公开(公告)号：US11920244B2

公开(公告)日：2024-03-05

申请号：US16982694

申请日：2018-07-24

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Chi-Hao Chang ,  Ya-Ting Yeh ,  Kuan-Ting Wu ,  Chih-Hsiung Liao

IPC: C23C28/00 ,  C23C14/16 ,  C25D11/02 ,  C25D11/30 ,  G06F1/16

CPC classification number: C23C28/345 ,  C23C14/16 ,  C23C28/322 ,  C25D11/026 ,  C25D11/30 ,  G06F1/1656

Abstract: The application discloses examples of a device housing of an electronic device including a magnesium-alloy substrate. The device housing further including a treatment layer applied over the magnesium-alloy substrate and a metallic coating layer applied over the treatment layer to provide a metallic luster. Further, a paint coating layer is disposed over a first portion of the metallic coating layer. Further, a top coating layer is applied over the paint coating layer and a visible second portion of the metallic coating layer.

公开(公告)号：US11789548B2

公开(公告)日：2023-10-17

申请号：US18005736

申请日：2020-07-17

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Hsiao-Jou Lin ,  Kuan-Ting Wu ,  Alexander Williams

IPC: G06F3/0354 ,  F25B21/02

CPC classification number: G06F3/03543 ,  F25B21/02 ,  F25B2321/021

Abstract: An input mouse may include a top button, a first wall rearward of the top button to underlie a palm of a user and a second wall forming an exterior of the input mouse. The first wall is formed from a material composition comprising a first polymer encapsulating thermally conductive particles. The second wall is formed from a thermally conductive material. A solid-state Peltier heat pump has a first face thermally coupled to the first wall and a second face thermally coupled to the second wall.

公开(公告)号：US20230055348A1

公开(公告)日：2023-02-23

申请号：US17795016

申请日：2020-02-11

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Hsing-Hung Hsieh ,  Kuan-Ting Wu ,  Chi Hao Chang

IPC: H01L51/52 ,  H01L27/32 ,  H01L51/56

Abstract: An example dual plate Organic Light-Emitting Field-Effect Transistor (OLET) display device includes a first plate device having a first substrate; a gate layer adjacent to the first substrate; and a dielectric layer adjacent to the gate layer. A second plate device is connected to the first plate device. The second plate device includes a second substrate; a source/drain layer adjacent to the second substrate; and a stacked active organic layer adjacent to the source/drain layer. The first plate device and the second plate device are to be independently fabricated and joined together to position the stacked active organic layer adjacent to the dielectric layer.

公开(公告)号：US20220351676A1

公开(公告)日：2022-11-03

申请号：US17774179

申请日：2019-11-18

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Hsing-Hung Hsieh ,  Kuan-Ting Wu ,  Dehuei Chen

IPC: G09G3/3208 ,  H01L27/32 ,  H01L51/52

Abstract: In example implementations, a display is provided. The display includes an organic light emitting diode (OLED). An anode is coupled to the OLED and a thin film transistor is coupled to the anode of the OLED. A cathode layer is coupled to the OLED. An electrically controllable reflective layer is coupled to the cathode layer. An electrode layer is coupled to the electrically controllable reflective layer to control an amount of reflectivity of the electrically controllable reflective layer.

公开(公告)号：US20220341052A1

公开(公告)日：2022-10-27

申请号：US17637238

申请日：2019-10-31

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Qingyong Guo ,  Kuan-Ting Wu ,  Ya Cheng Chuang ,  Feng Gu

IPC: C25D13/12 ,  H05K5/04 ,  C25D13/20 ,  C23C18/16 ,  C23C18/18 ,  C23C28/00

Abstract: In one example, an electronic device housing may include a substrate, a micro-arc oxidation layer formed on a surface of the substrate, and an electroless plating layer formed on the micro-arc oxidation layer. Example electroless plating layer may be one of an electroless tin plating layer and an electroless silver plating layer. Further, the electronic device housing may include an electrophoretic deposition layer formed on the electroless plating layer.

公开(公告)号：US20220291547A1

公开(公告)日：2022-09-15

申请号：US17634666

申请日：2019-10-09

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Hsing-Hung Hsieh ,  Kuan-Ting Wu ,  Chi-Hao Chang

IPC: G02F1/13357 ,  G02F1/137 ,  G02F1/1368 ,  G02F1/1343 ,  G02F1/1335 ,  G02F1/1337 ,  H01L41/09

Abstract: Examples of light source distance alterations are described herein. An example device for providing light source distance alterations can include a display that includes a light source coupled to a piezo material to alter a distance between the light source and a corresponding aperture of an aperture layer.

公开(公告)号：US20220230878A1

公开(公告)日：2022-07-21

申请号：US17614590

申请日：2019-09-05

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Hsing-Hung Hsieh ,  Kuan-Ting Wu ,  Super Liao

IPC: H01L21/02 ,  H01L27/12 ,  H01L29/786

Abstract: A semiconductor composite layer can include a source electrode and a drain electrode individually comprising both a carrier mobility contributor and an amorphous phase stabilizer. The semiconductor composite layer can further include a semiconductive portion disposed between the source electrode and the drain electrode wherein the semiconductive portion comprises the carrier mobility contributor and the amorphous phase stabilizer, the semiconductivity controller comprising oxygen and an element having an electrode potential that is lower than that of both the carrier mobility contributor and the amorphous phase stabilizer.

公开(公告)号：US20220210940A1

公开(公告)日：2022-06-30

申请号：US17609890

申请日：2019-09-06

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Chi Hao Chang ,  Kuo Chih Huang ,  Kuan-Ting Wu

IPC: H05K5/04 ,  C23C28/00

Abstract: Examples of a dual injection-molded metal substrate have been described. In an example, a dual injection-molded metal substrate includes a magnesium alloy layer injection-molded on a portion of a first surface of an injection-molded aluminum alloy substrate.

公开(公告)号：US20220145488A1

公开(公告)日：2022-05-12

申请号：US17297163

申请日：2019-07-25

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Kuan-Ting Wu ,  Chi Hao Chang ,  Hsing-Hung Hsieh

IPC: C25D13/22 ,  H05K5/04 ,  C25D13/12 ,  C25D13/20

Abstract: The present disclosure is drawn to a multi-color electronic housing. The multi-color electronic housing can include a metal alloy having a first portion that can be milled, plasma-treated, and can include an electrodeposited colorant thereon. The metal alloy can further have a second portion that can be milled, plasma-treated, and can include second electrodeposited colorant thereon. The first electrodeposited colorant can provide a different coloration than the second electrodeposited colorant.

公开(公告)号：US11309229B2

公开(公告)日：2022-04-19

申请号：US16617956

申请日：2017-07-13

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Kuan-Ting Wu ,  Jamal Wakil ,  Davis Castillo

IPC: H01L23/373 ,  C09D7/61 ,  C09D7/20 ,  C09D133/08 ,  C09D167/00 ,  C09D169/00 ,  C09D175/04 ,  C08K3/04 ,  C08K3/08

Abstract: Described herein in some examples is a heat dissipation coating composition for an electronic device, which can comprise: a transparent coating layer deposited on a surface of the electronic device, wherein the coating layer comprises: a heat absorber selected from the group consisting of silica aerogel, carbon nanotubes, carbon nanotube aerogel, graphene, graphene aerogel, and combinations thereof, a transparent resin selected from the group consisting of a polyacrylic resin, a polycarbonate resin, a cyclic olefin resin, an epoxy resin, a urethane resin, a silicone resin, a cyanoacrylate resin, a polyester resin, and combinations thereof, and a solvent; and a heat spreader layer deposited at least partially on top of the transparent coating layer or deposited on the surface of the electronic device adjacent to the transparent coating layer, wherein the heat spreader layer comprises: metallic or non-metallic particles selected from the group consisting of copper, aluminum, graphite, carbon nanotube, graphene on a metal, graphene, and combinations thereof.