公开(公告)号：US20180316383A1

公开(公告)日：2018-11-01

申请号：US15771865

申请日：2015-12-21

Applicant: Intel Corporation

Inventor： Telesphor KAMGAING ,  Georgios C. DOGIAMIS ,  Vijay K. NAIR

IPC: H04B1/44 ,  H04B1/401 ,  H01Q3/42 ,  H01Q21/22

CPC classification number: H04B1/44 ,  H01Q3/36 ,  H01Q3/42 ,  H01Q21/06 ,  H01Q21/22 ,  H01Q23/00 ,  H04B1/18 ,  H04B1/401 ,  H04B1/48

Abstract: Embodiments of the invention include a communication module that includes a die having a transceiver and a phase shifter die that is coupled to the die. The phase shifter includes a power combiner and splitter. The communication module also includes a substrate that is coupled to the phase shifter die. The substrate includes an antenna unit with steerable beam forming capability for transmitting and receiving communications.

公开(公告)号：US20180097458A1

公开(公告)日：2018-04-05

申请号：US15283117

申请日：2016-09-30

Applicant: Intel Corporation

Inventor： Shawna M. LIFF ,  Georgios C. DOGIAMIS ,  Sasha N. OSTER ,  Feras EID ,  Adel A. ELSHERBINI ,  Thomas L. SOUNART ,  Johanna M. SWAN

IPC: H02N2/02 ,  H01L41/09 ,  H01L41/187 ,  H01L41/18

CPC classification number: H02N2/023 ,  G01J3/42 ,  H01L27/20 ,  H02N2/025 ,  H02N2/026 ,  H02N2/101

Abstract: Embodiments of the invention include a self-propelled sensor system. In an embodiment, the self-propelled sensor system includes a piezoelectrically actuated motor that is integrated with a substrate. In an embodiment, the self-propelled sensor system may also include a sensor and an integrated circuit electrically coupled to the piezoelectrically actuated motor. Embodiments of the invention may also include self-propelled sensor systems that include plurality of piezoelectrically actuated motors. In an embodiment the piezoelectrically actuated motors may be one or more different types of motors including, but not limited to, stick and slip motors, inchworm stepping motors, standing acoustic wave motors, a plurality of piezoelectrically actuated cantilevers, and a piezoelectrically actuated diaphragm. Additional embodiments of the invention may include a plurality of self-propelled sensor systems that are communicatively coupled to form a sensor mesh.

公开(公告)号：US20180006208A1

公开(公告)日：2018-01-04

申请号：US15199894

申请日：2016-06-30

Applicant: Intel Corporation

Inventor： Feras EID ,  Sasha N. OSTER ,  Georgios C. DOGIAMIS ,  Shawna M. LIFF ,  Adel A. ELSHERBINI ,  Thomas L. SOUNART ,  Johanna M. SWAN

IPC: H01L41/113 ,  G06F1/16 ,  H01L41/16

CPC classification number: H01L41/1136 ,  B81B2201/0235 ,  B81B2207/012 ,  B81C1/00476 ,  G06F1/1633 ,  G06F1/1694 ,  G06F2200/1637 ,  H01L41/1132 ,  H01L41/16

Abstract: Embodiments of the invention include a sensing device that includes a base structure having a proof mass that is positioned in proximity to a cavity of an organic substrate, a piezoelectric material in contact with a first electrode of the base structure, and a second electrode in contact with the piezoelectric material. The proof mass deflects in response to application of an external force or acceleration and this deflection causes a stress in the piezoelectric material which generates a voltage differential between the first and second electrodes.

公开(公告)号：US20180004357A1

公开(公告)日：2018-01-04

申请号：US15199906

申请日：2016-06-30

Applicant: Intel Corporation

Inventor： Adel A. ELSHERBINI ,  Feras EID ,  Sasha N. OSTER ,  Georgios C. DOGIAMIS ,  Thomas L. SOUNART ,  Johanna M. SWAN ,  Shawna M. LIFF

IPC: G06F3/043 ,  H03H9/25 ,  G06F3/041

CPC classification number: G06F3/0436 ,  G06F3/0416 ,  H01L2924/15311 ,  H01L2924/181 ,  H03H9/25 ,  H01L2924/00012

Abstract: Embodiments of the invention include an acoustic sensing device having a piezoelectric transmit transducer to receive input electrical signals and to generate a surface acoustic wave to be transmitted along a surface of the sensing device which is integrated with an organic substrate. The sensing device also includes a piezoelectric receive transducer to receive the surface acoustic wave and to generate output electrical signals and an input region integrated with the organic substrate. The input region is capable of receiving input which changes an acoustic amplitude of the surface acoustic wave.

公开(公告)号：US20180001640A1

公开(公告)日：2018-01-04

申请号：US15199899

申请日：2016-06-30

Applicant: Intel Corporation

Inventor： Feras EID ,  Shawna M. LIFF ,  Sasha N. OSTER ,  Thomas L. SOUNART ,  Georgios C. DOGIAMIS ,  Adel A. ELSHERBINI ,  Johanna M. SWAN

IPC: B41J2/14

CPC classification number: B41J2/14298 ,  B41J2/14201 ,  B41J2/14233 ,  B41J2002/14266 ,  B41J2202/13

Abstract: Embodiments of the invention include a piezoelectric package integrated jet device. In one example, the jet device includes a vibrating membrane positioned between first and second cavities of an organic substrate, a piezoelectric material coupled to the vibrating membrane which acts as a first electrode, and a second electrode in contact with the piezoelectric material. The vibrating membrane generates fluid flow through an orifice in response to application of an electrical signal between the first and second electrodes.

公开(公告)号：US20170288642A1

公开(公告)日：2017-10-05

申请号：US15088987

申请日：2016-04-01

Applicant: Intel Corporation

Inventor： Feras EID ,  Georgios C. DOGIAMIS ,  Valluri R. RAO ,  Adel A. ELSHERBINI ,  Johanna M. SWAN ,  Telesphor KAMGAING ,  Vijay K. NAIR

IPC: H03H9/54 ,  H03H9/05 ,  B01D21/30 ,  H03H9/17

CPC classification number: H03H9/54 ,  H03H9/05 ,  H03H9/0542 ,  H03H9/17 ,  H03H9/173 ,  H03H9/2463 ,  H03H2009/02503 ,  H03H2009/155

Abstract: Embodiments of the invention include a filtering device that includes a first electrode, a piezoelectric material in contact with the first electrode, and a second electrode in contact with the piezoelectric material. The piezoelectric filtering device expands and contracts laterally in a plane of an organic substrate in response to application of an electrical signal between the first and second electrodes.

公开(公告)号：US20170285695A1

公开(公告)日：2017-10-05

申请号：US15089001

申请日：2016-04-01

Applicant: Intel Corporation

Inventor： Vijay K. NAIR ,  Feras EID ,  Adel A. ELSHERBINI ,  Telesphor KAMGAING ,  Georgios C. DOGIAMIS ,  Valluri R. RAO ,  Johanna M. SWAN

IPC: G06F1/18 ,  H03H9/54 ,  H03H9/56

CPC classification number: G06F1/18 ,  H03H9/0542 ,  H03H9/0557 ,  H03H9/542 ,  H03H9/545 ,  H03H9/56 ,  H03H9/587

Abstract: Embodiments of the invention include a piezoelectric package integrated filtering device that includes a film stack. In one example, the film stack includes a first electrode, a piezoelectric material in contact with the first electrode, and a second electrode in contact with the piezoelectric material. The film stack is suspended with respect to a cavity of an organic substrate having organic material and the film stack generates an acoustic wave to be propagated across the film stack in response to an application of an electrical signal between the first and second electrodes.

公开(公告)号：US20240006347A1

公开(公告)日：2024-01-04

申请号：US17853572

申请日：2022-06-29

Applicant: Intel Corporation

Inventor： Qiang YU ,  Georgios C. DOGIAMIS ,  Gwang-Soo KIM ,  Ibukunoluwa MOMSON ,  Ali FARID ,  Said RAMI

IPC: H01L23/58 ,  H01L23/00 ,  H01L23/522

CPC classification number: H01L23/585 ,  H01L24/16 ,  H01L23/5226 ,  H01L2224/16145

Abstract: Embodiments herein relate to systems, apparatuses, or processes directed to fabricating passive circuits on a surface of a BEOL of a package, for example on a C4 connection layer of the BEOL. In embodiments, the passive circuits may be fabricated using a standard bump process. Other embodiments may be described and/or claimed.

公开(公告)号：US20230246338A1

公开(公告)日：2023-08-03

申请号：US18133361

申请日：2023-04-11

Applicant: Intel Corporation

Inventor： Feras EID ,  Sasha N. OSTER ,  Telesphor KAMGAING ,  Georgios C. DOGIAMIS ,  Aleksandar ALEKSOV

IPC: H01Q9/04 ,  H01L21/56 ,  H01L23/31 ,  H01L23/495 ,  H01L23/552 ,  H01L23/66 ,  H01Q1/22 ,  H01Q1/24 ,  H01Q1/52 ,  H01Q19/22

CPC classification number: H01Q9/0414 ,  H01L21/565 ,  H01L23/3107 ,  H01L23/49541 ,  H01L23/552 ,  H01L23/66 ,  H01Q1/2283 ,  H01Q1/241 ,  H01Q1/526 ,  H01Q19/22 ,  H01L23/3675

Abstract: Embodiments of the invention include a microelectronic device that includes a first substrate having radio frequency (RF) components and a second substrate that is coupled to the first substrate. The second substrate includes a first conductive layer of an antenna unit for transmitting and receiving communications at a frequency of approximately 4 GHz or higher. A mold material is disposed on the first and second substrates. The mold material includes a first region that is positioned between the first conductive layer and a second conductive layer of the antenna unit with the mold material being a dielectric material to capacitively couple the first and second conductive layers of the antenna unit.

公开(公告)号：US20230208010A1

公开(公告)日：2023-06-29

申请号：US17561733

申请日：2021-12-24

Applicant: Intel Corporation

Inventor： Georgios C. DOGIAMIS ,  Aleksandar ALEKSOV ,  Veronica STRONG ,  Telesphor KAMGAING ,  Neelam PRABHU GAUNKAR ,  Brandon RAWLINGS

IPC: H01Q1/22 ,  H01Q13/10 ,  H01L23/498

CPC classification number: H01Q1/2283 ,  H01Q13/10 ,  H01L23/49822 ,  H05K1/181

Abstract: Embodiments disclosed herein include electronic packages. In an embodiment, an electronic package comprises a core, where the core comprises glass. In an embodiment, an electromagnetic wave launcher is embedded in the core. In an embodiment, the electromagnetic wave launcher comprises a fin, where the fin is a conductive material, and where the fin comprises a stepped profile.