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公开(公告)号:US12055777B2
公开(公告)日:2024-08-06
申请号:US17723174
申请日:2022-04-18
Applicant: Intel Corporation
Inventor: Peng Li , Joel Martinez , Jon Long
IPC: G02B6/43 , H01L23/00 , H01L23/498 , H01L23/538 , H01L25/065 , H04B10/40
CPC classification number: G02B6/43 , H01L23/49816 , H01L23/49827 , H01L23/49833 , H01L23/5385 , H01L24/14 , H01L24/48 , H01L24/81 , H01L25/0655 , H04B10/40 , H01L24/13 , H01L24/16 , H01L2224/13101 , H01L2224/1403 , H01L2224/16225 , H01L2924/10253 , H01L2924/15311 , H01L2924/3511 , H01L2924/3511 , H01L2924/00 , H01L2224/13101 , H01L2924/014 , H01L2924/00014 , H01L2924/10253 , H01L2924/00012
Abstract: A multichip package may include at least a package substrate, a main die mounted on the package substrate, a transceiver die mounted on the package substrate, and an optical engine die mounted on the package substrate. The main die may communicate with the transceiver die via a first high-bandwidth interconnect bridge embedded in the package substrate. The transceiver die may communicate with the optical engine die via a second high-bandwidth interconnect bridge embedded in the package substrate. The transceiver die has physical-layer circuits that directly drive the optical engine. An optical cable can be connected directly to the optical engine of the multichip package.
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公开(公告)号:US12003352B2
公开(公告)日:2024-06-04
申请号:US17029445
申请日:2020-09-23
Applicant: Intel Corporation
Inventor: Peng Li , Masashi Shimanouchi , Hsinho Wu
CPC classification number: H04L25/03031 , H03M1/1215 , H04B10/541 , H04B10/6971 , H04L25/03267 , H04L27/01 , H04L2025/0349
Abstract: A method facilitates determining transmission loss in a transmission signal and adjusting a receiver setting of a receiver to compensate for the transmission loss. The method includes transmitting a transmission signal from a transmitter and receiving the transmission signal by a first receiver and a second receiver. The method includes digitizing the transmission signal by the first receiver at a first sampling frequency and digitizing the transmission signal by the second receiver at a second sampling frequency that is less than or equal to the first sampling frequency. The method includes generating a PAM-n eye diagram of the transmission signal by the second receiver using digitized signals digitized by the first and second receivers and adjusting an equalizer setting of a first equalizer of the first receiver using eye-opening information of the PAM-n eye diagram where the eye-opening information includes information for the transmission loss.
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公开(公告)号:US11791237B2
公开(公告)日:2023-10-17
申请号:US16019899
申请日:2018-06-27
Applicant: Intel Corporation
Inventor: Peng Li , Sergio Antonio Chan Arguedas , Yongmei Liu , Deepak Goyal , Ken Hackenberg
IPC: H01L23/42 , H01L23/367 , H01L23/373 , H01L23/00
CPC classification number: H01L23/42 , H01L23/367 , H01L23/373 , H01L23/3736 , H01L24/29
Abstract: Microelectronic assemblies, and related devices and methods, are disclosed herein. For example, in some embodiments, a microelectronic assembly may include a package substrate having a first surface and an opposing second surface; a die having a first surface and an opposing second surface, wherein the first surface of the die is coupled to the second surface of the package substrate; a cooling apparatus thermally coupled to the second surface of the die; and a thermal interface material (TIM) between the second surface of the die and the cooling apparatus, wherein the TIM includes an indium alloy having a liquidus temperature equal to or greater than about 245 degrees Celsius.
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公开(公告)号:US20210326254A1
公开(公告)日:2021-10-21
申请号:US17220842
申请日:2021-04-01
Applicant: Intel Corporation
Inventor: Peng Li , Jawad B. Khan , Sanjeev N. Trika
IPC: G06F12/06 , G11C7/10 , G05B19/045
Abstract: An embodiment of a semiconductor package apparatus may include technology to provide a first interface between a first storage device and a host device, and provide a second interface directly between the first storage device and a second storage device. Other embodiments are disclosed and claimed.
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公开(公告)号:US10929251B2
公开(公告)日:2021-02-23
申请号:US16370644
申请日:2019-03-29
Applicant: Intel Corporation
Inventor: Peng Li , David J. Pelster , Gamil Cain , Ryan J. Norton
Abstract: A solid state drive (SSD) includes a nonvolatile memory array and a cache memory. The nonvolatile memory array has an encrypted integrated memory buffer (IMB) space. The cache memory has a decrypted copy of the IMB and an encrypted backup copy of the IMB. In power loss recovery (PLR) after a power loss imminent (PLI) event, the SSD can determine whether to recover the unencrypted copy of the IMB or the backup encrypted copy. The backup encrypted copy can reduce the risk of loss of data in the IMB in the event that multiple PLI events occur and a corrupted copy of the IMB is used to overwrite the IMB in the nonvolatile memory during a previous PLR.
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公开(公告)号:US10831734B2
公开(公告)日:2020-11-10
申请号:US15973428
申请日:2018-05-07
Applicant: Intel Corporation
Inventor: Peng Li , Sanjeev N. Trika
Abstract: An update-insert (“upsert”) interface manages updates to key-value storage at a memory or storage device. An upsert token is used to store a key and data for a transform to update a previous value stored for a key-value pair. The upsert token processing includes an upsert command to generate the upsert token for an existing key-value pair and store the upsert token in one or more first non-volatile memory (NVM) devices maintained at a memory or storage device. A hash-to-physical (H2P) table or index stored in one or more second NVM devices of the memory or storage device is utilized to locate and read the data for the key and the data for the transform and coalesce the transform(s) into a current value for the key-value pair, thereby avoiding unnecessary read and write amplification when updating key-value storage.
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公开(公告)号:US20190235779A1
公开(公告)日:2019-08-01
申请号:US16378606
申请日:2019-04-09
Applicant: Intel Corporation
Inventor: Peng Li
CPC classification number: G06F3/0643 , G06F3/0604 , G06F3/064 , G06F3/0658 , G06F3/0673 , G06F16/14
Abstract: Examples relate to a controller apparatus or controller device for a solid-stage storage device, to an apparatus or device for a host computer, to corresponding methods and computer programs, to a solid-stage storage device and to a host computer comprising a solid-state storage device. Examples provide a controller apparatus for a solid-state storage device. The solid-state storage device comprises non-volatile buffer memory circuitry and storage circuitry. The controller apparatus comprises interface circuitry for communicating with a host computer. The controller apparatus comprises processing circuitry configured to obtain a control instruction related to a file system of a partition from the host computer. The partition is at least partially stored within the storage circuitry of the solid-state storage device. The control instruction indicates a location of file system metadata within the partition. The processing circuitry is configured to store the file system metadata within the non-volatile buffer memory circuitry of the solid-state storage device based on the location of the file system metadata.
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公开(公告)号:US10236975B2
公开(公告)日:2019-03-19
申请号:US15430053
申请日:2017-02-10
Applicant: INTEL CORPORATION
Inventor: Peng Li
IPC: H04B10/077 , H04B10/079 , H04B10/073 , H04B10/071 , H04B10/40
Abstract: The present disclosure provides a programmable integrated circuit die for optical testing. The integrated circuit die includes both photonic and electronic elements. In particular, the integrated circuit die may include a memory block, a programmable logic block (for example, a field programmable gate array), an electrical transceiver block, an optical transceiver block, and an optical test interface unit. The programmable logic block may be programmed to have logic functionalities of an embedded microcontroller and of various encoders/decoders. The logic functions may be soft, hard, or mixed. The memory may be used to store test patterns, look-up tables, measured waveforms, error time profiles and statistics. The electrical and optical transceivers may implement PAMn, NRZ, or QAMn modulations and may have programmable parameters, including: voltage levels; optical power; slew rate; magnitude/phase; clock generation and recovery; equalizations; sampling levels; and sampling times. Other embodiments and features are also disclosed.
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公开(公告)号:US20190042098A1
公开(公告)日:2019-02-07
申请号:US16003219
申请日:2018-06-08
Applicant: Intel Corporation
Inventor: Peng Li , Sanjeev Trika
IPC: G06F3/06
Abstract: An embodiment of a semiconductor apparatus may include technology to define a region for a backed-up portion of a volatile memory, and designate the region as a part of a nonvolatile memory. Other embodiments are disclosed and claimed.
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公开(公告)号:US20190034427A1
公开(公告)日:2019-01-31
申请号:US15856686
申请日:2017-12-28
Applicant: Intel Corporation
Inventor: Sanjeev N. Trika , Dongchul Park , Peng Li , Francis R. Corrado , Robert A. Dickinson
IPC: G06F17/30
Abstract: Disclosed is a data management system configured to provide a key-value data structure architecture for use with a storage device. The key-value data structure includes a logic tree having a tree-based index and a hash table having a hash-based index. For a ‘scan’ (or range query) operation, the data management system scans the tree-based index to determine which keys exist between two search keys in the tree-based index. For a ‘get’ (e.g., a value request) operation, the data management system applies a hash function to a provided key to determine an index in the hash table by which to retrieve a value that corresponds with the provided key. Other operations (e.g., ‘put’, ‘update’, ‘delete’) may include updating both the tree-based index and the hash-based index. The logic tree stores keys and stores a zero byte-sized value with each of the keys, to limit the size of the logic tree.
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