公开(公告)号：US20080182217A1

公开(公告)日：2008-07-31

申请号：US12020898

申请日：2008-01-28

申请人： Tetsuo Fukuoka ,  Takahiro Kitano ,  Kazuo Terada

发明人： Tetsuo Fukuoka ,  Takahiro Kitano ,  Kazuo Terada

IPC分类号： F27D15/02 ,  F27D3/00

CPC分类号： F27B17/0025 ,  H01L21/67109 ,  H01L21/67248

摘要： A heating device 1 includes a flat heating chamber 3 provided with a side opening. A substrate W is carried in a horizontal position through the side opening into the processing chamber 3, and is subjected to a heating process in the heating chamber 3. the heating chamber 3 is provided with heating plates 34 and 35 respectively provided with heating elements 34a and 35a, and a cooling mechanism 2 for cooling the heating plates 34 and 35. A controller 7 controls the cooling mechanism such that the heating plates 34 and 35 are cooled after the completion of the heating process for heating the substrate W and before a succeeding substrate W is carried into the heating chamber 3, and controls the heating elements 34a and 35a such that the heating plates 34 and 35 are heated at a processing temperature after the succeeding substrate has been carried into the heating chamber 3.

摘要翻译： 加热装置1包括具有侧开口的平坦加热室3。 基板W通过侧开口在水平位置被运送到处理室3中，并且在加热室3中进行加热处理。 加热室3设置有分别设有加热元件31a和35a的加热板34和35，以及用于冷却加热板34和35的冷却机构2。 控制器7控制冷却机构，使得加热板34和35在完成用于加热基板W的加热过程之后并且在将下一个基板W运送到加热室3之前被冷却，并且控制加热元件34a 和35a，使得加热板34和35在后续基板被运送到加热室3之后的加工温度下被加热。

公开(公告)号：US20070181928A1

公开(公告)日：2007-08-09

申请号：US11508141

申请日：2006-08-23

申请人： Yoshiki Yamanishi ,  Muneo Harada ,  Takahiro Kitano ,  Tatsuzo Kawaguchi ,  Yoshihiro Hirota ,  Kinji Yamada ,  Tomotaka Shinoda ,  Katsuya Okumura ,  Shuichi Kawano

发明人： Yoshiki Yamanishi ,  Muneo Harada ,  Takahiro Kitano ,  Tatsuzo Kawaguchi ,  Yoshihiro Hirota ,  Kinji Yamada ,  Tomotaka Shinoda ,  Katsuya Okumura ,  Shuichi Kawano

IPC分类号： H01L29/94

CPC分类号： H01L23/50 ,  H01G4/228 ,  H01G4/33 ,  H01L23/481 ,  H01L24/81 ,  H01L2224/81801 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01056 ,  H01L2924/01072 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/30105 ,  H05K1/162 ,  H05K3/002 ,  H05K2201/09509 ,  H05K2201/096 ,  H05K2201/10378

摘要： A capacitor having a high quality and a manufacturing method of the same are provided. A capacitor has a lower electrode formed on an oxide film, a dielectric layer formed on the lower electrode, an upper electrode formed so as to face the lower electrode with the dielectric layer between, and an upper electrode formed so as to cover the upper electrode, an opening portion of the upper electrode and an opening portion of the dielectric layer. By forming the upper electrode on the dielectric layer, it is possible to pattern the dielectric layer by using the upper electrode as a mask, and provide a capacitor having a high-quality dielectric layer by preventing impurity diffusion into the dielectric layer. By forming the upper electrode on the dielectric layer, it is possible to prevent the dielectric layer from being exposed to etching liquid, liquid developer, etc.

摘要翻译： 提供了具有高质量的电容器及其制造方法。 电容器具有形成在氧化膜上的下电极，形成在下电极上的电介质层，形成为与电极之间介电层相对的下电极的上电极和形成为覆盖上电极的上电极 ，上电极的开口部分和电介质层的开口部分。 通过在电介质层上形成上电极，可以通过使用上电极作为掩模对电介质层进行图案化，并且通过防止杂质扩散到电介质层中来提供具有高质量电介质层的电容器。 通过在电介质层上形成上部电极，可以防止电介质层暴露于蚀刻液体，液体显影剂等

公开(公告)号：US20070170170A1

公开(公告)日：2007-07-26

申请号：US11642827

申请日：2006-12-21

申请人： Noboyuki Sata ,  Takahiro Kitano ,  Tetsuo Fukuoka ,  Toshiyuki Matsumoto ,  Tomohide Minami

发明人： Noboyuki Sata ,  Takahiro Kitano ,  Tetsuo Fukuoka ,  Toshiyuki Matsumoto ,  Tomohide Minami

IPC分类号： H05B1/02

CPC分类号： H05B1/0233 ,  H01L21/67248

摘要： This invention provides a wafer-type temperature sensor capable of eliminating the need for an A/D converter, adapting itself to automation and improving the heat resistance to measure temperature distribution of the upper surface of a wafer, a temperature measuring device using the sensor, a thermal processor having a temperature measurement function and a temperature measurement method. The wafer-type temperature sensor comprises a wafer and a plurality of temperature sensors arranged in regions which are formed by segmenting the upper surface of the wafer into a plurality of regions. Each of the temperature sensors includes an oscillation circuit for oscillating a frequency signal corresponding to the temperature of its own region within a frequency band that is different for every region in response to input of power supply voltage.

摘要翻译： 本发明提供一种晶片式温度传感器，其能够消除对A / D转换器的需要，适应自动化和提高耐热性，以测量晶片上表面的温度分布，使用该传感器的温度测量装置， 具有温度测量功能和温度测量方法的热处理器。 晶片型温度传感器包括晶片和多个温度传感器，其布置在通过将晶片的上表面分割成多个区域而形成的区域中。 每个温度传感器包括振荡电路，用于响应于电源电压的输入，在与每个区域不同的频带内振荡对应于其自身区域的温度的频率信号。

公开(公告)号：US20070126041A1

公开(公告)日：2007-06-07

申请号：US11508204

申请日：2006-08-23

申请人： Tomotaka Shinoda ,  Kinji Yamada ,  Takahiro Kitano ,  Yoshiki Yamanishi ,  Muneo Harada ,  Tatsuzo Kawaguchi ,  Yoshihiro Hirota ,  Katsuya Okumura ,  Shuichi Kawano

发明人： Tomotaka Shinoda ,  Kinji Yamada ,  Takahiro Kitano ,  Yoshiki Yamanishi ,  Muneo Harada ,  Tatsuzo Kawaguchi ,  Yoshihiro Hirota ,  Katsuya Okumura ,  Shuichi Kawano

IPC分类号： H01L29/94 ,  H01L21/00

CPC分类号： H01L28/65 ,  H01L27/11507 ,  H01L28/55 ,  Y10T29/435

摘要： A dielectric film capacitor includes a lower electrode having an opening and formed of a material including platinum, a dielectric film provided over the lower electrode and including an oxide having an ABOx crystal structure, and an upper electrode provided over the dielectric film. The planar area of the lower electrode is 50% or more of the area of a formation region of the dielectric film. A dielectric film capacitor includes a lower electrode formed of a material including platinum and having a thickness of 10 to 100 nm, a dielectric film provided over the lower electrode and including an oxide having an ABOx crystal structure, and an upper electrode provided over the dielectric film.

摘要翻译： 电介质膜电容器包括具有开口并由包括铂的材料形成的下电极，设置在下电极上并包括具有ABOx晶体结构的氧化物的电介质膜和设置在电介质膜上的上电极。 下部电极的平面面积为电介质膜的形成区域的面积的50％以上。 电介质膜电容器包括由包括铂的材料形成的厚度为10至100nm的下电极，设置在下电极上并包括具有ABOx晶体结构的氧化物的电介质膜，以及设置在电介质上的上电极 电影。

公开(公告)号：US20070106013A1

公开(公告)日：2007-05-10

申请号：US10562140

申请日：2004-06-23

申请人： Yoshifumi Adachi ,  Takahiro Kitano ,  Shinichi Fujino ,  Katsuyuki Wada ,  Kazushi Torii ,  Taku Iwamura ,  Sayaka Machida

发明人： Yoshifumi Adachi ,  Takahiro Kitano ,  Shinichi Fujino ,  Katsuyuki Wada ,  Kazushi Torii ,  Taku Iwamura ,  Sayaka Machida

IPC分类号： C09D5/02

CPC分类号： A61L15/60 ,  A61F2013/530686 ,  A61F2013/530744

摘要： The production method of a water absorbent resin composition including a particulate water absorbent resin, wherein: 95 wt % or more of particles whose particle diameter is less than 850 μm and not less, than 106 μm are contained, and a weight average particle diameter of the particles is less than 500 μm and not less than 300 μm and a logarithmic standard deviation (σξ) of a particle size distribution is 0.45 or less, and a water-soluble component of the water absorbent composition is 35 wt % or less, and a multivalent metal component is contained, and an extraction rate of the multivalent metal component is 5.0 wt % or more and less than 100 wt %, thereby providing the water absorbent resin composition, free from any coagulation of particles in high humidity, which has superior absorbent property in terms of an absorbency and a diffusing absorbency under pressure.

摘要翻译： 含有颗粒状吸水性树脂的吸水性树脂组合物的制造方法，其中含有95重量％以上的粒径小于850μm，不小于106μm的颗粒，重量平均粒径为 粒子小于500μm且不小于300μm，粒度分布的对数标准偏差（sigmaxi）为0.45以下，吸水性组合物的水溶性成分为35重量％以下， 含有多价金属成分，多价金属成分的提取率为5.0重量％以上且小于100重量％，因此提供了在高湿度下没有任何凝结的高吸湿性树脂组合物，其具有优异的 就吸收性而言，在压力下的扩散吸收性。

公开(公告)号：US20070048979A1

公开(公告)日：2007-03-01

申请号：US11505810

申请日：2006-08-18

申请人： Tetsuo Fukuoka ,  Masami Akimoto ,  Takahiro Kitano ,  Yoshi Kimura ,  Shinichi Hayashi ,  Hikaru Ito

发明人： Tetsuo Fukuoka ,  Masami Akimoto ,  Takahiro Kitano ,  Yoshi Kimura ,  Shinichi Hayashi ,  Hikaru Ito

IPC分类号： C30B11/00

CPC分类号： C30B33/02 ,  C30B35/00 ,  H01L21/67098 ,  H01L21/67748

摘要： A heating apparatus 2 comprises a housing 20; a flat heating chamber 4 which is provided in the housing 2 and adapted to heat a wafer W used as a substrate, with one side of the heating chamber 4 opening for carrying in and carrying out the wafer; and a heating plates 44, 45 provided in the heating chamber 4 such that the wafer W can be heated from both above and below. A cooling plate 3 is provided in the housing 20 located in the vicinity of the opening of the heating chamber 4, for cooling the wafer W after being heated by the heating plates 44, 45. Additionally, a carrying means is provided in the housing 20 for carrying the wafer W between an upper position of the cooling plate 3 and the interior of the heating chamber 4 such that a heat treatment for the wafer W can be performed with the wafer W being held in the heating chamber 4.

摘要翻译： 加热装置2包括壳体20; 平面加热室4，其设置在壳体2中并且适于加热用作基板的晶片W，加热室4的一侧开口用于承载和执行晶片; 以及设置在加热室4中的加热板44,45，使得晶片W能够从上下两者加热。 冷却板3设置在位于加热室4的开口附近的壳体20中，用于在被加热板44,45加热之后冷却晶片W.此外，在壳体20中设置有承载装置 用于在冷却板3的上部位置和加热室4的内部之间承载晶片W，使得可以在将晶片W保持在加热室4中的情况下进行晶片W的热处理。

公开(公告)号：US20050222293A1

公开(公告)日：2005-10-06

申请号：US11136368

申请日：2005-05-25

申请人： Takahiro Kitano ,  Hirokazu Suzuki ,  Keiji Kubo ,  Masayasu Ogushi ,  Kazutoshi Terada ,  Tsuneo Kawabata ,  Masaki Kojima

发明人： Takahiro Kitano ,  Hirokazu Suzuki ,  Keiji Kubo ,  Masayasu Ogushi ,  Kazutoshi Terada ,  Tsuneo Kawabata ,  Masaki Kojima

IPC分类号： C08F2/46 ,  C09J4/06 ,  C08G2/00

CPC分类号： C09J4/06 ,  C08F265/04

摘要： A curable resin composition with excellent thermal adhesiveness is constituted of the following components (A) to (C): (A) a thermoadhesive polymer; (B) an ethylenic unsaturated compound polymerizable by active energy radiation; and (C) a polymerization initiator, wherein the relationships represented by the following formulas (1) and (2) are satisfied: 0.1≦(Awt)/{(Awt)+(Bwt)}≦0.6  (1) 0.4≦(Bwt)/{(Awt)+(Bwt)}≦0.9  (2) where (Awt) stands for a compounded amount (parts by weight) of component (A), and (Bwt) stands for a compounded amount (parts by weight) of component (B).

摘要翻译： 热粘合性优异的固化性树脂组合物由以下成分（A）〜（C）构成：（A）热粘合性聚合物; （B）通过活性能量辐射可聚合的烯属不饱和化合物; 和（C）聚合引发剂，其中满足由下式（1）和（2）表示的关系：<？in-line-formula description =“In-line formula”end =“lead”？> 0.1 < =（Awt）/ {（Awt）+（Bwt）} <= 0.6（1）<？in-line-formula description =“In-line Formulas”end =“tail”？> <？in-line-formula description =“In-line Formulas”end =“lead”？> 0.4 <=（Bwt）/ {（Awt）+（Bwt）} <= 0.9（2）<？in-line-formula description = “end =”tail“？>其中（Awt）表示组分（A）的配混量（重量份），（Bwt）表示组分（B）的配混量（重量份）。

公开(公告)号：US20050155550A1

公开(公告)日：2005-07-21

申请号：US11080756

申请日：2005-03-16

申请人： Takahiro Kitano ,  Masateru Morikawa ,  Yukihiko Esaki ,  Nobukazu Ishizaka ,  Norihisa Koga ,  Kazuhiro Takeshita ,  Hirofumi Ookuma ,  Masami Akimoto

发明人： Takahiro Kitano ,  Masateru Morikawa ,  Yukihiko Esaki ,  Nobukazu Ishizaka ,  Norihisa Koga ,  Kazuhiro Takeshita ,  Hirofumi Ookuma ,  Masami Akimoto

IPC分类号： H01L21/027 ,  G03F7/16 ,  H01L21/00 ,  B05D3/12 ,  B05C11/00

CPC分类号： H01L21/6715 ,  G03F7/162 ,  Y10S134/902

摘要： A coating film forming apparatus for forming a film by applying a coating solution to a substrate, which is provided with a cassette section, coating unit, developing unit, pre-treatment/post-treatment units and a main arm for transferring the substrate between the respective units. In the coating unit, provided is a coating section in which a resist is applied on the substrate in a manner of single stroke by intermittently moving the substrate in a Y-direction and by moving a nozzle in an X-direction, and provided is a reduced-pressure drying section for drying under reduced pressure the substrate after being applied, and further provided is equipment for removing the coating film adhered to a periphery of the substrate. Additionally, when the reduced-pressure drying section is arranged outside the coating unit, the main arm is covered with a cover so that the inside thereof is under a solvent atmosphere.

公开(公告)号：US20050109274A1

公开(公告)日：2005-05-26

申请号：US10950411

申请日：2004-09-28

申请人： Takahiro Kitano ,  Norihisa Koga ,  Toshichika Takei ,  Yoshiyuki Kawafuchi

发明人： Takahiro Kitano ,  Norihisa Koga ,  Toshichika Takei ,  Yoshiyuki Kawafuchi

IPC分类号： H01L21/30 ,  B05B13/04 ,  B05C5/02 ,  B05C11/10 ,  H01L21/00 ,  B05B9/06 ,  B05C11/00

CPC分类号： H01L21/6715 ,  B05B13/041 ,  B05C5/0208 ,  B05C11/1013

摘要： A substrate is horizontally held by a substrate holding portion freely movable in the Y-direction, and a nozzle portion is provided above and opposing the substrate, and movable in X-direction corresponding to the coating liquid feeding region of the substrate. A discharge opening is formed at a lower end of the nozzle portion, and a channel connecting the discharge opening with a coating liquid feed tube coupled to an upper end of the nozzle portion is formed within the discharge opening. At the mid-stream of the channel, a liquid pool portion larger in diameter than the discharge opening is formed, the inside of which is provided with a filtering member formed by porous bodies blocking the channel. The filtering member forms a pressure loss portion, which absorbs pulsation occurring at the coating liquid feed tube before it reaches the discharge opening.

摘要翻译： 基板由能够沿Y方向自由移动的基板保持部水平保持，并且在基板的上方并且与基板相对设置有喷嘴部，并且能够在与基板的涂布液供给区域对应的X方向上移动。 在喷嘴部的下端形成有排出口，在喷出口内形成有将排出口与与喷嘴部的上端连结的涂液供给管连结的流路。 在通道的中间部分，形成直径大于排出口的液体池部分，其内部设有由堵塞通道的多孔体形成的过滤构件。 过滤构件形成压力损失部分，其在到达排出口之前吸收在涂液供给管处发生的脉动。

公开(公告)号：US20050087129A1

公开(公告)日：2005-04-28

申请号：US10932042

申请日：2004-09-02

申请人： Takahiro Kitano ,  Manabu Hama ,  Shinichi Sugimoto ,  Naoya Hirakawa

发明人： Takahiro Kitano ,  Manabu Hama ,  Shinichi Sugimoto ,  Naoya Hirakawa

IPC分类号： H01L21/027 ,  B05D3/04 ,  H01L21/00 ,  B05C11/00

CPC分类号： H01L21/67034 ,  B05D3/0493

摘要： The invention includes a hermetic container provided with a substrate mount; a vacuum exhauster connected to the hermetic container; a current member; and a current member raising and lowering mechanism. When the current member is raised and lowered as a function of the pressure inside the hermetic container, a liquid flow of the coating solution on the substrate is controlled, thereby controlling the uniformity of the film thickness of the coating solution.

摘要翻译： 本发明包括设置有基板安装件的密封容器; 连接到密封容器的真空排气器; 现任会员 和当前成员升降机制。 当根据密封容器内部的压力升高和降低当前构件时，控制基底上的涂布液的液体流动，从而控制涂布溶液的膜厚均匀性。