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    THERMAL TRANSPORT STRUCTURE
    1.
    发明申请
    THERMAL TRANSPORT STRUCTURE 审中-公开
    热运输结构

    公开(公告)号：US20080019097A1

    公开(公告)日：2008-01-24

    申请号：US11782049

    申请日：2007-07-24

    申请人： Jian Zhang ,  Sandeep Tonapi ,  Arun Gowda ,  Ryan Mills

    发明人： Jian Zhang ,  Sandeep Tonapi ,  Arun Gowda ,  Ryan Mills

    IPC分类号： H05K7/20

    CPC分类号： F28F13/00 ,  F28F2013/005 ,  H01L23/3677 ,  H01L23/3733 ,  H01L23/42 ,  H01L2924/0002 ,  H01L2924/12044 ,  H01L2924/00

    摘要： A thermally manageable system is provided. The system may include a heat-generating unit, a heat-dissipating unit, and a thermal transport structure located between the heat-dissipating unit and the heat-generating unit. The thermal transport structure has a first surface in thermal communication with the heat-generating unit and a second surface in thermal communication with the heat-dissipating unit. The thermal transport structure includes a thermally conductive material having a length-to-width ratio greater than 1, and the length is oriented to directionally facilitate heat conduction in a direction about perpendicular at least one of the thermal transport structure first surface or second surface. The thermal transport layer comprises a plurality of individual thermally conductive strips or channels that define a discontinuous array within a relatively non-thermally conductive matrix.

    摘要翻译： 提供热管理系统。 该系统可以包括位于散热单元和发热单元之间的发热单元，散热单元和热传输结构。 热传输结构具有与发热单元热连通的第一表面和与散热单元热连通的第二表面。 热传输结构包括长度与宽度比大于1的导热材料，并且长度方向定向地促进沿热交换结构第一表面或第二表面中的至少一个的大致垂直方向的热传导。 热传递层包括在相对非导热的基质内限定不连续阵列的多个独立的导热条或通道。

    THERMAL TRANSPORT STRUCTURE AND ASSOCIATED METHOD
    3.
    发明申请
    THERMAL TRANSPORT STRUCTURE AND ASSOCIATED METHOD 有权
    热运输结构及相关方法

    公开(公告)号：US20070231560A1

    公开(公告)日：2007-10-04

    申请号：US11247114

    申请日：2005-10-11

    申请人： Jian Zhang ,  Sandeep Tonapi ,  Ryan Mills ,  Arun Gowda

    发明人： Jian Zhang ,  Sandeep Tonapi ,  Ryan Mills ,  Arun Gowda

    IPC分类号： B32B5/16

    CPC分类号： F28F13/00 ,  F28F2013/005 ,  H01L23/3733 ,  H01L23/42 ,  H01L2924/0002 ,  Y10T428/25 ,  Y10T428/26 ,  Y10T428/269 ,  Y10T428/30 ,  Y10T428/31504 ,  H01L2924/00

    摘要： A thermal transport structure having a thermal transport layer and a resin layer is provided. The thermal transport layer may include a first surface and a second surface, and having a thermally conductive material disposed in the thermal transport layer, where the thermally conductive material is oriented in a predetermined direction in order to facilitate heat conduction relative to the predetermined direction. Further, the resin layer is secured to the thermal transport layer second surface, where the resin layer is relatively less thermally conductive than the thermal transport layer.

    摘要翻译： 提供具有热传输层和树脂层的热传输结构。 热传输层可以包括第一表面和第二表面，并且具有设置在热传输层中的导热材料，其中导热材料沿预定方向取向以便于相对于预定方向的热传导。 此外，树脂层固定到热传输层第二表面，其中树脂层的导热性比热传输层相对较少。

    Method of forming electronic devices
    5.
    发明申请
    Method of forming electronic devices 审中-公开
    电子器件形成方法

    公开(公告)号：US20060192280A1

    公开(公告)日：2006-08-31

    申请号：US11068376

    申请日：2005-02-28

    申请人： David Esler ,  Donald Buckley ,  Sandeep Tonapi ,  John Campbell ,  Ryan Mills ,  Ananth Prabhakumar ,  Arun Gowda

    发明人： David Esler ,  Donald Buckley ,  Sandeep Tonapi ,  John Campbell ,  Ryan Mills ,  Ananth Prabhakumar ,  Arun Gowda

    IPC分类号： H01L23/48 ,  H01L21/58

    CPC分类号： H05K3/3436 ,  H01L23/49816 ,  H01L2924/0002 ,  H05K2201/0209 ,  H05K2201/10977 ,  Y02P70/613 ,  H01L2924/00

    摘要： A method of forming polymer reinforced solder-bumped containing device or substrate is described. The method comprises the following steps: providing a device or substrate having at least one solder bump formed thereon; coating a predetermined portion of the device or substrate with a curable polymer reinforcement material forming a layer on the device or substrate, partially curing the curable polymer reinforcement material to provide a solder-bumped structure comprising a partially cured polymer reinforcement material, and, making a connection between the solder-bumped structure formed and a printed circuit board or array of attachment pads and fully curing the partially cured polymer reinforcement material to provide a reinforced interconnection. Full curing of the polymer reinforcement material may take place either during the “reflow step” or subsequent to it (post-curing).

    摘要翻译： 描述了形成聚合物增强焊料凸起的装置或基底的方法。 该方法包括以下步骤：提供其上形成有至少一个焊料凸块的器件或衬底; 用形成在所述装置或基底上的层的可固化聚合物增强材料涂覆所述装置或基材的预定部分，部分固化所述可固化聚合物增强材料，以提供包含部分固化的聚合物增强材料的焊料凸起结构， 所形成的焊料凸起结构与印刷电路板或附接焊盘阵列之间的连接，并且完全固化部分固化的聚合物增强材料以提供增强的互连。 聚合物增强材料的完全固化可以在“回流步骤”或之后（后固化）发生。

    Contact material, device including contact material, and method of making
    10.
    发明申请
    Contact material, device including contact material, and method of making 审中-公开
    接触材料，包括接触材料的装置和制造方法

    公开(公告)号：US20060274470A1

    公开(公告)日：2006-12-07

    申请号：US11480812

    申请日：2006-07-05

    申请人： Duraiswamy Srinivasan ,  Reed Corderman ,  Christopher Keimel ,  Somasundaram Gunasekaran ,  Sudhakar Reddy ,  Arun Gowda ,  Kanakasabapathi Subramanian

    发明人： Duraiswamy Srinivasan ,  Reed Corderman ,  Christopher Keimel ,  Somasundaram Gunasekaran ,  Sudhakar Reddy ,  Arun Gowda ,  Kanakasabapathi Subramanian

    IPC分类号： H02H5/04

    CPC分类号： A61B5/1112 ,  A61B5/0006 ,  A61B5/22 ,  A61B5/6807 ,  A61B5/6823 ,  A61B5/6824

    摘要： A device for controlling the flow of electric current is provided. The device comprises a first conductor; a second conductor switchably coupled to the first conductor to alternate between an electrically connected state with the first conductor and an electrically disconnected state with the first conductor. At least one conductor further comprises an electrical contact, the electrical contact comprising a solid matrix comprising a plurality of pores; and a filler material disposed within at least a portion of the plurality of pores. The filler material has a melting point of less than about 575K. A method to make an electrical contact is provided. The method includes the steps of: providing a substrate; providing a plurality of pores on the substrate; and disposing a filler material within at least a portion of the plurality of pores. The filler material has a melting point of less than about 575K.

    摘要翻译： 提供了一种用于控制电流流动的装置。 该装置包括第一导体; 第二导体，其可切换地耦合到所述第一导体，以在与所述第一导体的电连接状态与与所述第一导体的电断开状态之间交替。 至少一个导体还包括电接触，所述电接触包括包含多个孔的固体基质; 以及设置在所述多个孔的至少一部分中的填充材料。 填充材料的熔点小于约575K。 提供了形成电接触的方法。 该方法包括以下步骤：提供衬底; 在衬底上提供多个孔; 以及在所述多个孔的至少一部分内设置填充材料。 填充材料的熔点小于约575K。