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433 条记录 (耗时 0.045 秒)

    Arrangement for solder bump formation on wafers
    61.
    发明授权
    Arrangement for solder bump formation on wafers 失效
    在晶圆上形成焊锡凸点的布置

    公开(公告)号：US07632750B2

    公开(公告)日：2009-12-15

    申请号：US11482838

    申请日：2006-07-07

    申请人： Chunghsin Lee ,  Jian Zhang

    发明人： Chunghsin Lee ,  Jian Zhang

    IPC分类号： H01L21/44

    CPC分类号： H01L24/11 ,  B23K3/0623 ,  B23K2101/40 ,  H01L24/742 ,  H01L2224/1131 ,  H01L2224/11334 ,  H01L2224/13099 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15788 ,  H01L2924/00 ,  H01L2224/0401

    摘要： An apparatus and a process for the manufacture of a solder-bump adhered wafer substrate for use in the semiconductor industry, comprising one or more of the following steps including: arranging a first compressive member and a second compressive member in an opposed, compressibly displaceable, spaced-apart relationship, with a pattern plate disposed therebetween with the pattern plate having a plurality of aligned through-holes arranged thereon; filling the through-holes with a molten solder; compressing the solder and the pattern plate between the first and second opposed compressive members to compact the solder therein and cleans the pattern plate of excess solder; chilling the pattern plate to solidify the molten solder in the through-holes; and removing the pattern plate from the spaced-apart compressive members to produce a wafer with solder bumps thereon.

    摘要翻译： 一种用于制造用于半导体工业中的焊料凸起附着晶片衬底的装置和方法，包括一个或多个以下步骤，包括：将第一压缩构件和第二压缩构件布置成相对的可压缩位移的， 间隔开的关系，其间设置有图案板，其中所述图案板具有布置在其上的多个对准的通孔; 用熔融焊料填充通孔; 压缩第一和第二相对的压缩构件之间的焊料和图案板以压缩其中的焊料并清洁多余焊料的图案板; 冷却图案板以使通孔中的熔融焊料固化; 并且从间隔开的压缩构件移除图案板以产生其上具有焊料凸块的晶片。

    METAL-CATALYZED COPOLYMERIZATION OF IMINES AND CARBON MONOXIDE AS A ROUTE TO SYNTHESIZE POLYPEPTIDES
    62.
    发明申请
    METAL-CATALYZED COPOLYMERIZATION OF IMINES AND CARBON MONOXIDE AS A ROUTE TO SYNTHESIZE POLYPEPTIDES 有权
    金属和二氧化碳的金属催化共聚合作为合成聚氨酯的途径

    公开(公告)号：US20090264619A1

    公开(公告)日：2009-10-22

    申请号：US12480675

    申请日：2009-06-08

    申请人： Huailin SUN ,  Jian Zhang ,  Qiuhua Liu ,  Lei Yu ,  Jiangyu Zhao

    发明人： Huailin SUN ,  Jian Zhang ,  Qiuhua Liu ,  Lei Yu ,  Jiangyu Zhao

    IPC分类号： C07K1/00 ,  C07K2/00

    CPC分类号： C07K1/088 ,  C07K1/02

    摘要： Polypeptides of formula (I): wherein R1 and R2 are substituents independently selected from substituted and un-substituted alkyl groups and substituted and un-substituted aryl groups, and n is an integer greater than or equal to 2. Synthesis methods are also provided that do not use amino acids as starting materials, but instead employ imines and carbon monoxide as monomers that undergo transition metal-catalyzed alternating copolymerization to directly provide polypeptides using an acylcobalt catalyst with the following structural formula: wherein R is selected from the group consisting of alkyl, phenyl, and substituted phenyl groups.

    摘要翻译： 式（I）的多肽：其中R 1和R 2是独立地选自取代和未取代的烷基和取代和未取代的芳基的取代基，n是大于或等于2的整数。还提供了合成方法 不要使用氨基酸作为原料，而是使用亚胺和一氧化碳作为进行过渡金属催化的交替共聚的单体，以使用具有下列结构式的酰基钴催化剂直接提供多肽：其中R选自烷基 ，苯基和取代的苯基。

    Computer switcher and method for matching with a plurality of servers
    63.
    发明申请
    Computer switcher and method for matching with a plurality of servers 审中-公开
    用于与多个服务器匹配的计算机切换器和方法

    公开(公告)号：US20090144479A1

    公开(公告)日：2009-06-04

    申请号：US12315378

    申请日：2008-12-02

    申请人： Jishun Cui ,  Jian Zhang

    发明人： Jishun Cui ,  Jian Zhang

    IPC分类号： G06F13/00 ,  G06F15/173

    CPC分类号： G06F3/023

    摘要： The present invention provides a switcher for managing a plurality of servers and controlling at least one peripheral device, comprising: a transceiver module for transmitting a query instruction to one of the plurality of servers and receiving identification information of the server; and a matching module for receiving the identification information and matching a connection port between the switcher and the server with the server based on the identification information. With the present invention, automatic matching between a KVM switcher and servers can be achieved thus avoiding errors and delay which may occur during manual operations. Further, automatic matching can be performed after the connections between the servers and the KVM have been changed, without the need for excessive manual intervention.

    摘要翻译： 本发明提供了一种用于管理多个服务器并控制至少一个外围设备的切换器，包括：收发器模块，用于向多个服务器之一发送查询指令并接收服务器的识别信息; 以及匹配模块，用于接收所述识别信息，并且基于所述识别信息与所述服务器匹配所述切换器与所述服务器之间的连接端口。 利用本发明，可以实现KVM切换器与服务器之间的自动匹配，从而避免在手动操作期间可能发生的错误和延迟。 此外，可以在服务器和KVM之间的连接被改变之后执行自动匹配，而不需要过多的手动干预。

    Compositions and methods for tantalum CMP
    66.
    发明授权
    Compositions and methods for tantalum CMP 有权
    钽CMP的组成和方法

    公开(公告)号：US07316603B2

    公开(公告)日：2008-01-08

    申请号：US11235765

    申请日：2005-09-26

    申请人： Phillip W. Carter ,  Jian Zhang ,  Steven K. Grumbine ,  Francesco De Rege Thesauro

    发明人： Phillip W. Carter ,  Jian Zhang ,  Steven K. Grumbine ,  Francesco De Rege Thesauro

    IPC分类号： C09K3/14 ,  C09K13/06 ,  B24B1/00

    CPC分类号： H01L21/3212 ,  B24B37/044 ,  C09G1/02 ,  C09K3/1463 ,  C23F3/04 ,  C23F3/06

    摘要： A composition suitable for tantalum chemical-mechanical polishing (CMP) comprises an abrasive, an organic oxidizer, and a liquid carrier therefor. The organic oxidizer has a standard redox potential (E0) of not more than about 0.5 V relative to a standard hydrogen electrode. The oxidized form comprises at least one pi-conjugated ring, which includes at least one heteroatom directly attached to the ring. The heteroatom can be a N, O, S or a combination thereof. In a method embodiment, a CMP composition comprising an abrasive, and organic oxidizer having an E0 of not more than about 0.7 V relative to a standard hydrogen electrode, and a liquid carrier therefor, is utilized to polish a tantalum-containing surface of a substrate, by abrading the surface of the substrate with the composition, preferably with the aid of a polishing pad.

    摘要翻译： 适用于钽化学机械抛光（CMP）的组合物包括研磨剂，有机氧化剂和用于其的液体载体。 有机氧化剂相对于标准氢电极具有不超过约0.5V的标准氧化还原电位（E 0 SUP 0）。 氧化形式包含至少一个π-共轭环，其包括至少一个直接连接在环上的杂原子。 杂原子可以是N，O，S或它们的组合。 在方法实施方案中，使用包含磨料和相对于标准氢电极不超过约0.7V的E 0有机氧化剂的CMP组合物及其液体载体来抛光 通过用组合物研磨基底的表面，优选借助于抛光垫，将基底的含钽表面。

    THERMAL TRANSPORT STRUCTURE AND ASSOCIATED METHOD
    69.
    发明申请
    THERMAL TRANSPORT STRUCTURE AND ASSOCIATED METHOD 有权
    热运输结构及相关方法

    公开(公告)号：US20070231560A1

    公开(公告)日：2007-10-04

    申请号：US11247114

    申请日：2005-10-11

    申请人： Jian Zhang ,  Sandeep Tonapi ,  Ryan Mills ,  Arun Gowda

    发明人： Jian Zhang ,  Sandeep Tonapi ,  Ryan Mills ,  Arun Gowda

    IPC分类号： B32B5/16

    CPC分类号： F28F13/00 ,  F28F2013/005 ,  H01L23/3733 ,  H01L23/42 ,  H01L2924/0002 ,  Y10T428/25 ,  Y10T428/26 ,  Y10T428/269 ,  Y10T428/30 ,  Y10T428/31504 ,  H01L2924/00

    摘要： A thermal transport structure having a thermal transport layer and a resin layer is provided. The thermal transport layer may include a first surface and a second surface, and having a thermally conductive material disposed in the thermal transport layer, where the thermally conductive material is oriented in a predetermined direction in order to facilitate heat conduction relative to the predetermined direction. Further, the resin layer is secured to the thermal transport layer second surface, where the resin layer is relatively less thermally conductive than the thermal transport layer.

    摘要翻译： 提供具有热传输层和树脂层的热传输结构。 热传输层可以包括第一表面和第二表面，并且具有设置在热传输层中的导热材料，其中导热材料沿预定方向取向以便于相对于预定方向的热传导。 此外，树脂层固定到热传输层第二表面，其中树脂层的导热性比热传输层相对较少。