公开(公告)号：US20060054711A1

公开(公告)日：2006-03-16

申请号：US11264010

申请日：2005-11-02

申请人： Junichiro Osako ,  Hirotaka Nishizawa ,  Kenji Osawa ,  Akira Higuchi

发明人： Junichiro Osako ,  Hirotaka Nishizawa ,  Kenji Osawa ,  Akira Higuchi

IPC分类号： G06K19/06

CPC分类号： H05K3/284 ,  B29C45/14647 ,  B29C45/14655 ,  B29C45/1657 ,  B29C45/1671 ,  B29C2045/1673 ,  H01L21/563 ,  H01L21/565 ,  H01L23/3121 ,  H01L23/3135 ,  H01L23/49855 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2924/01014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/10253 ,  H01L2924/12041 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/181 ,  H05K1/117 ,  H05K2201/10159 ,  H05K2203/1316 ,  H05K2203/1572 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： An IC body is loaded to a case 2 made of thermosetting resin material and sealed with a sealing portion made of thermosetting resin material to be integrated, whereby an IC card is manufactured. The IC body comprises: a wiring substrate formed with an external connection terminal at a back surface thereof; a semiconductor chip loaded over a surface of the wiring substrate and electrically connected to the external connection terminal via a interconnect; and the sealing portion made of thermosetting resin material so as to cover the semiconductor chip and a bonding wire. The sealing portion is formed so that the external connection terminal is exposed. The present invention makes it possible to heighten the strength of IC cards and at the same time, to reduce the manufacturing cost and improve the reliability.

公开(公告)号：US20080225498A1

公开(公告)日：2008-09-18

申请号：US12125921

申请日：2008-05-23

申请人： JUNICHIRO OSAKO ,  Hirotaka Nishizawa ,  Kenji Osawa ,  Hideo Koike

发明人： JUNICHIRO OSAKO ,  Hirotaka Nishizawa ,  Kenji Osawa ,  Hideo Koike

IPC分类号： H05K1/14

CPC分类号： G06K19/07739 ,  G06K19/07743 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2225/06562 ,  H01R12/7005 ,  H01R12/714 ,  H01R27/00 ,  H01R31/06 ,  H01R2201/20 ,  H05K1/117 ,  H05K1/142 ,  H05K3/326 ,  H01L2924/00014 ,  H01L2924/00

摘要： An adapter for a memory card is disclosed which performs a change of size so that a memory card smaller in planar size but almost equal in thickness as compared with a multi-media card can be used as a multi-media card. A protuberant portion is formed behind plural external terminals formed on a back side of the adapter, whereby, while the thickness of a front side of the adapter is maintained at a standardized thickness of the multi-media card, a rear side of the adapter is made thicker than the front side and internal terminals for contact with external terminals of the memory card are disposed in the interior of the thick portion of the adapter. The versatility of an extremely small-sized memory card can be improved.

摘要翻译： 公开了一种用于存储卡的适配器，其执行尺寸的改变，使得与多媒体卡相比，平面尺寸较小但几乎相等的存储卡可用作多媒体卡。 在形成在适配器的背面的多个外部端子之后形成突出部分，由此，当适配器的前侧的厚度保持在多媒体卡的标准厚度时，适配器的后侧 制成厚于前侧，并且用于与存储卡的外部端子接触的内部端子设置在适配器的厚部的内部。 可以提高极小型存储卡的多功能性。

公开(公告)号：US07382045B2

公开(公告)日：2008-06-03

申请号：US11423755

申请日：2006-06-13

申请人： Junichiro Osako ,  Hirotaka Nishizawa ,  Kenji Osawa ,  Akira Higuchi

发明人： Junichiro Osako ,  Hirotaka Nishizawa ,  Kenji Osawa ,  Akira Higuchi

IPC分类号： H01L23/02 ,  H01L23/12 ,  H01L23/28

CPC分类号： H05K3/284 ,  B29C45/14647 ,  B29C45/14655 ,  B29C45/1657 ,  B29C45/1671 ,  B29C2045/1673 ,  H01L21/563 ,  H01L21/565 ,  H01L23/3121 ,  H01L23/3135 ,  H01L23/49855 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2924/01014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/10253 ,  H01L2924/12041 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/181 ,  H05K1/117 ,  H05K2201/10159 ,  H05K2203/1316 ,  H05K2203/1572 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： An IC body is loaded to a case 2 made of thermosetting resin material and sealed with a sealing portion made of thermosetting resin material to be integrated, whereby an IC card is manufactured. The IC body comprises: a wiring substrate formed with an external connection terminal at a back surface thereof; a semiconductor chip loaded over a surface of the wiring substrate and electrically connected to the external connection terminal via a interconnect; and the sealing portion made of thermosetting resin material so as to cover the semiconductor chip and a bonding wire. The sealing portion is formed so that the external connection terminal is exposed. The present invention makes it possible to heighten the strength of IC cards and at the same time, to reduce the manufacturing cost and improve the reliability.

摘要翻译： 将IC体装载到由热固性树脂材料制成的壳体2上并用由热固性树脂材料制成的密封部分密封以一体化，由此制造IC卡。 IC体包括：在其背面形成有外部连接端子的布线基板; 半导体芯片，其负载在所述布线基板的表面上，并且经由互连电连接到所述外部连接端子; 以及由热固性树脂材料制成的密封部分以覆盖半导体芯片和接合线。 密封部形成为使外部连接端子露出。 本发明可以提高IC卡的强度，同时降低制造成本，提高可靠性。

公开(公告)号：US20060194479A1

公开(公告)日：2006-08-31

申请号：US11361957

申请日：2006-02-27

申请人： Junichiro Osako ,  Hirotaka Nishizawa ,  Kenji Osawa ,  Hideo Koike

发明人： Junichiro Osako ,  Hirotaka Nishizawa ,  Kenji Osawa ,  Hideo Koike

IPC分类号： H01R33/90

CPC分类号： G06K19/07739 ,  G06K19/07743 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2225/06562 ,  H01R12/7005 ,  H01R12/714 ,  H01R27/00 ,  H01R31/06 ,  H01R2201/20 ,  H05K1/117 ,  H05K1/142 ,  H05K3/326 ,  H01L2924/00014 ,  H01L2924/00

摘要： An adapter for a memory card is disclosed which performs a change of size so that a memory card smaller in planar size but almost equal in thickness as compared with a multi-media card can be used as a multi-media card. A protuberant portion is formed behind plural external terminals formed on a back side of the adapter, whereby, while the thickness of a front side of the adapter is maintained at a standardized thickness of the multi-media card, a rear side of the adapter is made thicker than the front side and internal terminals for contact with external terminals of the memory card are disposed in the interior of the thick portion of the adapter. The versatility of an extremely small-sized memory card can be improved.

摘要翻译： 公开了一种用于存储卡的适配器，其执行尺寸的改变，使得与多媒体卡相比，平面尺寸较小但几乎相等的存储卡可用作多媒体卡。 在形成在适配器的背面的多个外部端子之后形成突出部分，由此，当适配器的前侧的厚度保持在多媒体卡的标准厚度时，适配器的后侧 制成厚于前侧，并且用于与存储卡的外部端子接触的内部端子设置在适配器的厚部的内部。 可以提高极小型存储卡的多功能性。

公开(公告)号：US06988668B2

公开(公告)日：2006-01-24

申请号：US10668229

申请日：2003-09-24

申请人： Junichiro Osako ,  Hirotaka Nishizawa ,  Kenji Osawa ,  Akira Higuchi

发明人： Junichiro Osako ,  Hirotaka Nishizawa ,  Kenji Osawa ,  Akira Higuchi

IPC分类号： G06K19/06 ,  G06K19/02

CPC分类号： H05K3/284 ,  B29C45/14647 ,  B29C45/14655 ,  B29C45/1657 ,  B29C45/1671 ,  B29C2045/1673 ,  H01L21/563 ,  H01L21/565 ,  H01L23/3121 ,  H01L23/3135 ,  H01L23/49855 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2924/01014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/10253 ,  H01L2924/12041 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/181 ,  H05K1/117 ,  H05K2201/10159 ,  H05K2203/1316 ,  H05K2203/1572 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： An IC body is loaded on a case made of a thermoplastic resin material and sealed to the case with a sealing portion made of thermoplastic resin material, whereby an IC card is manufactured. The IC body includes a wiring substrate formed with an external connection terminal at a back surface thereof, a semiconductor chip loaded over a surface of the wiring substrate and electrically connected to the external connection terminal via an interconnect, and a sealing portion made of thermoplastic resin material so as to cover the semiconductor chip and a bonding wire. The sealing portion is formed so that the external connection terminal is exposed. Thus, making it possible to increase the strength of IC cards and, at the same time, to reduce the manufacturing cost and improve the reliability.

摘要翻译： 将IC体装载在由热塑性树脂材料制成的壳体上，并用由热塑性树脂材料制成的密封部分密封到壳体上，由此制造IC卡。 IC体包括在其背面形成有外部连接端子的布线基板，负载在布线基板的表面上并通过布线电连接到外部连接端子的半导体芯片，以及由热塑性树脂制成的密封部 材料，以覆盖半导体芯片和接合线。 密封部形成为使外部连接端子露出。 因此，能够提高IC卡的强度，同时降低制造成本，提高可靠性。

公开(公告)号：US07615855B2

公开(公告)日：2009-11-10

申请号：US12116190

申请日：2008-05-06

申请人： Junichiro Osako ,  Hirotaka Nishizawa ,  Kenji Osawa ,  Akira Higuchi

发明人： Junichiro Osako ,  Hirotaka Nishizawa ,  Kenji Osawa ,  Akira Higuchi

IPC分类号： H01L23/02 ,  H01L23/12 ,  H01L23/28

CPC分类号： H05K3/284 ,  B29C45/14647 ,  B29C45/14655 ,  B29C45/1657 ,  B29C45/1671 ,  B29C2045/1673 ,  H01L21/563 ,  H01L21/565 ,  H01L23/3121 ,  H01L23/3135 ,  H01L23/49855 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2924/01014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/10253 ,  H01L2924/12041 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/181 ,  H05K1/117 ,  H05K2201/10159 ,  H05K2203/1316 ,  H05K2203/1572 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： An IC body is loaded to a case 2 made of thermosetting resin material and sealed with a sealing portion made of thermosetting resin material to be integrated, whereby an IC card is manufactured. The IC body comprises: a wiring substrate formed with an external connection terminal at a back surface thereof; a semiconductor chip loaded over a surface of the wiring substrate and electrically connected to the external connection terminal via a interconnect; and the sealing portion made of thermosetting resin material so as to cover the semiconductor chip and a bonding wire. The sealing portion is formed so that the external connection terminal is exposed. The present invention makes it possible to heighten the strength of IC cards and at the same time, to reduce the manufacturing cost and improve the reliability.

摘要翻译： 将IC体装载到由热固性树脂材料制成的壳体2上，并用由热固性树脂材料制成的密封部分密封，从而制造IC卡。 IC体包括：在其背面形成有外部连接端子的布线基板; 半导体芯片，其负载在所述布线基板的表面上，并且经由互连电连接到所述外部连接端子; 以及由热固性树脂材料制成的密封部分以覆盖半导体芯片和接合线。 密封部形成为使外部连接端子露出。 本发明可以提高IC卡的强度，同时降低制造成本，提高可靠性。

公开(公告)号：US07823793B2

公开(公告)日：2010-11-02

申请号：US12261993

申请日：2008-10-30

申请人： Akira Higuchi ,  Hirotaka Nishizawa ,  Junichiro Osako ,  Kenji Osawa

发明人： Akira Higuchi ,  Hirotaka Nishizawa ,  Junichiro Osako ,  Kenji Osawa

IPC分类号： G06K19/06

CPC分类号： G06K19/07732 ,  G06K19/0719 ,  G06K19/07733 ,  G06K19/07741 ,  G06K19/07743 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H05K1/0268 ,  H05K1/117 ,  H01L2924/00014 ,  H01L2924/00

摘要： An IC card and card adapters are designed so that the IC card of a specific standard (e.g., MMC standard) is compatible with IC cards and terminals of other standards (e.g., MS card standard and USB terminal standard). In the IC card (MMC), a controller IC, which is connected to a flash memory, includes a voltage pull-down detector, a mode controller, a USB-mode interface controller, a MS-mode interface controller, and an MMC/SD-mode interface controller. The card adapters suffice to have component parts which are easy in formation and low in cost such as wiring lines and resistors. The voltage pull-down detector of the IC card detects the voltage pull-down caused by the resistors, and the mode controller selects the USB-mode interface controller, MS-mode interface controller or MMC/SD-mode interface controller so that the IC card becomes compatible with the corresponding IC card standard.

摘要翻译： IC卡和卡适配器被设计成使得特定标准（例如，MMC标准）的IC卡与IC卡和其他标准的终端（例如，MS卡标准和USB终端标准）兼容。 在IC卡（MMC）中，连接到闪速存储器的控制器IC包括电压下拉检测器，模式控制器，USB模式接口控制器，MS模式接口控制器和MMC / SD模式接口控制器。 卡适配器足以具有易于形成的部件，成本低廉，例如布线和电阻器。 IC卡的电压下拉检测器检测由电阻引起的电压下拉，模式控制器选择USB模式接口控制器，MS模式接口控制器或MMC / SD模式接口控制器，使IC 卡与相应的IC卡标准兼容。

公开(公告)号：US07427032B2

公开(公告)日：2008-09-23

申请号：US11361957

申请日：2006-02-27

申请人： Junichiro Osako ,  Hirotaka Nishizawa ,  Kenji Osawa ,  Hideo Koike

发明人： Junichiro Osako ,  Hirotaka Nishizawa ,  Kenji Osawa ,  Hideo Koike

IPC分类号： G06K19/06

CPC分类号： G06K19/07739 ,  G06K19/07743 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2225/06562 ,  H01R12/7005 ,  H01R12/714 ,  H01R27/00 ,  H01R31/06 ,  H01R2201/20 ,  H05K1/117 ,  H05K1/142 ,  H05K3/326 ,  H01L2924/00014 ,  H01L2924/00

摘要： An adapter for a memory card is disclosed which performs a change of size so that a memory card smaller in planar size but almost equal in thickness as compared with a multi-media card can be used as a multi-media card. A protuberant portion is formed behind plural external terminals formed on a back side of the adapter, whereby, while the thickness of a front side of the adapter is maintained at a standardized thickness of the multi-media card, a rear side of the adapter is made thicker than the front side and internal terminals for contact with external terminals of the memory card are disposed in the interior of the thick portion of the adapter. The versatility of an extremely small-sized memory card can be improved.

摘要翻译： 公开了一种用于存储卡的适配器，其执行尺寸的改变，使得与多媒体卡相比，平面尺寸较小但几乎相等的存储卡可用作多媒体卡。 在形成在适配器的背面的多个外部端子之后形成突出部分，由此，当适配器的前侧的厚度保持在多媒体卡的标准厚度时，适配器的后侧 制成厚于前侧，并且用于与存储卡的外部端子接触的内部端子设置在适配器的厚部的内部。 可以提高极小型存储卡的多功能性。

公开(公告)号：US07012321B2

公开(公告)日：2006-03-14

申请号：US10377713

申请日：2003-03-04

申请人： Masachika Masuda ,  Tamaki Wada ,  Michiaki Sugiyama ,  Hirotaka Nishizawa ,  Toshio Sugano ,  Yasushi Takahashi ,  Masayasu Kawamura

发明人： Masachika Masuda ,  Tamaki Wada ,  Michiaki Sugiyama ,  Hirotaka Nishizawa ,  Toshio Sugano ,  Yasushi Takahashi ,  Masayasu Kawamura

IPC分类号： H01L23/495 ,  H01L21/44 ,  H01L21/48 ,  H01L21/50 ,  H01R43/00

CPC分类号： H01L24/06 ,  H01L23/4951 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/04042 ,  H01L2224/05554 ,  H01L2224/05599 ,  H01L2224/06136 ,  H01L2224/32145 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/4826 ,  H01L2224/48599 ,  H01L2224/49113 ,  H01L2224/49171 ,  H01L2224/73215 ,  H01L2224/85201 ,  H01L2224/85205 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01023 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01039 ,  H01L2924/01055 ,  H01L2924/01058 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/30105 ,  H01L2924/3011 ,  Y10T29/49121 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/85399

摘要： A semiconductor device comprising a resin mold, two semiconductor chips positioned inside the resin mold and having front and back surfaces and external terminals formed on the front surfaces, and leads extending from the inside to the outside of the resin mold, wherein each of said leads is branched into two branch leads in at least the resin mold, the one branch lead is secured to the surface of the one semiconductor chip and is electrically connected to an external terminal on the surface thereof through a wire, the other branch lead is secured to the surface of the other semiconductor chip and is electrically connected to an external terminal on the surface thereof through a wire, and the two semiconductor chips are stacked one upon the other, with their back surfaces opposed to each other.

公开(公告)号：US20050184380A1

公开(公告)日：2005-08-25

申请号：US11114175

申请日：2005-04-26

申请人： Kazuki Sakuma ,  Masayasu Kawamura ,  Yasushi Takahashi ,  Masachika Masuda ,  Tamaki Wada ,  Michiaki Sugiyama ,  Hirotaka Nishizawa ,  Toshio Sugano

发明人： Kazuki Sakuma ,  Masayasu Kawamura ,  Yasushi Takahashi ,  Masachika Masuda ,  Tamaki Wada ,  Michiaki Sugiyama ,  Hirotaka Nishizawa ,  Toshio Sugano

IPC分类号： G11C8/00 ,  H01L23/02 ,  H01L23/495

CPC分类号： H01L24/06 ,  H01L23/4951 ,  H01L23/49537 ,  H01L23/49575 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/04042 ,  H01L2224/05554 ,  H01L2224/05599 ,  H01L2224/06136 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/4826 ,  H01L2224/49171 ,  H01L2224/73215 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01055 ,  H01L2924/01058 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/3011 ,  H01L2224/45099 ,  H01L2924/00 ,  H01L2924/00012

摘要： A semiconductor device is formed by laminating two semiconductor chips with the rear surfaces thereof provided face to face. Each semiconductor chip is provided with an outer lead for clock enable to which the clock enable signal and chip select signal are individually input. On the occasion of making access to one semiconductor chip, the other semiconductor chip is set to the low power consumption mode by setting the clock enable signal and chip select signal to the non-active condition.