METALLIZATION LINES ON INTEGRATED CIRCUIT PRODUCTS

    公开(公告)号:US20190006232A1

    公开(公告)日:2019-01-03

    申请号:US16103372

    申请日:2018-08-14

    Abstract: An integrated circuit product includes a first layer of insulating material including a first insulating material. The first layer of insulating material is positioned above a device layer of a semiconductor substrate. The device layer includes transistors. A metallization blocking structure is positioned in an opening in the first layer of insulating material. The metallization blocking structure includes a second insulating material that is different from the first insulating material. A metallization trench is defined in the first layer of insulating material on opposite sides of the metallization blocking structure. A conductive metallization line includes first and second portions positioned in the metallization trench on opposite sides of the metallization blocking structure. The conductive metallization line has a long axis extending along the first and second portions.

    Methods of forming a vertical transistor device

    公开(公告)号:US10170616B2

    公开(公告)日:2019-01-01

    申请号:US15268796

    申请日:2016-09-19

    Abstract: One illustrative method disclosed herein includes, among other things, defining a cavity in a plurality of layers of material positioned above a bottom source/drain (S/D) layer of semiconductor material, wherein a portion of the bottom source/drain (S/D) layer of semiconductor material is exposed at the bottom of the cavity, and performing at least one epi deposition process to form a vertically oriented channel semiconductor structure on the bottom source/drain (S/D) layer of semiconductor material and in the cavity and a top source/drain (S/D) layer of semiconductor material above the vertically oriented channel semiconductor structure. In this example, the method further includes removing at least one of the plurality of layers of material to thereby expose an outer perimeter surface of the vertically oriented channel semiconductor structure and forming a gate structure around the vertically oriented channel semiconductor structure.

    Self-aligned finFET formation
    67.
    发明授权

    公开(公告)号:US10170591B2

    公开(公告)日:2019-01-01

    申请号:US15178871

    申请日:2016-06-10

    Abstract: A method for fabricating a semiconductor device comprises forming a first hardmask, a planarizing layer, and a second hardmask on a substrate. Removing portions of the second hardmask and forming alternating blocks of a first material and a second material over the second hardmask. The blocks of the second material are removed to expose portions of the planarizing layer. Exposed portions of the planarizing layer and the first hardmask are removed to expose portions of the first hardmask. Portions of the first hardmask and portions of the substrate are removed to form a first fin and a second fin. Portions of the substrate are removed to further increase the height of the first fin and substantially remove the second fin. A gate stack is formed over a channel region of the first fin.

    Semiconductor devices having equal thickness gate spacers

    公开(公告)号:US10170585B2

    公开(公告)日:2019-01-01

    申请号:US15437840

    申请日:2017-02-21

    Abstract: A method is presented for forming equal thickness gate spacers for a CMOS (complementary metal oxide semiconductor) device, the method includes forming a PFET (p-type field effect transistor) device and an NFET (n-type field effect transistor) device each including gate masks formed over dummy gates, forming PFET epi growth regions between the dummy gates of the PFET device, forming NFET epi growth regions between the dummy gates of the NFET device, depositing a nitride liner and an oxide over the PFET and NFET epi growth regions, the nitride liner and oxide extending up to the gate masks, and removing the dummy gates and the gate masks to form HKMGs (high-k metal gates) between the PFET and NFET epi growth regions.

    Semiconductor contact
    69.
    发明授权

    公开(公告)号:US10157827B2

    公开(公告)日:2018-12-18

    申请号:US15196371

    申请日:2016-06-29

    Abstract: A method for forming a semiconductor device comprises forming a gate stack on a channel region of a semiconductor, forming a source/drain region adjacent to the channel region, depositing a first insulator layer over the source/drain region, and removing a portion of the first insulator layer to form a first cavity that exposes a portion of the source/drain region. A first conductive material is deposited in the first cavity, and a conductive extension is formed from the first conductive material over the first insulator layer. A protective layer is deposited over the extension and a second insulator layer is deposited over the protective layer. A portion of the second insulator layer is removed to form a second cavity that exposes the protective layer, and an exposed portion of the protective layer is removed to expose a portion of the extension. A second conductive material is deposited in the second cavity.

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