公开(公告)号：US07341888B2

公开(公告)日：2008-03-11

申请号：US11435986

申请日：2006-05-18

申请人： Kuang-woo Nam ,  Yun-kwon Park ,  In-sang Song ,  Jea-shik Shin ,  Seok-mo Chang ,  Seok-chul Yun

发明人： Kuang-woo Nam ,  Yun-kwon Park ,  In-sang Song ,  Jea-shik Shin ,  Seok-mo Chang ,  Seok-chul Yun

IPC分类号： H01L23/02

CPC分类号： H03H9/0547

摘要： A balance filter packaging chip having a balun mounted therein and a manufacturing method thereof are provided. The balance filter packaging chip includes a device substrate; a balance filter mounted on the device substrate; a bonding layer stacked on a certain area of the device substrate; a packaging substrate having a cavity formed over the balance filter, and combined with the device substrate by the bonding layer; a balun located on a certain area over the packaging substrate; and an insulator layer for passivating the balun. Accordingly, the present invention can reduce an element size and simplify a manufacturing process.

摘要翻译： 提供一种其中安装有平衡 - 不平衡转换器的平衡滤波器封装芯片及其制造方法。 平衡滤波器封装芯片包括器件基板; 安装在装置基板上的平衡过滤器; 层叠在所述器件基板的特定区域上的接合层; 封装基板，其具有形成在所述平衡滤波器上方的空腔，并且通过所述接合层与所述器件基板结合; 位于包装衬底上的某个区域上的平衡 - 不平衡转换器; 以及用于钝化平衡 - 不平衡变换器的绝缘体层。 因此，本发明可以减小元件尺寸并简化制造工艺。

公开(公告)号：US20070224719A1

公开(公告)日：2007-09-27

申请号：US11802231

申请日：2007-05-21

申请人： Jong-seok Kim ,  Yun-kwon Park ,  In-sang Song ,  Duck-hwan Kim ,  Kuang-woo Nam ,  Seok-chul Yun

发明人： Jong-seok Kim ,  Yun-kwon Park ,  In-sang Song ,  Duck-hwan Kim ,  Kuang-woo Nam ,  Seok-chul Yun

IPC分类号： H01L21/00

CPC分类号： B81B7/007

摘要： A micro electromechanical system (MEMS) device package and a method of manufacturing the same are provided. The MEMS device package includes: a device substrate with a MEMS active device being formed on the top surface thereof; internal electrode pads, each of which is positioned on the opposite side of the MEMS active device and electrically connected to the MEMS active device; sealing pads positioned outside of the internal electrode pads; a closure substrate joined to the device substrate through the sealing pads, the closure substrate having via holes formed at the areas where the internal electrode pads are positioned; and external electrode pads formed on the top surface of the closure substrate in such a way that the external electrode pads are electrically connected to the internal electrode pads through the via holes. The internal electrode pads and the sealing pads are formed from an identical material such as Au and thus the device substrate and the closure substrate are bonded to each other with direct bonding such as Au—Au direct bonding via the sealing pads.

摘要翻译： 提供了微机电系统（MEMS）装置封装及其制造方法。 MEMS器件封装包括：在其顶表面上形成有MEMS有源器件的器件衬底; 内部电极焊盘，每个内部电极焊盘位于MEMS有源器件的相对侧并电连接到MEMS有源器件; 位于内部电极焊盘外部的密封垫; 通过所述密封垫连接到所述装置基板的封闭基板，所述封闭基板具有形成在所述内部电极焊盘定位的区域处的通孔; 以及形成在封闭基板的​​顶表面上的外部电极焊盘，使得外部电极焊盘通过通孔电连接到内部电极焊盘。 内部电极焊盘和密封焊盘由相同的材料例如Au形成，因此器件基板和封闭基板通过诸如通过密封焊盘的Au-Au直接接合的直接接合彼此接合。

公开(公告)号：US07274147B2

公开(公告)日：2007-09-25

申请号：US11303986

申请日：2005-12-19

申请人： Dong-ha Shim ,  Kuang-woo Nam ,  Yun-kwon Park ,  In-sang Song

发明人： Dong-ha Shim ,  Kuang-woo Nam ,  Yun-kwon Park ,  In-sang Song

IPC分类号： H03B9/10

CPC分类号： H01J25/50

摘要： A magnetron which generates a high-frequency energy in the Terahertz band is provided. The magnetron includes a cathode unit, which is connected to a terminal of a power source, and which selectively emits an electron according to when power is supplied; an anode block, which is connected to another terminal of the power source, and which has an operation chamber in which the emitted electron moves; and one or more resonance cavities which generate a high-frequency energy by a movement of the emitted electron; and a pair of magnet units forming a magnetic field in the operation chamber.

摘要翻译： 提供在太赫兹频带中产生高频能量的磁控管。 磁控管包括阴极单元，其连接到电源的端子，并且根据供电时选择性地发射电子; 阳极块，其连接到电源的另一个端子，并且具有其中发射的电子移动的操作室; 以及通过所发射的电子的运动产生高频能量的一个或多个谐振腔; 以及在操作室中形成磁场的一对磁体单元。

公开(公告)号：US20070182508A1

公开(公告)日：2007-08-09

申请号：US11637768

申请日：2006-12-13

申请人： Yun-kwon Park ,  In-sang Song ,  Seok-chul Yun ,  Kuang-woo Nam

发明人： Yun-kwon Park ,  In-sang Song ,  Seok-chul Yun ,  Kuang-woo Nam

IPC分类号： H03H9/70

CPC分类号： H03H9/706

摘要： A band pass filter for improving filtering, realizing high integration, and reducing manufacturing costs, and a duplexer having the band pass filter. The band pass filter comprises a first resonant circuit in which n first resonators are connected in series, where n is a natural number greater than 1; a second resonator circuit which faces the first resonant circuit and has m second resonators connected in series, where m is a natural number greater than 1; and a third resonant circuit in which k third resonators are connected in parallel on branching lines linking the first and second resonant circuits, where k is a natural number greater than 1. By arranging the resonators of the respective resonant circuits in the bridge structure, the filtering characteristics can be improved, the number of inductors used to adjust the resonant frequency characteristics of the resonators can be reduced, high integration can be realized and manufacture cost can be reduced.

摘要翻译： 用于改进滤波，实现高集成度和降低制造成本的带通滤波器，以及具有带通滤波器的双工器。 带通滤波器包括第一谐振电路，其中n个第一谐振器串联连接，其中n是大于1的自然数; 面向第一谐振电路并具有串联连接的m个第二谐振器的第二谐振器电路，其中m是大于1的自然数; 以及第三谐振电路，其中k个第三谐振器并联在连接第一和第二谐振电路的分支线上，其中k是大于1的自然数。通过将各个谐振电路的谐振器布置在桥结构中， 可以提高滤波特性，可以减少用于调节谐振器的谐振频率特性的电感器的数量，可以实现高集成度并且可以降低制造成本。

公开(公告)号：US20070157442A1

公开(公告)日：2007-07-12

申请号：US11687734

申请日：2007-03-19

申请人： Byeoung-ju HA ,  Yun-kwon Park ,  In-sang Song ,  Il-jong Song ,  Jong-seok Kim ,  Duck-hwan Kim ,  Jun-sik Hwang

发明人： Byeoung-ju HA ,  Yun-kwon Park ,  In-sang Song ,  Il-jong Song ,  Jong-seok Kim ,  Duck-hwan Kim ,  Jun-sik Hwang

IPC分类号： H04R17/00 ,  B05D5/12

CPC分类号： H03H9/173 ,  H03H3/02 ,  H03H9/02133 ,  H03H2003/021 ,  Y10T29/42 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49135 ,  Y10T29/49155

摘要： A film bulk acoustic resonator, and a method for manufacturing the same. The film bulk acoustic resonator includes a substrate, a protection layer vapor-deposited on the substrate, a membrane vapor-deposited on the protection layer and at a predetermined distance from an upper side of the substrate, and a laminated resonance part vapor-deposited on the membrane. Further, the manufacturing method includes vapor-depositing a membrane on a substrate, forming protection layers on both sides of the membrane, vapor-depositing a laminated resonance part on the membrane, and forming an air gap by removing a part of the substrate disposed between the protection layers. Accordingly, the membrane can be formed in a simple structure and without stress, and the whole manufacturing process is simplified.

摘要翻译： 一种薄膜体声波谐振器及其制造方法。 薄膜体声波谐振器包括基板，气相沉积在基板上的保护层，气相沉积在保护层上并距离基板的上侧预定距离的膜，以及气相沉积在 膜。 此外，制造方法包括在基板上气相沉积膜，在膜的两侧形成保护层，在膜上气相沉积层叠的共振部分，并且通过去除设置在膜之间的基板的一部分来形成气隙 保护层。 因此，膜可以以简单的结构形成并且没有应力，并且整个制造过程被简化。

公开(公告)号：US20060244552A1

公开(公告)日：2006-11-02

申请号：US11269844

申请日：2005-11-09

申请人： Yun-kwon Park ,  Duck-hwan Kim ,  Kuang-woo Nam ,  In-sang Song ,  Seok-chul Yun ,  Byeoung-ju Ha ,  Jong-seok Kim

发明人： Yun-kwon Park ,  Duck-hwan Kim ,  Kuang-woo Nam ,  In-sang Song ,  Seok-chul Yun ,  Byeoung-ju Ha ,  Jong-seok Kim

IPC分类号： H03H9/58

CPC分类号： H03H9/0542 ,  H03H9/542 ,  H03H9/564 ,  H03H9/566

摘要： A filter formed of film bulk acoustic resonators has a topology that enables a trimming inductor to be fabricated on the same substrate as the resonator arrays. The entire filter can be fabricated on a single chip, utilizing only integrated circuit processes. In an exemplary embodiment, a pair of shunt resonators each have one electrode connected to series-connected resonators. The other electrodes of the two shunt resonators are connected in common to one another. The trimming inductor is connected between the common electrode and ground potential. A third shunt resonator is connected between the series-connected resonators and ground potential.

公开(公告)号：US20060214745A1

公开(公告)日：2006-09-28

申请号：US11429256

申请日：2006-05-08

申请人： Yun-kwon Park ,  In-sang Song ,  Byeoung-ju Ha ,  Il-jong Song ,  Duck-hwan Kim

发明人： Yun-kwon Park ,  In-sang Song ,  Byeoung-ju Ha ,  Il-jong Song ,  Duck-hwan Kim

IPC分类号： H03H9/70 ,  H03H9/58

CPC分类号： H03H9/173 ,  H03H3/02 ,  H03H9/02133 ,  H03H9/0571 ,  H03H9/587 ,  H03H9/706 ,  Y10T29/42

摘要： An air-gap type film bulk acoustic resonator (FBAR) is created by securing two substrate parts, one providing a resonance structure and the other providing a separation structure, i.e., a cavity. When the two substrate parts are secured, the resonance structure is over the cavity, forming an air gap isolating the resonant structure from the support substrate. The FBAR may be used to form a duplexer, which includes a plurality of resonance structures, a corresponding plurality of cavities, and an isolation part formed between the cavities. The separate creation of the resonance structures and the cavities both simplifies processing and allows additional elements to be readily integrated in the cavities.

摘要翻译： 通过固定两个基板部分，一个提供谐振结构，另一个提供分离结构，即空腔，形成气隙型膜体声波谐振器（FBAR）。 当固定两个基板部分时，谐振结构在空腔之上，形成将谐振结构与支撑基板隔离的气隙。 FBAR可以用于形成双工器，其包括多个谐振结构，相应的多个空腔和形成在腔之间的隔离部分。 谐振结构和空腔的独立创建既简化了处理，并允许额外的元件容易地集成在空腔中。

公开(公告)号：US20060199297A1

公开(公告)日：2006-09-07

申请号：US11368626

申请日：2006-03-07

申请人： Jong-seok Kim ,  Duck-hwan Kim ,  Kuang-woo Nam ,  Yun-kwon Park ,  Seok-chul Yun ,  Sung-hoon Choa ,  In-sang Song

发明人： Jong-seok Kim ,  Duck-hwan Kim ,  Kuang-woo Nam ,  Yun-kwon Park ,  Seok-chul Yun ,  Sung-hoon Choa ,  In-sang Song

IPC分类号： H01L21/00

CPC分类号： B81B7/0051 ,  B81B7/007

摘要： A MEMS device package and a method of manufacturing the same. The MEMS device package includes a device substrate having a surface on which a MEMS active device is formed, and multiple sealing pads arranged around the MEMS active device so that the sealing pads provide electric paths for the MEMS active device. In addition, the MEMS device package may include a cap substrate bonded to the device substrate through the multiple sealing pads, the cap substrate including a trench, within which the MEMS active device is positioned, and via holes. One or more outer electrode pads may be formed on one surface of the cap substrate to be electrically connected with the multiple sealing pads through the via holes. Because there are several bonding and sealing areas between the device substrate and the cap substrate, the sealing intensity is strengthened.

摘要翻译： 一种MEMS器件封装及其制造方法。 MEMS器件封装包括具有其上形成有MEMS器件的表面的器件衬底以及围绕MEMS有源器件布置的多个密封焊盘，使得密封垫为MEMS有源器件提供电路径。 此外，MEMS器件封装可以包括通过多个密封焊盘结合到器件衬底的帽衬底，帽衬底包括其中定位MEMS有源器件的沟槽和通孔。 可以在盖基板的一个表面上形成一个或多个外电极焊盘，以通过通孔与多个密封垫电连接。 由于在器件基板和盖基板之间存在多个接合和密封区域，所以密封强度得以加强。

公开(公告)号：US07095298B2

公开(公告)日：2006-08-22

申请号：US10854793

申请日：2004-05-27

申请人： Il-jong Song ,  Duck-hwan Kim ,  In-sang Song ,  Yun-kwon Park ,  Byeoung-ju Ha

发明人： Il-jong Song ,  Duck-hwan Kim ,  In-sang Song ,  Yun-kwon Park ,  Byeoung-ju Ha

IPC分类号： H03H9/54 ,  H03H3/02

CPC分类号： H03H9/172 ,  H03H3/02 ,  H03H9/0514 ,  H03H9/0547 ,  Y10T29/42

摘要： A film bulk acoustic resonator (FBAR) has a support structure, a piezoelectric resonator, and a signal line that is electrically connected, e.g., through a via, to the piezoelectric resonator, all on a semiconductor substrate. Support(s) and/or the via mount the piezoelectric resonator at a predetermined distance from the semiconductor substrate, allowing an ideal shape of the resonator to be realized. The signal line may include a patterned inductor. A capacitor can be formed between the via and the signal line. The resonance characteristics can be enhanced since the substrate loss caused by the driving of the resonator can be prevented due to an air gap formed by the predetermined distance. The resonance frequency can be adjusted by altering the pattern of the inductor, the capacitance of the capacitor and/or the thickness of the piezoelectric layer, also allowing Impedance matching to be readily realized.

摘要翻译： 薄膜体声波谐振器（FBAR）具有支撑结构，压电谐振器和信号线，其全部在半导体衬底上，例如通过通孔电连接到压电谐振器。 支撑件和/或通孔将压电谐振器安装在离半导体衬底预定距离处，从而实现谐振器的理想形状。 信号线可以包括图案化电感器。 可以在通孔和信号线之间形成电容器。 由于由于由预定距离形成的气隙可以防止由共振器的驱动引起的衬底损耗，所以可以提高谐振特性。 可以通过改变电感器的图案，电容器的电容和/或压电层的厚度来调节谐振频率，并且可以容易地实现阻抗匹配。

公开(公告)号：US20060141652A1

公开(公告)日：2006-06-29

申请号：US11260090

申请日：2005-10-28

申请人： Jong-seok Kim ,  Yun-kwon Park ,  In-sang Song ,  Duck-hwan Kim ,  Kuang-woo Nam ,  Seok-chul Yun

发明人： Jong-seok Kim ,  Yun-kwon Park ,  In-sang Song ,  Duck-hwan Kim ,  Kuang-woo Nam ,  Seok-chul Yun

IPC分类号： H01L21/00

CPC分类号： B81B7/007

摘要： A micro electromechanical system (MEMS) device package and a method of manufacturing the same are provided. The MEMS device package includes: a device substrate with a MEMS active device being formed on the top surface thereof; internal electrode pads, each of which is positioned on the opposite side of the MEMS active device and electrically connected to the MEMS active device; sealing pads positioned outside of the internal electrode pads; a closure substrate joined to the device substrate through the sealing pads, the closure substrate having via holes formed at the areas where the internal electrode pads are positioned; and external electrode pads formed on the top surface of the closure substrate in such a way that the external electrode pads are electrically connected to the internal electrode pads through the via holes. The internal electrode pads and the sealing pads are formed from an identical material such as Au and thus the device substrate and the closure substrate are bonded to each other with direct bonding such as Au—Au direct bonding via the sealing pads.

摘要翻译： 提供了微机电系统（MEMS）装置封装及其制造方法。 MEMS器件封装包括：在其顶表面上形成有MEMS有源器件的器件衬底; 内部电极焊盘，每个内部电极焊盘位于MEMS有源器件的相对侧并电连接到MEMS有源器件; 位于内部电极焊盘外部的密封垫; 通过所述密封垫连接到所述装置基板的封闭基板，所述封闭基板具有形成在所述内部电极焊盘定位的区域处的通孔; 以及形成在封闭基板的​​顶表面上的外部电极焊盘，使得外部电极焊盘通过通孔电连接到内部电极焊盘。 内部电极焊盘和密封焊盘由相同的材料例如Au形成，因此器件基板和封闭基板通过诸如通过密封焊盘的Au-Au直接接合的直接接合彼此接合。