. An end of the first shield electrode is positioned between the first gate electrode and the second gate electrode, and an end of the second shield electrode is positioned between the second gate electrode and the first gate electrode.
摘要:
A sheet feeding apparatus which includes: a sheet loading tray for stacking sheets; a suction and conveyance section placed above stacked sheets on the sheet loading tray and sucks and conveys a sheet in the sheet conveying direction; an air blowing section which blows air at the stacked sheets on the sheet loading tray and causes the sheet to float up; a skew correction section which is provided with a pair of conveyance rollers, and corrects a skew of the sheet being conveyed by the suction and conveyance section; and a control section which controls a force of sucking the sheet, wherein the control section changes the force of sucking the sheet from a first level to a second level that is lower than the first level, before a leading edge of the sheet butts against a pair of conveyance rollers of the skew correction section.
摘要:
A nitride semiconductor device includes: a first nitride semiconductor layer; a second nitride semiconductor layer formed on the first nitride semiconductor layer and having a wider band gap than the first nitride semiconductor layer; and a third nitride semiconductor layer formed on the second nitride semiconductor layer. A region of the third nitride semiconductor layer located below the gate electrode is formed with a control region having a p-type conductivity, and a region of the third nitride semiconductor layer located between the gate electrode and each of the source electrode and the drain electrode is formed with a high resistive region having a higher resistance than the that of the control region.
摘要:
An object of the present invention is to provide a method for desalinating saltwater with a desalination device.The desalination device comprises inside a vessel, a breathable sheet, a water-repellent particle layer and a tank layer. The tank layer is positioned at the lower portion inside the vessel and the breathable sheet is interposed between the water-repellent particle layer and the tank layer. The breathable sheet comprises a through-hole, the water-repellent particle layer is composed of a plurality of water-repellent particles, and the surface of the respective water-repellent particles comprises a water-repellent film.The saltwater is desalted by a step of pouring saltwater into the vessel to dispose the saltwater on the surface of the water-repellent particle layer, a step of heating the saltwater to evaporate the saltwater into vapor; and a step of liquefying the vapor to obtain fresh water in the tank layer.
摘要:
Disclosed is an optical recording method. The optical recording method includes irradiating an area where a recording mark is formed in a medium with a pulse train of laser light, and irradiating the area where the recording mark is formed with continuous-wave laser light that is continuously output.
摘要:
To provide a semiconductor equipment having high heat-transfer effect and breakdown voltage, and a method of manufacturing the same. The semiconductor equipment includes: a sealed container; a stem connected to the sealed container via a stem peripheral portion; and a semiconductor chip mounted on a top surface of the stem, inside the sealed container. The semiconductor chip is electrically connected to a lead provided to the stem, the stem peripheral portion, which is of a material that is different from the material of stem and the same as the material of the sealed container, is bonded along a periphery of the stem, and the sealed container is filled with a working fluid including at least one of ethanol, a perfluorocarbon, and a fluoroether.