Semiconductor device and manufacturing method thereof
    66.
    发明授权
    Semiconductor device and manufacturing method thereof 有权
    半导体装置及其制造方法

    公开(公告)号:US09136390B2

    公开(公告)日:2015-09-15

    申请号:US13104546

    申请日:2011-05-10

    摘要: A semiconductor device which includes a thin film transistor having an oxide semiconductor layer and excellent electrical characteristics is provided. Further, a method for manufacturing a semiconductor device in which plural kinds of thin film transistors of different structures are formed over one substrate to form plural kinds of circuits and in which the number of steps is not greatly increased is provided. After a metal thin film is formed over an insulating surface, an oxide semiconductor layer is formed thereover. Then, oxidation treatment such as heat treatment is performed to oxidize the metal thin film partly or entirely. Further, structures of thin film transistors are different between a circuit in which emphasis is placed on the speed of operation, such as a logic circuit, and a matrix circuit.

    摘要翻译: 提供一种包括具有氧化物半导体层和优异的电特性的薄膜晶体管的半导体器件。 此外,提供了一种用于制造半导体器件的方法,其中在一个衬底上形成了多种不同结构的薄膜晶体管,以形成多种电路,并且其中步骤数目没有大大增加。 在绝缘表面上形成金属薄膜之后,在其上形成氧化物半导体层。 然后,进行氧化处理如热处理以部分或全部氧化金属薄膜。 此外,在诸如逻辑电路和矩阵电路之类的重点放在诸如操作速度的电路之间,薄膜晶体管的结构是不同的。

    Semiconductor device and manufacturing method thereof
    67.
    发明授权
    Semiconductor device and manufacturing method thereof 有权
    半导体装置及其制造方法

    公开(公告)号:US09006729B2

    公开(公告)日:2015-04-14

    申请号:US12943558

    申请日:2010-11-10

    CPC分类号: H01L29/7869 H01L29/45

    摘要: It is an object to provide a method for manufacturing a highly reliable semiconductor device having a thin film transistor formed using an oxide semiconductor and having stable electric characteristics. The semiconductor device includes an oxide semiconductor film overlapping with a gate electrode with a gate insulating film interposed therebetween; and a source electrode and a drain electrode which are in contact with the oxide semiconductor film. The source electrode and the drain electrode include a mixture, metal compound, or alloy containing one or more of a metal with a low electronegativity such as titanium, magnesium, yttrium, aluminum, tungsten, and molybdenum. The concentration of hydrogen in the source electrode and the drain electrode is 1.2 times, preferably 5 times or more as high as that of hydrogen in the oxide semiconductor film.

    摘要翻译: 本发明的目的是提供一种用于制造具有使用氧化物半导体形成并且具有稳定的电特性的薄膜晶体管的高度可靠的半导体器件的方法。 半导体器件包括与栅电极重叠的氧化物半导体膜,其间插入有栅极绝缘膜; 以及与氧化物半导体膜接触的源电极和漏电极。 源电极和漏极包括含有一种或多种具有低电负性的金属如钛,镁,钇,铝,钨和钼的混合物,金属化合物或合金。 源电极和漏电极中的氢浓度是氧化物半导体膜中的氢的浓度的1.2倍,优选为5倍以上。

    Method for manufacturing semiconductor device including oxide semiconductor film
    69.
    发明授权
    Method for manufacturing semiconductor device including oxide semiconductor film 有权
    包括氧化物半导体膜的半导体器件的制造方法

    公开(公告)号:US08900916B2

    公开(公告)日:2014-12-02

    申请号:US12832329

    申请日:2010-07-08

    IPC分类号: H01L21/00

    摘要: A highly reliable semiconductor device which includes a thin film transistor having stable electric characteristics, and a manufacturing method thereof. In the manufacturing method of the semiconductor device which includes a thin film transistor where a semiconductor layer including a channel formation region is an oxide semiconductor layer, heat treatment which reduces impurities such as moisture to improve the purity of the oxide semiconductor layer and oxidize the oxide semiconductor layer (heat treatment for dehydration or dehydrogenation) is performed. Not only impurities such as moisture in the oxide semiconductor layer but also those existing in a gate insulating layer are reduced, and impurities such as moisture existing in interfaces between the oxide semiconductor layer and films provided over and under and in contact with the oxide semiconductor layer are reduced.

    摘要翻译: 一种高度可靠的半导体器件及其制造方法,其包括具有稳定电特性的薄膜晶体管。 在包括具有沟道形成区域的半导体层是氧化物半导体层的薄膜晶体管的半导体器件的制造方法中,减少诸如水分的杂质的热处理以提高氧化物半导体层的纯度并氧化氧化物 进行半导体层(脱水或脱氢的热处理)。 氧化物半导体层中的水分等杂质,以及存在于栅极绝缘层中的杂质都会降低,氧化物半导体层和氧化物半导体层之间的界面中存在的水分等杂质与氧化物半导体层 减少了

    Semiconductor device
    70.
    发明授权
    Semiconductor device 有权
    半导体器件

    公开(公告)号:US08841662B2

    公开(公告)日:2014-09-23

    申请号:US12917548

    申请日:2010-11-02

    IPC分类号: H01L29/786 H01L27/12

    摘要: An object is, in a thin film transistor including an oxide semiconductor layer, to reduce contact resistance between the oxide semiconductor layer and source and drain electrode layers electrically connected to the oxide semiconductor layer. The source and drain electrode layers have a stacked-layer structure of two or more layers in which a layer in contact with the oxide semiconductor layer is formed using a metal whose work function is lower than the work function of the oxide semiconductor layer or an alloy containing such a metal. Layers other than the layer in contact with the oxide semiconductor layer of the source and drain electrode layers are formed using an element selected from Al, Cr, Cu, Ta, Ti, Mo, or W, an alloy containing any of these elements as a component, an alloy containing any of these elements in combination, or the like.

    摘要翻译: 在包括氧化物半导体层的薄膜晶体管中,目的是减少氧化物半导体层与与氧化物半导体层电连接的源电极层和漏电极层之间的接触电阻。 源极和漏极电极层具有两层或多层的层叠结构,其中使用功函数低于氧化物半导体层的功函数或合金的金属形成与氧化物半导体层接触的层 含有这样的金属。 使用选自Al,Cr,Cu,Ta,Ti,Mo或W的元素形成与源极和漏极电极层的氧化物半导体层接触的层以外的层,包含任何这些元素作为 组分,包含任何这些元素组合的合金等。